HSMN-C150

HSMM-C110/C120/C150/C170/C190 HSMN-C110/C120/C150/C170/C190/C191 SMT ChipLEDs Data Sheet Description Features These small chip-type LEDs utilize high efficient InGaN/SiC material to deliver competitively priced high performance blue and green. These 525 nm green and 470 nm blue are unique hues which provide color differentiation to a product. These ChipLEDs come in either top emitting packages (HSMx-C170, C190, C191, and C150) or in a side emitting package (HSMx-C110 and HSMX-C120). The side emitting package is especially suitable for LCD backlighting application. The top emitting packages with their wide viewing angle are suitable for direct backlighting application or being used with light pipes. In order to facilitate pick and place operation, these ChipLEDs are shipped in tape and reel with 4000 units per reel for HSMx-C120, C170, C190, and C191 packages, and 3000 units per reel for HSMx-C110 and C150 packages. All packages are compatible with IR soldering and binned by both color and intensity. x High brightness x Small size x Industrial standard footprint x Diffused optics x Top emitting or right angle emitting x Compatible with IR soldering x Compatible for use with light piping x Available in 8 mm tape on 7" diameter reel xReel sealed in zip locked moisture barrier bags Applications x LCD backlighting x Pushbutton backlighting x Front panel indicator x Symbol indicator x Microdisplays x Small message panel signage Device Selection Guide Package Dimension (mm) [1], [2] Ingan Green Ingan Blue Package Description 3.2 (L) x 1.5 (W) x 1.0 (H) HSMM-C110 HSMN-C110 Untinted, Non-diffused 1.6 (L) x 1.0 (W) x 0.6 (H) HSMM-C120 HSMN-C120 Untinted, Nondiffused 3.2 (L) x 1.6 (W) x 1.1 (H) HSMM-C150 HSMN-C150 Untinted, Diffused 2.0 (L) x 1.25 (W) x 0.8 (H) HSMM-C170 HSMN-C170 Untinted, Diffused 1.6 (L) x 0.8 (W) x 0.8 (H) HSMM-C190 HSMN-C190 Untinted, Diffused HSMN-C191 Untinted, Diffused 1.6 (L) x 0.8 (W) x 0.6 (H) Notes: 1. Dimensions in mm. 2. Tolerance ± 0.1 mm unless otherwise noted. CAUTION: HSMM-C1xx and HSMN-C1xx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details. Package Dimensions CATHODE LINE LED DIE C A TH O D E M A R K LED D IE 1.0 (0.039) 0.3 (0.012) 2.6 (0.102 ) 1.6 (0.063) 3.2 (0.126 ) 0.6 (0.024) POLARITY CLEAR EPOXY PO LA R ITY 1.5 (0.059) 1.2 (0.047) C LEA R EPO XY PC BOARD 1.6 (0.063 ) 0.5 (0.020) 1.0 (0.039) PC B O A R D 0.5 (0.020) 3.2 (0.126 ) 0.8 (0.031) CATHODE LINE 3 – 0.3 (0.012) C A TH O D E LIN E 1.0 (0.039) SOLDERING TERMINAL SO LD ER IN G TER M IN A L HSMx-C110 H SM x-C 120 CATHODE MARK CATHODE MARK 1.25 (0.049) 0.8 (0.031) 1.6 (0.063 ) 2.0 (0.079 ) 1.4 (0.055) DIFFUSED EPOXY POLARITY 1.0 (0.039) 0.3 (0.012) 0.3 (0.012) PC BOARD DIFFUSED EPOXY 0.8 (0.031) 0.3 (0.012) PC BOARD 0.8 (0.031) 0.3 (0.012) CATHODE LINE 0.4 ± 0.15 (0.016 ± 0.006) 0.4 ± 0.15 (0.016 ± 0.006) POLARITY CATHODE LINE 0.3 ± 0.15 (0.012 ± 0.006) 0.3 ± 0.15 (0.012 ± 0.006) 0.7 (0.028) MIN. 2 SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C170 HSMx-C190 Package Dimensions, continued CATHODE MARK CATHODE MARK 0.8 (0.031) 1.6 (0.063) 1.6 (0.063 ) 3.2 (0.126 ) 1.0 (0.039) DIFFUSED EPOXY POLARITY 2.0 (0.079) POLARITY 0.3 (0.012) DIFFUSED EPOXY 0.6 (0.024) 1.1 (0.043) PC BOARD PC BOARD 0.6 (0.023) 0.3 (0.012) 0.5 (0.020) CATHODE LINE CATHODE LINE 0.50 ± 0.2 (0.020 ± 0.008) 0.50 ± 0.2 (0.020 ± 0.008) 0.3 ± 0.15 (0.012 ± 0.006) 0.3 ± 0.15 (0.012 ± 0.006) 0.7 (0.028) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C191 HSMx-C150 NOTES: 1. All dimensions in millimeters (inches). 2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified. Absolute Maximum Ratings at TA = 25˚C Parameter HSMM-C110/C120/C170/C190/C150 HSMN-C110/C120/C170/C190/C191/C150 Units DC Forward Current [1] 20 mA Power Dissipation 78 mW Reverse Voltage (IR = 100 μA) 5 V Led Junction Temperature 95 ˚C Operating Temperature Range –40 to +85 ˚C Storage Temperature Range –40 to +85 ˚C Soldering Temperature See reflow soldering profile (Figure 7) Note: 1. Derate linearly as shown in Figure 4. Electrical Characteristics at TA = 25˚C Part Number Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. Reverse Breakdown VR (Volts) @ IR = 100 μA Min. Capacitance C (pF), VF = 0, f = 1 MHz Typ. Thermal Resistance RTJ–PIN (˚C/W) Typ. HSMM-C110/C150 3.3 5 70 450 HSMN-C110/C150 3.3 3.9 5 70 450 HSMM-C120 3.3 3.9 5 45 450 HSMN-C120 3.3 3.9 5 45 450 HSMM-C170/C190 3.3 3.9 5 70 300 3.3 3.9 5 70 300 HSMN-C170/C190/C191 VF Tolerance: ±0.1 V. 3 3.9 Optical Characteristics at TA = 25˚C Part Number Color Luminous Intensity IV (mcd) @ 20 mA[1] Min. Typ. Peak Wavelength Opeak (nm) Typ. Color, Dominant Wavelength Od[2] (nm) Typ. Viewing Angle 2 T1/2 Degrees[3] Typ. Luminous Efficacy KV (lm/w) Typ. HSMM-C110 Green 45 126 523 525 130 490 HSMM-C120 Green 45 120 523 525 155 490 HSMM-C170/C190/ /C150 Green 45 120 523 525 170 490 HSMN-C110 Blue 11.2 39 468 470 130 77 HSMN-C120 Blue 11.2 35 468 470 155 80 HSMN-C170/C190/ Blue 11.2 35 468 470 170 77 C191/C150 Notes: 1. The luminous intensity, IV, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, Od, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. T1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Light Intensity (Iv) Bin Limits[1] Color Bin Limits[1] Intensity (mcd) Blue Color Bins[1] Dom. Wavelength (nm) Bin ID Min. Max. Bin ID Min. Max. Bin ID Min. Max. A 0.11 0.18 N 28.50 45.00 A 460.0 465.0 B 0.18 0.29 P 45.00 71.50 B 465.0 470.0 C 0.29 0.45 Q 71.50 112.50 C 470.0 475.0 D 0.45 0.72 R 112.50 180.00 D 475.0 480.0 E 0.72 1.10 S 180.00 285.00 F 1.10 1.80 T 285.00 450.00 G 1.80 2.80 U 450.00 715.00 H 2.80 4.50 V 715.00 1125.00 J 4.50 7.20 W 1125.00 1800.00 K 7.20 11.20 X 1800.00 2850.00 L 11.20 18.00 Y 2850.00 4500.00 M 18.00 28.50 Tolerance: ± 1 nm InGaN Green Color Bins[1] Dom. Wavelength (nm) Bin ID Min. Max. A 515.0 520.0 B 520.0 525.0 C 525.0 530.0 D 530.0 535.0 Tolerance: ± 1 nm Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. 4 Intensity (mcd) Tolerance: ± 15% Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. 2. The Iv binning specification set-up is for lowest allowable Iv binning only. There is no upper Iv bin limits. 100 BLUE IF FORWARD CURRENT mA RELATIVE INTENSITY % 1.0 GREEN 0.5 0 350 400 500 450 550 600 10 1 0.1 650 2.0 2.5 3.0 WAVELENGTH nm Figure 1. Relative intensity vs. wavelength. 0.8 1.00 0.6 0.90 0.4 0.2 10 5 15 25 20 IF - FORWARD CURRENT - mA Figure 3. Luminous intensity vs. forward current. RELATIVE INTENSITY - % LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.0 0 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 25 1.00 20 0.80 0.90 RELATIVE INTENSITY - % IF MAX. - MAXIMUM FORWARD CURRENT - mA ANGLE 15 RθJ-A = 800°C/W 10 RθJ-A = 600°C/W 5 0 20 40 60 80 100 TA - AMBIENT TEMPERATURE - °C Figure 4. Maximum forward current vs. ambient temperature. 5 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 4.0 Figure 2. Forward current vs. forward voltage. 1.2 0 3.5 VF FORWARD VOLTAGE V 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5. Relative intensity vs. angle for HSMx-C110. 100 RELATIVE INTENSITY 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE 100 RELATIVE INTENSITY 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 6. Relative intensity vs. angle for HSMx-C120 1.00 RELATIVE INTENSITY - % 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 7. Relative intensity vs. angle for HSMx-C170, C190, C191, and C150. 6 TEMPERATURE 10 SEC. MAX. 230°C MAX. 4°C/SEC. MAX. 140-160°C TEMPERATURE 10 SEC. MAX. 217 °C 200 °C 255 - 260 °C 3 °C/SEC. MAX. 6 °C/SEC. MAX. 150 °C 3 °C/SEC. MAX. 3°C/SEC. MAX. 4°C/SEC. MAX. 60 SEC. MAX. 60 - 120 SEC. OVER 2 MIN. TIME TIME Figure 8. Recommended reflow soldering profile. Figure 9. Recommended Pb-free reflow soldering profile. 5.0 (0.200) 0.4 (0.016) 0.4 (0.016) 0.9 (0.035) 0.9 (0.035) 0.7 (0.028) 1.0 (0.039) 0.15 (0.006) CENTERING BOARD 0.2 (0.008) CENTERING BOARD 1.5 (0.059) 2.0 (0.079) 0.8 (0.031) 1.5 (0.059) Figure 10. Recommended soldering pattern for HSMx-C110. 1.2 (0.047) 0.8 (0.031) Figure 11. Recommended soldering pattern for HSMx-C120. 0.8 (0.031) 1.2 (0.047) 1.2 (0.047) 1.2 (0.047) 0.9 (0.035) Figure 12. Recommended soldering pattern for HSMx-C170. NOTE: 1. All dimensions in millimeters (inches). 7 0.8 (0.031) 0.7 (0.028) 0.8 (0.031) Figure 13. Recommended soldering pattern for HSMX-C190/C191 USER FEED DIRECTION 1.5 (0.059) 1.5 (0.059) 2.0 (0.079) CATHODE SIDE 1.5 (0.059) PRINTED LABEL Figure 14. Recommended soldering pattern for HSMx-C150. Figure 15. Reeling orientation. 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) ∅ 13.1 ± 0.5 (∅ 0.516 ± 0.020) ∅ 20.20 MIN. (∅ 0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) NOTE: 1. All dimensions in millimeters (inches). Figure 16. Reel dimensions. 8 6 PS 5.0 ± 0.5 (0.197 ± 0.020) 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) 8.00 ± 0.30 (0.315 ± 0.012) CARRIER TAPE USER FEED DIRECTION COVER TAPE 4.00 (0.157) TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) HSMx-C110/120 POSITION IN CARRIER TAPE DIM. A DIM. B DIM. C ± 0.10 (± 0.004) ± 0.10 (± 0.004) ± 0.10 (± 0.004) PART NUMBER DIM. A (SEE TABLE 1) HSMx-C191 SERIES 1.85 (0.073) 0.88 (0.035) 0.85 (0.033) HSMx-C190 SERIES 1.75 (0.069) 0.90 (0.035) 0.90 (0.035) HSMx-C170 SERIES HSMx-C110 SERIES HSMx-C120 SERIES HSMx-C150 SERIES 2.30 (0.091) 3.40 (0.134) 1.90 (0.075) 3.50 (0.138) 1.45 (0.057) 1.70 (0.067) 1.15 (0.045) 1.88 (0.074) 0.95 (0.037) 1.20 (0.047) 0.75 (0.030) 1.27 (0.050) R 1.0 ± 0.05 (0.039 ± 0.002) FOR HSMx-C110 DIM. B (SEE TABLE 1) R 0.5 ± 0.05 (0.020 ± 0.002) FOR HSMx-C120 Figure 17. Tape dimensions. END Reflow Soldering: START For more information on reflow soldering, refer to Application Note AN-1060, Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 30°C @ 60%RH max. THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. NOTES: 1. All dimensions in millimeters (inches). 2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified. 1. Humidity Indicator Card is > 10% when read at 23 ± 5°C. 2. Device expose to factory conditions