HSMQ-C170

Data Sheet HSMQ-C1xx and HSMR-C1xx High-Performance Chip LED Description These Broadcom® small chip-type LEDs use high-efficient and high-brightness InGaN material to deliver competitively priced high-performance blue and green. These 520-nm green and 470-nm blue are unique hues that provide color differentiation to a product. These chipLEDs come in either top-emitting packages (HSMx-C130, C150, C170, C177, C190, C191, C197), in side-emitting packages (HSMx-C110, C120) or in a reverse-mount package (HSMx-C265). The side-emitting package is especially suitable for LCD backlighting application. The top-emitting packages, with their wide viewing angle, are suitable for direct backlighting application or being used with light pipes. To facilitate pick-and-place operation, these chipLEDs are shipped in tape and reel with 4000 units per reel for HSMx-C120, C130, C170, C177, C190, C191, and C197 packages, and 3000 units per reel for HSMx-C110, C150, and C265 packages. All packages are compatible with IR soldering and binned by both color and intensity. Features          High brightness Small size Industrial standard footprint Diffused optics Top-emitting or right-angle emitting Compatible with IR soldering Compatible for use with light piping Available in 8-mm tape on 7-in. diameter reels Reel sealed in zip-locked moisture barrier bags Applications       LCD backlighting Push button backlighting Front panel indicator Symbol indicator Microdisplays Small message panel signage CAUTION! HSMQ-Cxxx and HSMR-Cxxx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Observe appropriate precautions during handling and processing. Refer to Broadcom Application Note AN-1142 for additional details. Broadcom AV02-0977EN October 28, 2020 HSMQ-C1xx and HSMR-C1xx Data Sheet High-Performance Chip LED Package Dimensions HSMx-C110 HSMx-C170 CATHODE MARK CATHODE LINE LED DIE 1.25 (0.049) 1.0 (0.039) 2.6 (0.102 ) 2.0 (0.079†) 3.2 (0.126 ) POLARITY 1.4 (0.055) DIFFUSED EPOXY CLEAR EPOXY 1.5 (0.059) POLARITY 0.3 (0.012) PC BOARD PC BOARD 0.5 (0.020) 1.6 (0.063 ) 0.4 ± 0.15 (0.016 ± 0.006) 3.2 (0.126 ) 0.8 (0.031) 0.3 (0.012) CATHODE LINE 0.8 (0.031) 0.4 ± 0.15 (0.016 ± 0.006) CATHODE LINE 1.0 (0.039) SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C190 HSMx-C191 CATHODE MARK CATHODE MARK 0.8 (0.031) 0.8 (0.031) 1.6 (0.063†) 1.6 (0.063†) 1.0 (0.039) 1.0 (0.039) POLARITY 0.3 (0.012) 0.3 (0.012) DIFFUSED EPOXY DIFFUSED EPOXY POLARITY PC BOARD PC BOARD 0.3 (0.012) 0.8 (0.031) CATHODE LINE 0.3 ± 0.15 (0.012 ± 0.006) 0.3 ± 0.15 (0.012 ± 0.006) 0.3 (0.012) 0.6 (0.023) CATHODE LINE 0.3 ± 0.15 (0.012 ± 0.006) 0.3 ± 0.15 (0.012 ± 0.006) 0.7 (0.028) MIN. 0.7 (0.028) MIN. SOLDERING TERMINAL SOLDERING TERMINAL NOTE: 1. All dimensions are in millimeters (inches). 2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise noted. Broadcom AV02-0977EN 2 HSMQ-C1xx and HSMR-C1xx Data Sheet High-Performance Chip LED HSMx-C150 HSMx-C177 CATHODE MARK CATHODE MARK 1.25 (0.049) 1.6 (0.063) 2.00 (0.079) 3.2 (0.126†) DIFFUSED EPOXY POLARITY 2.0 (0.079) POLARITY DIFFUSED EPOXY 0.40 (0.016) 0.6 (0.024) 1.1 (0.043) PC BOARD PC BOARD CATHODE LINE 0.16 (0.006) 0.5 (0.020) 0.50 ± 0.20 (0.020 ± 0.008) 0.50 ± 0.20 (0.020 ± 0.008) CATHODE LINE 0.40 ± 0.15 (0.016 ± 0.006) 0.40 ± 0.15 (0.016 ± 0.006) 1.10 (0.043) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C197 HSMx-C120 CATHODE MARK CATHODE MARK LED DIE 0.80 (0.031) 0.3 (0.012) 1.60 (0.063) DIFFUSED EPOXY POLARITY 0.6 (0.024) 1.6 (0.063) 0.40 (0.016) POLARITY 1.2 (0.047) CLEAR EPOXY PC BOARD 0.16 (0.006) CATHODE LINE 1.0 (0.039) PC BOARD 0.30 ± 0.15 (0.012 ± 0.006) 0.5 (0.020) 0.70 (0.028) MIN. CATHODE LINE 3 – 0.3 (0.012) SOLDERING TERMINAL SOLDERING TERMINAL NOTE: 1. All dimensions are in millimeters (inches). 2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise noted. Broadcom AV02-0977EN 3 HSMQ-C1xx and HSMR-C1xx Data Sheet High-Performance Chip LED HSMx-C265 3.4 (0.134) HSMx-C130 CATHODE MARK (ETCHED) CATHODE MARK LED DIE LED DIE 0.8 (0.031) 1.25 (0.049) (0.625) 1.6 (0.063) GREEN SOLDER MASK POLARITY POLARITY 1.15 (0.045) 1.2 (0.047) UNDIFFUSED EPOXY 1.1 (0.043) 0.23 (0.009) DIFFUSED EPOXY 0.37 (0.015) PCB BOARD 1.1 (0.043) 0.18 (0.007) PC BOARD 0.3 (0.012) CATHODE LINE CATHODE LINE 0.3 ± 0.15 (0.012 ± 0.006) 0.50 ± 0.15 (0.020 ± 0.006) 0.50 ± 0.15 (0.020 ± 0.006) 0.3 ± 0.15 (0.012 ± 0.006) 0.7 (0.028) MIN. SOLDERING TERMINAL SOLDERING TERMINAL NOTE: 1. All dimensions are in millimeters (inches). 2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise noted. Device Selection Guide Package Dimension (mm)a, b InGaN Green InGaN Blue Package Description 3.2 (L) × 1.5 (W) × 1.0 (H) HSMQ-C110 HSMR-C110 Untinted, Non-diffused 1.6 (L) × 1.0 (W) × 0.6 (H) HSMQ-C120 HSMR-C120 Untinted, Non-diffused 1.6 (L) × 0.8 (W) × 0.37 (H) — HSMR-C130 Untinted, Diffused 3.2 (L) × 1.6 (W) × 1.1 (H) HSMQ-C150 HSMR-C150 Untinted, Diffused 2.0 (L) × 1.25 (W) × 0.8 (H) HSMQ-C170 HSMR-C170 Untinted, Diffused 2.0 (L) × 1.25 (W) × 0.4 (H) HSMQ-C177 HSMR-C177 Untinted, Diffused 1.6 (L) × 0.8 (W) × 0.8 (H) HSMQ-C190 HSMR-C190 Untinted, Diffused 1.6 (L) × 0.8 (W) × 0.6 (H) HSMQ-C191 HSMR-C191 Untinted, Diffused 1.6 (L) × 0.8 (W) × 0.4 (H) HSMQ-C197 HSMR-C197 Untinted, Diffused 3.4 (L) × 1.25 (W) × 1.1(H) HSMQ-C265 HSMR-C265 Untinted, Non-diffused a. Dimensions are in mm. b. Tolerance is ± 0.1 mm unless otherwise noted. Broadcom AV02-0977EN 4 HSMQ-C1xx and HSMR-C1xx Data Sheet High-Performance Chip LED Absolute Maximum Ratings at TA = 25°C Parameter HSMQ-Cxxx, HSMR-Cxxx Units DC Forward Currenta 20 mA Power Dissipation 78 mW Reverse Voltage (IR = 100 µA) 5 V LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature 95 °C –40 to +85 °C –40 to +85 °C See reflow soldering profile (Figure 11 and Figure 12) a. Derate linearly as shown in Figure 4. Electrical Characteristics at TA = 25°C Forward Voltage VF (V) at IF = 20 mA at IR = 100 µA Part Number Reverse Breakdown VR (V), f = 1 MHz Capacitance C (pF), VF = 0, RJ-PIN (°C/W) Thermal Resistance Typ. Max. Min. Typ. Typ. HSMQ-C110/C150 3.4 3.9 5 140 450 HSMR-C110/C150 3.4 3.9 5 140 450 HSMQ-C120 3.4 3.9 5 100 450 HSMR-C120/C130 3.4 3.9 5 100 450 HSMQ-C170/C190/C191 3.4 3.9 5 110 300 HSMR-C170/C190/C191 3.4 3.9 5 110 300 HSMQ-C177/C197 3.4 3.9 5 110 350 HSMR-C177/C197 3.4 3.9 5 110 350 HSMQ-C265 3.4 3.9 5 65 300 HSMR-C265 3.4 3.9 5 65 300 VF tolerance: ± 0.1V. Broadcom AV02-0977EN 5 HSMQ-C1xx and HSMR-C1xx Data Sheet High-Performance Chip LED Optical Characteristics at TA = 25°C Luminous Intensity, IV (mcd) at 20 mAa Part Number HSMQ-C110 Color Peak Wavelength, PEAK (nm) Viewing Dominant Wavelength, Db (nm) Luminous Angle, 2½, Degreesc Efficacy, V, (lm/w) Color Min. Typ. Typ. Typ. Typ. Typ. Green 45 150 520 527 130 500 HSMQ-C120 Green 45 145 520 527 155 500 HSMQ-C150/170/190/191 Green 45 145 520 527 140 500 HSMQ-C177/197 Green 45 145 520 527 130 500 HSMQ-C265 Green 45 140 520 527 150 500 HSMR-C110 Blue 18 60 469 473 130 88 HSMR-C120 Blue 18 55 469 473 155 88 HSMR-C130 Blue 18 55 469 473 145 88 HSMR-C150/170/190/191 Blue 18 55 469 473 140 88 HSMR-C177/197 Blue 18 55 469 473 130 88 HSMR-C265 Blue 18 45 469 473 150 88 a. The luminous intensity, IV, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. b. The dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. c. ½ is the off-axis angle where the luminous intensity is ½ the peak intensity. Color Bin Limits1 Blue Color Bins1 InGaN Green Color Bins1 Dom. Wavelength (nm) Dominant Wavelength (nm) Bin ID Min. Max. Bin ID Min. Max. A 460.0 465.0 A 515.0 520.0 B 465.0 470.0 B 520.0 525.0 C 470.0 475.0 C 525.0 530.0 D 475.0 480.0 D 530.0 535.0 Tolerance: ± 1 nm. 1. Broadcom Tolerance: ± 1 nm. Bin categories are established for classification of products. Products may not be available in all categories. Contact your Broadcom representative for information on currently available bins. AV02-0977EN 6 HSMQ-C1xx and HSMR-C1xx Data Sheet High-Performance Chip LED Light Intensity (Iv) Bin Limits2, 3 Intensity (mcd) Intensity (mcd) Bin ID Min. Max. Bin ID Min. Max. A 0.11 0.18 N 28.50 45.00 B 0.18 0.29 P 45.00 71.50 C 0.29 0.45 Q 71.50 112.50 D 0.45 0.72 R 112.50 180.00 E 0.72 1.10 S 180.00 285.00 F 1.10 1.80 T 285.00 450.00 G 1.80 2.80 U 450.00 715.00 H 2.80 4.50 V 715.00 1125.00 J 4.50 7.20 W 1125.00 1800.00 K 7.20 11.20 X 1800.00 2850.00 L 11.20 18.00 Y 2850.00 4500.00 M 18.00 28.50 Tolerance: ±15% Figure 1: Relative Intensity vs. Wavelength 100 RELATIVE INTENSITY – % 90 BLUE 80 GREEN 70 60 50 40 30 20 10 0 400 600 500 700 WAVELENGTH – nm 2. 3. Broadcom Bin categories are established for classification of products. Products may not be available in all categories. Contact your Broadcom representative for information on currently available bins. The Iv binning specification setup is for lowest allowable Iv binning only. There are no upper Iv bin limits. AV02-0977EN 7 HSMQ-C1xx and HSMR-C1xx Data Sheet High-Performance Chip LED Figure 3: Luminous Intensity vs. Forward Current 1.2 1.0 LUMINOUS INTENSITY (NORMALIZED AT 20 mA) IF – FORWARD CURRENT – mA 100 Figure 4: Maximum Forward Current vs. Ambient Temperature 10 BLUE 1 0.1 2.0 2.5 GREEN 3.0 3.5 0.8 0.6 GREEN 0.2 0 4.0 BLUE 0.4 0 5 VF – FORWARD VOLTAGE – V 10 15 20 IF – FORWARD CURRENT – mA 25 IF MAX – MAXIMUM FORWARD CURRENT – mA Figure 2: Forward Current vs. Forward Voltage 30 25 20 15 RTJ-A = 600°C/W 10 RTJ-A = 500°C/W 5 0 0 10 20 30 40 50 60 70 80 90 TA – AMBIENT TEMPERATURE – °C Figure 5: Relative Intensity vs. Angle for HSMx-C110 RELATIVE INTENSITY – % 100 80 60 40 20 0 -90 -70 -50 -30 -10 10 30 50 70 90 50 70 90 ANGLE Figure 6: Relative Intensity vs. Angle for HSMx-C110 RELATIVE INTENSITY – % 100 80 60 40 20 0 -90 -70 -50 -30 -10 10 30 ANGLE Broadcom AV02-0977EN 8 HSMQ-C1xx and HSMR-C1xx Data Sheet High-Performance Chip LED Figure 7: Relative Intensity vs. Angle for HSMx-C120 100 90 RELATIVE INTENSITY 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 60 70 80 90 ANGLE Figure 8: Relative Intensity vs. Angle for HSMx-C120 100 90 RELATIVE INTENSITY 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 ANGLE Figure 9: Relative Intensity vs. Angle for HSMx-C177 and C197 100 RELATIVE INTENSITY – % 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Broadcom AV02-0977EN 9 HSMQ-C1xx and HSMR-C1xx Data Sheet High-Performance Chip LED Figure 10: Relative Intensity vs. Angle for HSMx-C130 100 RELATIVE INTENSITY – % 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 11: Relative Intensity vs. Angle for HSMx-C170, C190, C191, and C150 100 RELATIVE INTENSITY – % 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 60 70 80 90 ANGLE Figure 12: Relative Intensity vs. Angle for HSMx-C265 100 RELATIVE INTENSITY – % 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 ANGLE Broadcom AV02-0977EN 10 HSMQ-C1xx and HSMR-C1xx Data Sheet High-Performance Chip LED Figure 13: Recommended Reflow Soldering Profile Figure 14: Recommended Pb-free Reflow Soldering Profile 10 SEC. MAX. 10 SEC. MAX. 4°C/SEC. MAX. 140-160°C 3°C/SEC. MAX. 4°C/SEC. MAX. OVER 2 MIN. TEMPERATURE TEMPERATURE 230°C MAX. 255 - 260°C 3°C/SEC. MAX. 217°C 200°C 6°C/SEC. MAX. 150°C 3°C/SEC. MAX. TIME 60 SEC. MAX. 60 - 120 SEC. TIME Figure 15: Recommended Soldering Pattern for HSMx-C110 Figure 16: Recommended Soldering Pattern for HSMx-C170/ 177 5.0 (0.200) 1.2 (0.047) 0.9 (0.035) 0.9 (0.035) 1.2 (0.047) 1.2 (0.047) 1.0 (0.039) 0.9 (0.035) 0.2 (0.008) CENTERING BOARD 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) Figure 17: Recommended Soldering Pattern for HSMx-C130/ 190/191/197 Figure 18: Recommended Soldering Pattern for HSMx-C150 0.8 (0.031) 0.8 (0.031) NOTE: Broadcom 0.7 (0.028) 0.8 (0.031) 1.5 (0.059) 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) All dimensions are in millimeters (inches). AV02-0977EN 11 HSMQ-C1xx and HSMR-C1xx Data Sheet High-Performance Chip LED Figure 19: Recommended Soldering Pattern for HSMx-C120 Figure 20: Recommended Soldering Pattern for HSMx-C265 2.2 (0.087) DIA. PCB HOLE 0.4 (0.016) 0.4 (0.016) 0.7 (0.028) 1.25 (0.049) 0.15 (0.006) 0.8 (0.031) 1.2 (0.047) 0.8 (0.031) CENTERING BOARD 1.4 (0.055) NOTE: 2.3 (0.091) 1.4 (0.055) All dimensions are in millimeters (inches). Figure 21: Reeling Orientation USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Broadcom AV02-0977EN 12 HSMQ-C1xx and HSMR-C1xx Data Sheet High-Performance Chip LED Figure 22: Reel Dimensions 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) Ø 20.20 MIN. (Ø 0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) NOTE: Broadcom 6 PS 5.0 ± 0.5 (0.197 ± 0.020) All dimensions are in millimeters (inches). AV02-0977EN 13 HSMQ-C1xx and HSMR-C1xx Data Sheet High-Performance Chip LED Figure 23: Tape Dimensions 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 0.23 ± 0.05 (0.009 ± 0.002) FOR HSMR-C130 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) 4.00 (0.157) HSMx-C110/120 POSITION IN CARRIER TAPE R 1.0 ± 0.05 (0.039 ± 0.002) FOR HSMx-C110 COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) CARRIER TAPE USER FEED DIRECTION DIM. A ± 0.10 (0.004) DIM. B ± 0.10 (0.004) DIM. C ± 0.10 (0.004) 3.40 (0.134) 1.90 (0.075) 1.75 (0.069) 3.50 (0.138) 2.30 (0.091) 2.30 (0.091) 1.75 (0.069) 1.85 (0.073) 1.75 (0.069) 1.70 (0.067) 1.15 (0.045) 0.88 (0.035) 1.88 (0.074) 1.45 (0.057) 1.40 (0.055) 0.90 (0.035) 0.88 (0.035) 0.95 (0.037) 1.20 (0.047) 0.75 (0.030) 0.50 (0.020) 1.27 (0.050) 0.95 (0.037) 0.60 (0.024) 0.90 (0.035) 0.85 (0.033) 0.60 (0.024) HSMx-C110 SERIES HSMx-C120 SERIES HSMx-C130 SERIES HSMx-C150 SERIES HSMx-C170 SERIES HSMx-C177 SERIES HSMx-C190 SERIES HSMx-C191 SERIES HSMx-C197 SERIES R 0.5 ± 0.05 (0.020 ± 0.002) FOR HSMx-C120 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) 4.00 (0.157) HSMx-C265 SERIES Broadcom COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER NOTE: CARRIER TAPE USER FEED DIRECTION DIM. A ± 0.10 (0.004) 3.70 (0.146) DIM. B ± 0.10 (0.004) 1.45 (0.057) DIM. C ± 0.10 (0.004) 1.30 (0.051) All dimensions are in millimeters (inches). AV02-0977EN 14 HSMQ-C1xx and HSMR-C1xx Data Sheet High-Performance Chip LED Figure 24: Tape Leader and Trailer Dimensions END START THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. NOTE: 1. All dimensions are in millimeters (inches). 2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified. Convective IR Reflow Soldering Storage Condition For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. 5°C to 30°C @ 60% RH maximum. Baking is required under the following conditions: 1. The humidity indicator card is >10% when read at 23°C ± 5°C. 2. The device is exposed to factory conditions