HSMS-280C-BLKG

HSMS-280x Surface Mount RF Schottky Barrier Diodes Data Sheet Description/Applications Features These Schottky diodes are specifically designed for both analog and digital applications. This series offers a wide range of specifications and package configurations to give the designer wide flexibility. The HSMS-280x series of diodes is optimized for high voltage applications. x Surface Mount Packages Note that Avago’s manufacturing techniques assure that dice found in pairs and quads are taken from adjacent sites on the wafer, assuring the highest degree of match. x Single, Dual and Quad Versions x High Breakdown Voltage x Low FIT (Failure in Time) Rate* x Six-sigma Quality Level x Tape and Reel Options Available x Lead-free * Package Lead Code Identification, SOT-323 (Top View) For more information see the Surface Mount Schottky Reliability Data Sheet. Package Lead Code Identification, SOT-363 (Top View) HIGH ISOLATION UNCONNECTED PAIR SERIES SINGLE C COMMON CATHODE B COMMON ANODE E 6 5 1 2 4 K 3 COMMON CATHODE QUAD F UNCONNECTED TRIO 6 5 1 2 5 4 6 5 1 2 3 1 2 6 BRIDGE QUAD 5 L 3 COMMON ANODE QUAD 6 M 4 4 6 3 1 4 N 3 RING QUAD 5 4 Package Lead Code Identification, SOT-23/SOT-143 (Top View) SINGLE 3 SERIES 3 1 1 #0 2 UNCONNECTED PAIR 3 4 1 #5 2 #2 2 BRIDGE QUAD 3 4 1 #8 2 COMMON ANODE 3 1 #3 2 COMMON CATHODE 3 1 #4 2 1 2 P 2 R 3 Pin Connections and Package Marking, SOT-363 2 3 6 GUx 1 5 4 Notes: 1. Package marking provides orientation and identification. 2. See “Electrical Specifications” for appropriate package marking. ESD WARNING: Handling Precautions Should Be Taken To Avoid Static Discharge. Absolute Maximum Ratings[1] TC = 25°C Symbol Parameter Unit SOT-23/SOT-143 SOT-323/SOT-363 If Forward Current (1 μs Pulse) PIV Peak Inverse Voltage Amp 1 1 V Same as VBR Same as VBR Tj Junction Temperature °C 150 150 Tstg Storage Temperature °C -65 to 150 -65 to 150 Tjc Thermal Resistance[2] °C/W 500 150 Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. TC = +25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board. Electrical Specifications TA = 25°C, Single Diode [3] Part Number HSMS[4] 2800 2802 2803 2804 2805 2808 Package Marking Code A0 A2 A3 A4 A5 A8 Lead Code 0 2 3 4 5 8 280B 280C 280E 280F A0 A2 A3 A4 B C E F 280K AK K 280L AL 280M H 280N N 280P AP 280R O Test Conditions L M N P R Configuration Single Series Common Anode Common Cathode Unconnected Pair Bridge Quad[4] Single Series Common Anode Common Cathode High Isolation Unconnected Pair Unconnected Trio Common Cathode Quad Common Anode Quad Bridge Quad Ring Quad Minimum Breakdown Voltage VBR (V) Maximum Forward Voltage VF (mV) Maximum Forward Voltage VF (V) @ IF (mA) Maximum Reverse Leakage IR (nA) @ VR (V) Maximum Capacitance CT (pF) Typical Dynamic Resistance RD (Ω) [5] 70 410 1.0 @ 15 200 @ 50 2.0 35 IR = 10 mA IF = 1 mA VF = 0 V f = 1 MHz IF = 5 mA Notes: 1. DVF for diodes in pairs and quads in 15 mV maximum at 1 mA. 2. DCTO for diodes in pairs and quads is 0.2 pF maximum. 3. Effective Carrier Lifetime (t) for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA. 4. See section titled “Quad Capacitance.” 5. R D = RS + 5.2 Ω at 25°C and I f = 5 mA. 2 Quad Capacitance A Capacitance of Schottky diode quads is measured using an HP4271 LCR meter. This instrument effectively isolates individual diode branches from the others, allowing accurate capacitance measurement of each branch or each diode. The conditions are: 20 mV R.M.S. voltage at 1 MHz. Avago defines this measurement as “CM”, and it is equivalent to the capacitance of the diode by itself. The equivalent diagonal and adjacent capacitances can then be calculated by the formulas given below. In a quad, the diagonal capacitance is the capacitance between points A and B as shown in the figure below. The diagonal capacitance is calculated using the following formula C1 x C2 + _______ C3 x C4 CDIAGONAL = _______ C1 + C2 C3 C2 C4 C B The equivalent adjacent capacitance is the capacitance between points A and C in the figure below. This capacitance is calculated using the following formula 1 CADJACENT = C1 + ____________ 1 + –– 1 + –– 1 –– C2 C3 C4 This information does not apply to cross-over quad diodes. C3 + C4 Linear Equivalent Circuit, Diode Chip Rj RS Cj RS = series resistance (see Table of SPICE parameters) C j = junction capacitance (see Table of SPICE parameters) 8.33 X 10-5 nT Rj = Ib + Is where Ib = externally applied bias current in amps Is = saturation current (see table of SPICE parameters) T = temperature, K n = ideality factor (see table of SPICE parameters) Note: To effectively model the packaged HSMS-280x product, please refer to Application Note AN1124. 3 C1 SPICE Parameters Parameter Units HSMS-280x BV V 75 CJ0 pF 1.6 EG eV 0.69 IBV A E-5 IS A 3.00E-08 N 1.08 RS Ω 30 PB V 0.65 PT 2 M 0.5 Typical Performance, TC = 25°C (unless otherwise noted), Single Diode 1000 10,000 10 1 TA = +125C TA = +75C TA = +25C TA = –25C 0 1000 100 TA = +125C TA = +75C TA = +25C 10 1 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0 VF – FORWARD VOLTAGE (V) 20 30 40 30 IF - FORWARD CURRENT (mA) 1.5 1 0.5 0 0 10 20 30 40 VR – REVERSE VOLTAGE (V) Figure 4. Total Capacitance vs. Reverse Voltage. 50 30 IF (Left Scale) 10 10 VF (Right Scale) 1 0.3 0.2 1 0.4 0.6 0.8 1.0 1.2 10 1 10 I F – FORWARD CURRENT (mA) Figure 3. Dynamic Resistance vs. Forward Current. Figure 2. Reverse Current vs. Reverse Voltage at Temperatures. 2 100 1 0.1 50 VR – REVERSE VOLTAGE (V) Figure 1. Forward Current vs. Forward Voltage at Temperatures. C T – CAPACITANCE (pF) 10 0.3 1.4 VF - FORWARD VOLTAGE (V) Figure 5. Typical Vf Match, Pairs and Quads. VF - FORWARD VOLTAGE DIFFERENCE (mV) 0.1 0.01 4 RD – DYNAMIC RESISTANCE () 100,000 I R – REVERSE CURRENT (nA) I F – FORWARD CURRENT (mA) 100 100 Applications Information Introduction — Product Selection 0.026 Avago’s family of Schottky products provides unique solutions to many design problems. The first step in choosing the right product is to select the diode type. All of the products in the HSMS-280x family use the same diode chip, and the same is true of the HSMS-281x and HSMS-282x families. Each family has a different set of characteristics which can be compared most easily by consulting the SPICE parameters in Table 1. A review of these data shows that the HSMS-280x family has the highest breakdown voltage, but at the expense of a high value of series resistance (Rs). In applications which do not require high voltage the HSMS-282x family, with a lower value of series resistance, will offer higher current carrying capacity and better performance. The HSMS-281x family is a hybrid Schottky (as is the HSMS-280x), offering lower 1/f or flicker noise than the HSMS-282x family. In general, the HSMS-282x family should be the designer’s first choice, with the -280x family reserved for high voltage applications and the HSMS-281x family for low flicker noise applications. 0.079 0.039 0.022 Dimensions in inches Figure 6. Recommended PCB Pad Layout for Avago’s SC70 3L/SOT-323 Products. Assembly Instructions SOT-363 PCB Footprint A recommended PCB pad layout for the miniature SOT363 (SC-70, 6 lead) package is shown in Figure 7 (dimensions are in inches). This layout provides ample allowance for package placement by automated assembly equipment without adding parasitics that could impair the performance. 0.026 Assembly Instructions SOT-323 PCB Footprint A recommended PCB pad layout for the miniature SOT323 (SC-70) package is shown in Figure 6 (dimensions are in inches). This layout provides ample allowance for package placement by automated assembly equipment without adding parasitics that could impair the performance. 0.079 0.039 0.018 Dimensions in inches Figure 7. Recommended PCB Pad Layout for Avago’s SC70 6L/SOT-363 Products. Table 1. Typical SPICE Parameters Parameter Units HSMS-280x HSMS-281x HSMS-282x BV V 75 25 15 CJ0 pF 1.6 1.1 0.7 EG eV 0.69 0.69 0.69 IBV A 1 E-5 1 E-5 1 E-4 IS A 3 E-8 4.8 E-9 2.2 E-8 1.08 1.08 1.08 RS Ω 30 10 6 PB (VJ) V 0.65 0.65 0.65 N PT (XTI) 2 2 2 M 0.5 0.5 0.5 5 SMT Assembly Reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including: method of heating (e.g., IR or vapor phase reflow, wave soldering, etc.) circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity and thermal mass of components. Components with a low mass, such as the SOT package, will reach solder reflow temperatures faster than those with a greater mass. zones. The preheat zones increase the temperature of the board and components to prevent thermal shock and begin evaporating solvents from the solder paste. The reflow zone briefly elevates the temperature sufficiently to produce a reflow of the solder. The rates of change of temperature for the ramp-up and cool-down zones are chosen to be low enough to not cause deformation of the board or damage to components due to thermal shock. The maximum temperature in the reflow zone (TMAX) should not exceed 260°C. Avago’s SOT diodes have been qualified to the timetemperature profile shown in Figure 8. This profile is representative of an IR reflow type of surface mount assembly process. These parameters are typical for a surface mount assembly process for Avago diodes. As a general guideline, the circuit board and components should be exposed only to the minimum temperatures and times necessary to achieve a uniform reflow of solder. After ramping up from room temperature, the circuit board with components attached to it (held in place with solder paste) passes through one or more preheat tp Tp Critical Zone T L to Tp Ramp-up Temperature TL Ts Ts tL max min Ramp-down ts Preheat 25 t 25° C to Peak Time Figure 8. Surface Mount Assembly Profile. Lead-Free Reflow Profile Recommendation (IPC/JEDEC J-STD-020C) Reflow Parameter Lead-Free Assembly Average ramp-up rate (Liquidus Temperature (TS(max) to Peak) 3°C/ second max Preheat Temperature Min (TS(min)) 150°C Temperature Max (TS(max)) 200°C Time (min to max) (tS) 60-180 seconds Temperature (TL) 217°C Time (tL) 60-150 seconds Ts(max) to TL Ramp-up Rate Time maintained above: 3°C/second max Peak Temperature (TP) 260 +0/-5°C Time within 5 °C of actual Peak temperature (tP) 20-40 seconds Ramp-down Rate 6°C/second max Time 25 °C to Peak Temperature 8 minutes max Note 1: All temperatures refer to topside of the package, measured on the package body surface 6 Part Number Ordering Information Part Number No. of Devices Container HSMS-280x-TR2G 10000 13” Reel HSMS-280x-TR1G 3000 7” Reel HSMS-280x-BLKG 100 antistatic bag x = 0, 2, 3, 4, 5, 8, B, C, E, F, K, L, M, N, P, R Package Dimensions Outline 23 (SOT-23) Outline SOT-323 (SC-70 3 Lead) e1 e2 e1 E E XXX XXX E1 E1 e e L B L C D B D DIMENSIONS (mm) A A1 Notes: XXX-package marking Drawings are not to scale 7 DIMENSIONS (mm) C SYMBOL A A1 B C D E1 e e1 e2 E L MIN. 0.79 0.000 0.30 0.08 2.73 1.15 0.89 1.78 0.45 2.10 0.45 MAX. 1.20 0.100 0.54 0.20 3.13 1.50 1.02 2.04 0.60 2.70 0.69 A A1 Notes: XXX-package marking Drawings are not to scale SYMBOL A A1 B C D E1 e e1 E L MIN. MAX. 0.80 1.00 0.00 0.10 0.15 0.40 0.08 0.25 1.80 2.25 1.10 1.40 0.65 typical 1.30 typical 1.80 2.40 0.26 0.46 Package Dimensions (Continued) Outline 143 (SOT-143) Outline SOT-363 (SC-70 6 Lead) e2 DIMENSIONS (mm) e1 HE B1 E XXX SYMBOL E D HE A A2 A1 e b c L E E1 e D MIN. MAX. 1.15 1.35 1.80 2.25 1.80 2.40 0.80 1.10 0.80 1.00 0.00 0.10 0.650 BCS 0.15 0.30 0.08 0.25 0.10 0.46 L B e C A1 A2 DIMENSIONS (mm) D A A1 Notes: XXX-package marking Drawings are not to scale SYMBOL A A1 B B1 C D E1 e e1 e2 E L MIN. 0.79 0.013 0.36 0.76 0.086 2.80 1.20 0.89 1.78 0.45 2.10 0.45 MAX. 1.097 0.10 0.54 0.92 0.152 3.06 1.40 1.02 2.04 0.60 2.65 0.69 c A b L For Outlines SOT-23, -323 Device Orientation REEL TOP VIEW END VIEW 4 mm CARRIER TAPE 8 mm USER FEED DIRECTION ABC For Outline SOT-143 ABC For Outline SOT-363 TOP VIEW END VIEW TOP VIEW 4 mm END VIEW 4 mm ABC ABC ABC ABC Note: "AB" represents package marking code. "C" represents date code. 8 ABC Note: "AB" represents package marking code. "C" represents date code. COVER TAPE 8 mm ABC 8 mm ABC ABC ABC ABC Note: "AB" represents package marking code. "C" represents date code. Tape Dimensions and Product Orientation For Outline SOT-23 P P2 D E P0 F W D1 t1 13.5° MAX 8° MAX Ko 9° MAX B0 A0 DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES) CAVITY LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER A0 B0 K0 P D1 3.15 ± 0.10 2.77 ± 0.10 1.22 ± 0.10 4.00 ± 0.10 1.00 + 0.05 0.124 ± 0.004 0.109 ± 0.004 0.048 ± 0.004 0.157 ± 0.004 0.039 ± 0.002 PERFORATION DIAMETER PITCH POSITION D P0 E 1.50 + 0.10 4.00 ± 0.10 1.75 ± 0.10 0.059 + 0.004 0.157 ± 0.004 0.069 ± 0.004 CARRIER TAPE WIDTH THICKNESS W t1 8.00 +0.30- 0.10 0.229 ± 0.013 0.315 +0.012- 0.004 0.009 ± 0.0005 DISTANCE BETWEEN CENTERLINE CAVITY TO PERFORATION (WIDTH DIRECTION) F 3.50 ± 0.05 0.138 ± 0.002 CAVITY TO PERFORATION (LENGTH DIRECTION) P2 2.00 ± 0.05 0.079 ± 0.002 For Outline SOT-143 P D P2 P0 E F W D1 t1 K0 9° MAX 9° MAX A0 B0 DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES) CAVITY LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER A0 B0 K0 P D1 3.19 ± 0.10 2.80 ± 0.10 1.31 ± 0.10 4.00 ± 0.10 1.00+ 0.25 0.126 ± 0.004 0.110 ± 0.004 0.052 ± 0.004 0.157 ± 0.004 0.039 + 0.010 PERFORATION DIAMETER PITCH POSITION D P0 E 1.50 + 0.10 4.00 ± 0.10 1.75 ± 0.10 0.059 + 0.004 0.157 ± 0.004 0.069 ± 0.004 CARRIER TAPE WIDTH THICKNESS W t1 8.00 +0.30- 0.10 0.254 ± 0.013 0.315+0.012- 0.004 0.0100± 0.0005 DISTANCE CAVITY TO PERFORATION (WIDTH DIRECTION) F 3.50 ± 0.05 0.138 ± 0.002 CAVITY TO PERFORATION (LENGTH DIRECTION) P2 2.00 ± 0.05 0.079 ± 0.002 9 Tape Dimensions and Product Orientation For Outlines SOT-323, -363 P P2 D P0 E F W C D1 t1 (CARRIER TAPE THICKNESS) Tt (COVER TAPE THICKNESS) K0 An A0 DESCRIPTION B0 SYMBOL SIZE (mm) SIZE (INCHES) CAVITY LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER A0 B0 K0 P D1 2.40 ± 0.10 2.40 ± 0.10 1.20 ± 0.10 4.00 ±0.10 1.00 + 0.25 0.094 ± 0.004 0.094 ± 0.004 0.047 ± 0.004 0.157 ± 0.004 0.039 + 0.010 PERFORATION DIAMETER PITCH POSITION D P0 E 1.55 ± 0.05 4.00 ± 0.10 1.75 ± 0.10 0.061 ± 0.002 0.157 ± 0.004 0.069 ± 0.004 CARRIER TAPE WIDTH THICKNESS W t1 8.00 ± 0.30 0.254 ± 0.02 0.315 ± 0.012 0.0100± 0.0008 COVER TAPE WIDTH TAPE THICKNESS C Tt 5.4 ± 0.10 0.062 ± 0.001 0.205 ± 0.004 0.0025± 0.00004 DISTANCE CAVITY TO PERFORATION (WIDTH DIRECTION) F 3.50 ± 0.05 0.138 ± 0.002 CAVITY TO PERFORATION (LENGTH DIRECTION) P2 2.00 ± 0.05 0.079 ± 0.002 FOR SOT-323 (SC70-3 LEAD) An 8° C MAX ANGLE FOR SOT-363 (SC70-6 LEAD) An 10° C MAX For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved. Obsoletes 5989-4020EN AV02-0533EN - April 14, 2010