HSMM-A400-V8QM2

HSMx-A4xx-xxxxx SMT LED Surface Mount LED Indicator Data Sheet Description Features Avago Power PLCC-4 is an extension of our PLCC‑2 SMT LEDs. The package can be driven at higher current due to its superior package design. The product is able to dissipate heat more efficiently compared to the conventional PLCC-2 SMT LEDs. In proportion to the increase in driving current, this family of LEDs is able to produce higher light output compared to the conventional PLCC-2 SMT LEDs. • Industry standard PLCC-4 • High reliability LED package • High brightness using AlInGaP and InGaN dice technologies • High optical efficiency • Higher ambient temperature at the same current possible compared to PLCC-2 • Available in full selection of colors • Super wide viewing angle at 120˚ • Available in 8mm carrier tape on 7-inch reel • Compatible with both IR and TTW soldering process • JEDEC MSL 2a • High reliability LED package due to enhanced silicone resin material for InGaN family These SMT LEDs have higher reliability and better performance and are designed to work under a wide range of environmental conditions. This higher reliability makes them suitable for use under harsh environment and conditions like automotive. In addition, they are also suitable to be used in electronic signs and signals. To facilitate easy pick and place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel will be shipped in single intensity and color bin (except for red color), to provide close uniformity. These LEDs are compatible with IR solder reflow process. Due to the high reliability feature of these products, they also can be mounted using through-the-wave soldering process. There are a variety of colors and various viewing angles (30°, 60° and 120°) available in these SMT LEDs. Ideally, the 30° parts are suitable for light piping where focused intensities are required. As for the 60° and 120°, they are most suitable for automotive interior and exterior lighting and electronic signs applications. Applications • Interior automotive – Instrument panel backlighting – Central console backlighting – Cabin backlighting – Navigation and audio system – Dome lighting – Push button backlighting • Exterior automotive – Turn signals – CHMSL – Rear combination lamp – Puddle light • Electronic signs and signals – Interior full color sign – Variable message sign • Office automation, home appliances, industrial equipment – Front panel backlighting – Push button backlighting – Display backlighting CAUTION: HSMN-, HSMK-, HSMM-A40x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details. Package Dimensions 2.8 ± 0.2 1.9 ± 0.2 2.2 ± 0.2 0.1 TYP. A 0.8 ± 0.1 C 3.2 0.2 3.5 0.2 0.8 0.3 C C 0.5 ± 0.1 0.7 0.1 CATHODE MARKING NOTES: ALL DIMENSIONS IN mm. ELECTRICAL CONNECTION BETWEEN ALL CATHODES IS RECOMMENDED. Device Selection Guide Color Part Number Min. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology Red HSMC-A400-S30M1 180.00 355.00 50 AlInGaP HSMC-A401-U80M1 560.00 1400.00 50 AllnGaP HSMJ-A401-T40M1 285.00 715.00 50 AlInGaP Red Orange HSMJ-A401-U40M1 450.00 1125.00 50 AlInGaP Orange HSML-A401-U40M1 450.00 1125.00 50 AlInGaP Amber HSMA-A401-U45M1 450.00 1125.00 50 AlInGaP Emerald Green HSME-A401-P4PM1 45.00 112.50 50 AlInGaP Blue HSMN-A400-S8QM2 224.00 560.00 30 InGaN HSMN-A400-S8PM2 224.00 560.00 30 InGaN HSMN-A400-S4QM2 180.00 450.00 30 InGaN HSMM-A400-U4QM2 450.00 1125.00 30 InGaN HSMM-A400-V8QM2 900.00 2240.00 30 InGaN Green Notes: 1. The luminous intensity IV, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned with this axis. 2. IV tolerance = ±12 %. 2 Part Numbering System HSM x1 – A x2 x3x4 – x5x6 x7 x8x9 Packaging Option Color Bin Selection Intensity Bin Select Device Specific Configuration Package Type LED Chip Color Absolute Maximum Ratings (TA = 25°C) Parameters HSMC/J/L/A/E HSMZ/V/U HSMM/K/N DC Forward Current[1] 70 mA[3,4] 70 mA[3,4] 30 mA Peak Forward Current [2] 200 mA 200 mA 90 mA Power Dissipation 180 mW 240 mW 114 mW Reverse Voltage Junction Temperature 5 V 110°C Operating Temperature –40°C to +100°C Storage Temperature –40°C to +100°C Notes: 1.  Derate linearly as shown in figure 5. 2.  Duty factor = 10%, Frequency = 1 kHz. 3.  Drive current between 10 mA and 70 mA is recommended for best long-term performance. 4.  Operation at currents below 5 mA is not recommended. 3 Optical Characteristics (TA = 25°C) Peak Dominant Luminous Wavelength Wavelength Viewing Angle Efficacy ηv[3] Part λPEAK (nm) λD[1] (nm) 2θ1/2[2] (Degrees) (lm/W) Color Number Typ. Typ. Typ. Typ. Luminous Intensity/ Total Flux Iv (mcd)/Φv (mlm) Typ. Red HSMC 635 626 120 150 0.45 HSMZ 639 630 120 155 0.45 Red Orange HSMJ 621 615 120 240 0.45 HSMV 623 617 120 263 0.45 Orange HSML 609 605 120 320 0.45 Amber HSMA 592 590 120 480 0.45 HSMU 594 592 120 500 0.45 Yellow Green HSME 576 575 120 560 0.45 Emerald Green HSME 568 567 120 610 0.45 Green HSMM 518 525 120 500 0.45 Cyan HSMK 502 505 120 300 0.45 Blue 75 0.45 HSMN 468 470 120 Notes: 1.  The dominant wavelength, λD, is derived from the CIE Chromaticity Diagram and represents the color of the device. 2.  θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 3.  Radiant intensity, Ie in watts/steradian, may be calculated from the equation Ie = Iv/ηv, where Iv is the luminous intensity in candelas and ηv is the luminous efficacy in lumens/watt. Electrical Characteristics (TA = 25°C) Forward Voltage VF (Volts) @ IF = 50 mA Part Number Typ. Max. Reverse Voltage VR @ 100 µA Min. HSMC/J/L/A/E 2.2 2.5 5 HSMZ/V/U 2.8 3.4 5 Forward Voltage VF (Volts) @ IF = 30 mA Part Number Typ. Max. Reverse Voltage VR @ 10 µA Min. HSMM/K/N 5 1.0 0.9 RELATIVE INTENSITY 0.8 0.7 3.8 4.6 BLUE EMERALD GREEN CYAN YELLOW GREEN GREEN AMBER 0.6 0.5 ORANGE 0.4 RED ORANGE 0.3 RED 0.2 0.1 0 380 430 480 530 580 630 WAVELENGTH – nm Figure 1. Relative intensity vs. wavelength 4 HSMx-Axxxx fig 1 680 730 780 70 1.2 60 HSMC/J/L/A/E HSMZ/V/U 50 40 30 20 10 0 1.0 0.8 0.6 0.4 0.2 HSMM/K/N 0 1 2 3 4 1.2 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 30 mA) 1.4 RELATIVE INTENSITY (NORMALIZED AT 50 mA) FORWARD CURRENT – mA 80 0 5 FORWARD VOLTAGE – V 1.0 0.8 0.6 0.4 0.2 0 0 10 20 30 40 50 60 70 80 5 0 FORWARD CURRENT – mA Figure 2. Forward current vs. forward voltage Figure 3. Relative intensity vs. forward current (AlInGaP) 10 15 20 25 30 35 FORWARD CURRENT – mA Figure 4. Relative intensity vs. forward current (InGaN) HSMx-Axxxx fig 3 35 70 60 300C/W 350C/W 50 40 470C/W 30 20 10 0 0 40 20 60 80 100 120 540 30 300C/W 25 350C/W 20 470C/W 15 10 5 0 0 20 40 60 80 Figure 5a. Maximum forward current vs. ambient temperature, derated based on TJmax = 110°C (AlInGaP) 0.9 RELATIVE INTENSITY 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 -50 -30 -10 10 ANGLE – DEGREES Figure 7. Radiation pattern HSMx-Axxxx fig 7 5 120 Figure 5b. Maximum forward current vs. ambient temperature, derated based on TJmax = 110°C (InGaN) 1.0 -70 100 AMBIENT TEMPERATURE – C AMBIENT TEMPERATURE – C 0 -90 DOMINANT WAVELENGTH – nm MAXIMUM FORWARD CURRENT – mA MAXIMUM FORWARD CURRENT – mA 80 30 50 70 90 530 InGaN GREEN 520 510 500 InGaN CYAN 490 480 InGaN BLUE 470 460 0 5 10 15 20 25 30 CURRENT – mA Figure 6. Dominant wavelength vs. forward current – InGaN devices HSMx-Axxxx fig 6 35 X 2.60 (0.103) X 0.40 (0.016) 1.10 (0.043) 0.50 (0.020) Y 4.50 (0.178) 1.50 (0.059) Y DIMENSIONS IN mm (INCHES). SOLDER RESIST REPRESENTS ELECTRICAL CONNECTIVITY BETWEEN PADS Figure 8a. Recommended soldering pad pattern X 0.5 (0.020) 6.1 (0.240) 2.8 (0.110) Y 2.0 (0.079) 6.0 (0.236) 3.0 (0.118) Thermal Resistance 300°C/W 350°C/W 470°C/W Y REPRESENTS ELECTRICAL CONNECTIVITY BETWEEN PADS Solder Pad Area (xy) >16 mm2 >12 mm2 >8 mm2 Figure 8b. Recommended soldering pad pattern (TTW) 6 1.0 (0.039) 2.0 (0.079) DIMENSIONS IN mm (INCHES). X 10 to 20 SEC. +5 °C 255 °C -0 °C 217 °C TEMPERATURE 3 °C/SEC. MAX. 125 °C ± 25 °C 6 °C/SEC. MAX. 60 to 150 SEC. MAX. 120 SEC. TIME Figure Recommended profile. = 6 MINUTES MAX. * THE9.TIME FROM 25Pb-free °C TO reflow PEAK soldering TEMPERATURE Note: For detailed information on reflow soldering of Avago surface mount LEDs, refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components. LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE 250 BOTTOM SIDE OF PC BOARD TEMPERATURE – C 200 TOP SIDE OF PC BOARD 150 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150C (100C PCB) SOLDER WAVE TEMPERATURE = 245C AIR KNIFE AIR TEMPERATURE = 390C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA FLUXING 100 50 30 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 0 10 20 30 40 50 60 70 TIME – SECONDS Figure 10. Recommended wave soldering profile ID Note : Diameter "ID" should be bigger than 2.3mm Figure 11. Recommended Pick and Place Nozzle Size for InGaN Family 7 80 90 100 TRAILER COMPONENT LEADER 480 mm MIN. FOR Ø180 REEL. 960 mm MIN. FOR Ø330 REEL. 200 mm MIN. FOR Ø180 REEL. 200 mm MIN. FOR Ø330 REEL. C A USER FEED DIRECTION Figure 12. Tape leader and trailer dimensions Ø1.5 +0.1 –0 4 ± 0.1 2 ± 0.05 B 3.6 ± 0.1 1.75 ± 0.1 5.5 ± 0.05 A C C C A A 3.8 ± 0.1 12 Ø1 8 ± 0.1 +0.1 –0 +0.3 –0.1 B 0.229 ± 0.01 3.45 ± 0.1 VIEW B-B VIEW A-A ALL DIMENSIONS IN mm. Figure 13. Tape dimensions USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 14. Reeling orientation 8 Intensity Bin Select (X5X6) Color Bin Select (X7) X5 X7 Individual reel will contain parts from one half bin only. Min. Iv Bin Individual reel will contain parts from one full bin only. 0 Full Distribution X6 Z A and B only 0 Full Distribution Y B and C only 2 2 half bins starting from X51 3 3 half bins starting from X51 W C and D only 4 4 half bins starting from X51 V D and E only 5 5 half bins starting from X51 U E and F only 6 2 half bins starting from X52 T F and G only 7 3 half bins starting from X52 S G and H only 8 4 half bins starting from X52 Q A, B and C only 9 5 half bins starting from X52 P B, C and D only N C, D and E only M D, E and F only L E, F and G only K F, G and H only 1 A, B, C and D only 2 E, F, G and H only Intensity Bin Limits Bin ID Min. (mcd) N1 28.50 35.50 3 B, C, D and E only N2 35.50 45.00 4 C, D, E and F only P1 45.00 56.00 P2 56.00 71.50 5 A, B, C, D and E only Q1 71.50 90.00 6 B, C, D, E and F only Q2 90.00 112.50 R1 112.50 140.00 R2 140.00 180.00 S1 180.00 224.00 S2 224.00 285.00 T1 285.00 355.00 T2 355.00 450.00 U1 450.00 560.00 U2 560.00 715.00 V1 715.00 900.00 V2 900.00 1125.00 W1 1125.00 1400.00 W2 1400.00 1800.00 X1 1800.00 2240.00 X2 2240.00 2850.00 Tolerance of each bin limit = ± 12% 9 Max. (mcd) Color Bin Limits Color Bin Limits Orange Min. (nm) 460.0 465.0 A 597.0 600.0 465.0 470.0 B 600.0 603.0 C 470.0 475.0 C 603.0 606.0 D 475.0 480.0 D 606.0 609.0 E 609.0 612.0 Cyan Min. (nm) A 490.0 495.0 B 495.0 500.0 Red Orange Min. (nm) C 500.0 505.0 A 611.0 616.0 D 505.0 510.0 B 616.0 620.0 Green Min. (nm) Red Min. (nm) A 515.0 520.0 Full Distribution B 520.0 525.0 Tolerance of each bin limit = ± 1 nm C 525.0 530.0 D 530.0 535.0 Blue Min. (nm) A B Max. (nm) Max. (nm) Max. (nm) Max. (nm) Max. (nm) Max. (nm) Packaging Option (X8X9) Emerald Green Min. (nm) A 552.5 555.5 Test Package Reel Option Current Type Size B 555.5 558.5 M1 50 mA Top Mount 7 inch C 558.5 561.5 M2 30 mA Top Mount 7 inch D 561.5 564.5 Yellow Green Min. (nm) E 564.5 567.5 F 567.5 570.5 Forward Voltage Bin Table For HSMZ/V/U – A4xx-xxxxx only G 570.5 573.5 H 573.5 576.5 BIN MIN. MAX. Max. (nm) Max. (nm) VA 1.9 2.2 VB 2.2 2.5 Amber/ Yellow Min. (nm) A 582.0 584.5 VD 2.8 3.1 B 584.5 587.0 VE 3.1 3.4 C 587.0 589.5 Tolerance of each bin limit = ± 0.1 D 589.5 592.0 E 592.0 594.5 F 594.5 597.0 10 Max. (nm) VC 2.5 2.8 Moisture Sensitivity This product is qualified as Moisture Sensitive Level 2a per JEDEC J-STD-020. Precaution when handling this moisture sensitive product is important to ensure the reliability of the product. Refer to Avago Application Note AN 5305 Handling of Moisture Sensitive Surface Mount Devices for details. D. Control of assembled boards A. Storage before use E. Baking is required if: – Unopen moisture barrier bag (MBB) can be stored at