HSMR-C265

HSMQ-C1xx and HSMR-C1xx High Performance Chip LED Data Sheet HSMQ-C110, HSMQ-C120, HSMQ-C150, HSMQ-C170, HSMQ-C177, HSMQ-C190, HSMQ-C191, HSMQ-C197, HSMQ-C265, HSMR-C110, HSMR-C120, HSMR-C130, HSMR-C150, HSMR-C170, HSMR-C177, HSMR-C190, HSMR-C191, HSMR-C197, HSMR-C265 Description Features These small chip-type LEDs utilize high efficient and high brightness InGaN material to deliver competitively priced high performance blue and green. These 520 nm green and 470 nm blue are unique hues which provide color differentiation to a product. • High brightness • Small size • Industrial standard footprint • Diffused optics • Top emitting or right angle emitting • Compatible with IR soldering • Compatible for use with light piping • Available in 8 mm tape on 7" diameter reel • Reel sealed in zip locked moisture barrier bags These ChipLEDs come in either top emitting packages (HSMx-C130, C150, C170, C177, C190, C191, C197), in side emitting packages (HSMx-C110, C120) or in a reverse mount package (C265). The side emitting package is especially suitable for LCD backlighting application. The top emitting packages, with their wide viewing angle, are suitable for direct backlighting application or being used with light pipes. In order to facilitate pick and place operation, these ChipLEDs are shipped in tape and reel with 4000 units per reel for HSMx-C120, C130, C170, C177, C190, C191 and C197 packages, and 3000 units per reel for HSMx-C110, C150 and C265 packages. All packages are compatible with IR soldering and binned by both color and intensity. Applications • LCD backlighting • Push button backlighting • Front panel indicator • Symbol indicator • Microdisplays • Small message panel signage CAUTION: HSMQ-Cxxx and HSMR-Cxxx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details. Package Dimensions CATHODE LINE LED DIE CATHODE MARK 1.0 (0.039) 1.25 (0.049) 2.6 (0.102 ) 2.0 (0.079 ) 3.2 (0.126 ) POLARITY CLEAR EPOXY 1.4 (0.055) DIFFUSED EPOXY 1.5 (0.059) POLARITY 0.3 (0.012) PC BOARD PC BOARD 0.8 (0.031) 1.6 (0.063 ) 0.5 (0.020) 3.2 (0.126 ) 0.8 (0.031) 0.3 (0.012) CATHODE LINE 0.4 ± 0.15 (0.016 ± 0.006) 0.4 ± 0.15 (0.016 ± 0.006) CATHODE LINE 1.0 (0.039) SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C170 HSMx-C110 CATHODE MARK CATHODE MARK 0.8 (0.031) 0.8 (0.031) 1.6 (0.063 ) 1.6 (0.063 ) 1.0 (0.039) 1.0 (0.039) POLARITY 0.3 (0.012) 0.3 (0.012) DIFFUSED EPOXY DIFFUSED EPOXY PC BOARD POLARITY PC BOARD 0.8 (0.031) 0.3 (0.012) CATHODE LINE 0.3 ± 0.15 (0.012 ± 0.006) 0.6 (0.023) 0.3 (0.012) CATHODE LINE 0.3 ± 0.15 (0.012 ± 0.006) 0.3 ± 0.15 (0.012 ± 0.006) 0.3 ± 0.15 (0.012 ± 0.006) 0.7 (0.028) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C190 HSMx-C191 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. 2 0.7 (0.028) MIN. Package Dimensions, continued CATHODE MARK CATHODE MARK 1.25 (0.049) 1.6 (0.063) 2.00 (0.079) 3.2 (0.126 ) DIFFUSED EPOXY POLARITY 2.0 (0.079) POLARITY DIFFUSED EPOXY 0.40 (0.016) 0.6 (0.024) 1.1 (0.043) PC BOARD PC BOARD CATHODE LINE 0.5 (0.020) 0.50 ± 0.20 (0.020 ± 0.008) 0.50 ± 0.20 (0.020 ± 0.008) 0.16 (0.006) CATHODE LINE 0.40 ± 0.15 (0.016 ± 0.006) 0.40 ± 0.15 (0.016 ± 0.006) 1.10 (0.043) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C150 HSMx-C177 CATHODE MARK LED DIE CATHODE MARK 0.3 (0.012) 1.6 (0.063) 0.80 (0.031) 1.60 (0.063) POLARITY POLARITY 1.2 (0.047) CLEAR EPOXY DIFFUSED EPOXY 0.6 (0.024) 0.40 (0.016) 1.0 (0.039) PC BOARD PC BOARD 0.16 (0.006) 0.5 (0.020) CATHODE LINE 0.30 ± 0.15 (0.012 ± 0.006) CATHODE LINE 0.70 (0.028) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C197 HSMx-C120 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. 3 3 – 0.3 (0.012) Package Dimensions, continued 3.4 (0.134) CATHODE MARK (ETCHED) CATHODE MARK LED DIE LED DIE 0.8 (0.031) 1.25 (0.049) (0.625) 1.6 (0.063) GREEN SOLDER MASK POLARITY UNDIFFUSED EPOXY POLARITY 1.15 (0.045) 1.2 (0.047) 0.23 (0.009) DIFFUSED EPOXY 1.1 (0.043) 1.1 (0.043) PC BOARD 0.35 (0.014) PCB BOARD 0.12 (0.005) 0.3 (0.012) CATHODE LINE CATHODE LINE 0.50 ± 0.15 (0.020 ± 0.006) 0.50 ± 0.15 (0.020 ± 0.006) 0.3 ± 0.15 (0.012 ± 0.006) 0.3 ± 0.15 (0.012 ± 0.006) 0.7 (0.028) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C265 HSMx-C130 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. Device Selection Guide Package Dimension (mm) [1], [2] InGaN Green InGaN Blue Package Description 3.2(L) x 1.5(W) x 1.0(H) HSMQ-C110 HSMR-C110 Untinted, Non-diffused 1.6(L) x 1.0(W) x 0.6(H) HSMQ-C120 HSMR-C120 Untinted, Non-diffused 1.6(L) x 0.8(W) x 0.35(H) – HSMR-C130 Untinted, Diffused 3.2(L) x 1.6(W) x 1.1(H) HSMQ-C150 HSMR-C150 Untinted, Diffused 2.0(L) x 1.25(W) x 0.8(H) HSMQ-C170 HSMR-C170 Untinted, Diffused 2.0(L) x 1.25(W) x 0.4(H) HSMQ-C177 HSMR-C177 Untinted, Diffused 1.6(L) x 0.8(W) x 0.8(H) HSMQ-C190 HSMR-C190 Untinted, Diffused 1.6(L) x 0.8(W) x 0.6(H) HSMQ-C191 HSMR-C191 Untinted, Diffused 1.6(L) x 0.8(W) x 0.4(H) HSMQ-C197 HSMR-C197 Untinted, Diffused 3.4(L) x 1.25(W) x 1.1(H) HSMQ-C265 HSMR-C265 Untinted, Non-diffused Notes: 1. Dimensions in mm. 2. Tolerance ± 0.1 mm unless otherwise noted. Absolute Maximum Ratings at TA = 25˚C Parameter HSMQ-Cxxx HSMR-Cxxx Units DC Forward Current [1] 20 mA Power Dissipation 78 mW Reverse Voltage (IR = 100 µA) 5 V LED Junction Temperature 95 ˚C Operating Temperature Range –40 to +85 ˚C Storage Temperature Range –40 to +85 ˚C Soldering Temperature See reflow soldering profile (Figures 11 & 12) Note: 1. Derate linearly as shown in Figure 4. 4 Electrical Characteristics at TA = 25˚C Part Number Forward Voltage VF (Volts) @ IF = 20 mA @ IR = 100 µA Typ. Max. Reverse Breakdown VR (Volts) f = 1 MHz Min. Capacitance C (pF), VF = 0, RθJ–PIN (˚C/W) Typ. Thermal Resistance Typ. HSMQ-C110/C150 3.4 3.9 5 140 450 HSMR-C110/C150 3.4 3.9 5 140 450 HSMQ-C120 3.4 3.9 5 100 450 HSMR-C120/C130 3.4 3.9 5 100 450 HSMQ-C170/C190/C191 3.4 3.9 5 110 300 HSMR-C170/C190/C191 3.4 3.9 5 110 300 HSMQ-C177/C197 3.4 3.9 5 110 350 HSMR-C177/C197 3.4 3.9 5 110 350 HSMQ-C265 3.4 3.9 5 65 300 HSMR-C265 3.4 3.9 5 65 300 VF Tolerance: ±0.1 V Optical Characteristics at TA = 25˚C Part Number Color Luminous Intensity IV (mcd) @ 20 mA[1] Min. Typ. Color, Peak Wavelength λpeak (nm) Typ. Viewing Dominant Wavelength λd[2] (nm) Typ. Luminous Angle 2 θ1/2 Degrees[3] Typ. Efficacy ηV (lm/w) Typ. HSMQ-C110 Green 45 520 527 130 500 HSMQ-C120 150 Green 45 145 520 527 155 500 HSMQ-C150/170/190/191 Green 45 145 520 527 140 500 HSMQ-C177/197 Green 45 145 520 527 130 500 HSMQ-C265 Green 45 140 520 527 150 500 HSMR-C110 Blue 18 60 469 473 130 88 HSMR-C120 Blue 18 55 469 473 155 88 HSMR-C130 Blue 18 55 469 473 145 88 HSMR-C150/170/190/191 Blue 18 55 469 473 140 88 HSMR-C177/197 Blue 18 55 469 473 130 88 HSMR-C265 Blue 18 45 469 473 150 88 Notes: 1. The luminous intensity, IV, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Color Bin Limits[1] Blue Color Bins[1] InGaN Green Color Bins[1] Bin ID Dom. Wavelength (nm) Min. Max. Bin ID Dom. Wavelength (nm) Min. Max. A 460.0 465.0 A 515.0 520.0 B 465.0 470.0 B 520.0 525.0 C 470.0 475.0 C 525.0 530.0 D 475.0 480.0 D 530.0 535.0 Tolerance: ±1 nm Tolerance: ±1 nm Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. 5 Light Intensity (Iv) Bin Limits[1] Bin ID Intensity (mcd) Min. Max. Bin ID Intensity (mcd) Min. Max. A 0.11 0.18 N 28.50 45.00 B 0.18 0.29 P 45.00 71.50 C 0.29 0.45 Q 71.50 112.50 D 0.45 0.72 R 112.50 180.00 E 0.72 1.10 S 180.00 285.00 F 1.10 1.80 T 285.00 450.00 G 1.80 2.80 U 450.00 715.00 H 2.80 4.50 V 715.00 1125.00 J 4.50 7.20 W 1125.00 1800.00 K 7.20 11.20 X 1800.00 2850.00 L 11.20 18.00 Y 2850.00 4500.00 M 18.00 28.50 Tolerance: ±15% Notes: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. 2. The Iv binning specification set-up is for lowest allowable Iv binning only. There are no upper Iv bin limits. 100 RELATIVE INTENSITY – % 90 BLUE 80 GREEN 70 60 50 40 30 20 10 0 400 600 500 700 WAVELENGTH – nm HSMx-C1xx fig 1 1.2 10 BLUE 1 0.1 2.0 2.5 GREEN 3.0 3.5 VF – FORWARD VOLTAGE – V Figure 2. Forward current vs. forward voltage. HSMx-C1xx fig 2 6 LUMINOUS INTENSITY (NORMALIZED AT 20 mA) IF – FORWARD CURRENT – mA 100 4.0 1.0 0.8 0.6 BLUE 0.4 GREEN 0.2 0 0 5 10 15 20 IF – FORWARD CURRENT – mA Figure 3. Luminous intensity vs. forward current. HSMx-C1xx fig 3 25 IF MAX – MAXIMUM FORWARD CURRENT – mA Figure 1. Relative intensity vs. wavelength. 30 25 20 15 RθJ-A = 600°C/W 10 RθJ-A = 500°C/W 5 0 0 10 20 30 40 50 60 70 80 90 TA – AMBIENT TEMPERATURE – °C Figure 4. M aximum for ward c urrent vs. ambient temperature. HSMx-C1xx fig 4 RELATIVE INTENSITY – % 100 80 60 40 20 0 -90 -70 -50 -30 -10 10 30 50 70 90 30 50 70 90 ANGLE RELATIVE INTENSITY – % 100 80 60 40 20 0 -90 -70 -50 -30 -10 10 ANGLE Figure 5. Relative intensity vs. angle for HSMx-C110. 100 RELATIVE INTENSITY 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE 100 RELATIVE INTENSITY 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 6. Relative intensity vs. angle for HSMx-C120. 7 100 RELATIVE INTENSITY – % 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 7. Relative intensity vs. angle for HSMx-C177 and C197. 100 RELATIVE INTENSITY – % 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 8. Relative intensity vs. angle for HSMx-C130. 100 RELATIVE INTENSITY – % 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 9. Relative intensity vs. angle for HSMx-C170, C190, C191, and C150. 100 RELATIVE INTENSITY – % 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 10. Relative intensity vs. angle for HSMx-C265. 8 10 SEC. MAX. 10 SEC. MAX. 4°C/SEC. MAX. 140-160°C 3°C/SEC. MAX. 4°C/SEC. MAX. OVER 2 MIN. TEMPERATURE TEMPERATURE 230°C MAX. 255 - 260 C 3 C/SEC. MAX. 217 C 200 C 6 C/SEC. MAX. 150 C 3 C/SEC. MAX. TIME 60 SEC. MAX. 60 - 120 SEC. Figure 11. Recommended reflow soldering profile. TIME Figure 12. Recommended Pb-free reflow soldering profile. 5.0 (0.200) 0.9 (0.035) 0.9 (0.035) 1.0 (0.039) 1.2 (0.047) 0.2 (0.008) CENTERING BOARD 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) 1.2 (0.047) 1.2 (0.047) 0.9 (0.035) Figure 13. Recommended soldering pattern for HSMx-C110. Figure 14. Recommended soldering pattern for HSMx-C170/177. 0.8 (0.031) 1.5 (0.059) 0.8 (0.031) 0.7 (0.028) 0.8 (0.031) 1.5 (0.059) Figure 15. Recommended soldering pattern for HSMxC130/190/191/197. 2.0 (0.079) 1.5 (0.059) Figure 16. Recommended soldering pattern for HSMx-C150. 0.4 (0.016) 2.2 (0.087) DIA. PCB HOLE 0.4 (0.016) 0.7 (0.028) 1.25 (0.049) 0.15 (0.006) 0.8 (0.031) 1.2 (0.047) 0.8 (0.031) Figure 17. Recommended soldering pattern for HSMx-C120. NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 9 CENTERING BOARD 1.4 (0.055) 2.3 (0.091) 1.4 (0.055) Figure 18. Recommended soldering pattern for HSMx-C265. USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 19. Reeling orientation. 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) Ø 20.20 MIN. (Ø 0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) Figure 20. Reel dimensions. NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 10 6 PS 5.0 ± 0.5 (0.197 ± 0.020) 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 0.23 ± 0.05 (0.009 ± 0.002) FOR HSMR-C130 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) 8.00 ± 0.30 (0.315 ± 0.012) 4.00 (0.157) HSMx-C110/120 POSITION IN CARRIER TAPE COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER HSMx-C110 SERIES HSMx-C120 SERIES HSMx-C150 SERIES HSMx-C170 SERIES HSMx-C177 SERIES HSMx-C190 SERIES HSMx-C191 SERIES HSMx-C197 SERIES DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) CARRIER TAPE USER FEED DIRECTION DIM. A ± 0.10 (0.004) 3.40 (0.134) 1.90 (0.075) 3.50 (0.138) 2.30 (0.091) 2.30 (0.091) 1.75 (0.069) 1.85 (0.073) 1.75 (0.069) DIM. B DIM. C ± 0.10 (0.004) ± 0.10 (0.004) 1.20 (0.047) 1.70 (0.067) 0.75 (0.030) 1.15 (0.045) 1.27 (0.050) 1.88 (0.074) 0.95 (0.037) 1.45 (0.057) 0.60 (0.024) 1.40 (0.055) 0.90 (0.035) 0.90 (0.035) 0.85 (0.033) 0.88 (0.035) 0.60 (0.024) 0.95 (0.037) R 1.0 ± 0.05 (0.039 ± 0.002) FOR HSMx-C110 R 0.5 ± 0.05 (0.020 ± 0.002) FOR HSMx-C120 4.00 (0.157) CATHODE 1.50 (0.059) DIM. C (SEE TABLE 1) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) 8.00 ± 0.30 (0.315 ± 0.012) 4.00 (0.157) HSMx-C265 SERIES Figure 21. Tape dimensions. NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER 11 CARRIER TAPE USER FEED DIRECTION DIM. A DIM. B DIM. C ± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004) 3.70 (0.146) 1.45 (0.057) 1.30 (0.051) END THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START MOUNTED WITH COMPONENTS MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 22. Tape leader and trailer dimensions. NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 30°C @ 60% RH max. Baking is required under the condition: a) Humidity Indicator Card is >10% when read at 23 ± 5°C b) Device exposed to factory conditions