HSMS-2814-TR1G

HSMS-281x Surface Mount RF Schottky Barrier Diodes Data Sheet Description/Applications Features These Schottky diodes are specifically designed for both analog and digital applications. This series offers a wide range of specifications and package configurations to give the designer wide flexibility. The HSMS-281x series of diodes features very low flicker (1/f) noise. • Surface Mount Packages Note that Avago’s manufacturing techniques assure that dice found in pairs and quads are taken from adjacent sites on the wafer, assuring the highest degree of match. Pin Connections and Package Marking 2 3 GUx 1 6 • Low Flicker Noise • Low FIT (Failure in Time) Rate* • Six-sigma Quality Level • Single, Dual and Quad Versions • Tape and Reel Options Available • Lead-free Option Available * For more information see the Surface Mount Schottky Reliability Data Sheet. Package Lead Code Identification, SOT-23/SOT-143 (Top View) SINGLE 3 SERIES 3 1 1 COMMON CATHODE 3 5 4 Notes: 1. Package marking provides orientation and identification. 2. See “Electrical Specifications” for appropriate package marking. Package Lead Code Identification, SOT-323 (Top View) SERIES B COMMON ANODE C COMMON CATHODE E F #0 2 UNCONNECTED PAIR 3 4 1 SINGLE COMMON ANODE 3 #5 #2 2 1 RING QUAD 3 4 2 1 #7 #3 2 1 BRIDGE QUAD 3 4 1 2 #8 2 Package Lead Code Identification, SOT-363 (Top View) HIGH ISOLATION UNCONNECTED PAIR 6 5 1 2 K UNCONNECTED TRIO 4 6 5 3 1 2 4 3 L #4 2 2 Absolute Maximum Ratings[1] TC = 25°C Symbol If PIV Tj Tstg θjc Parameter Unit SOT-23/SOT-143 SOT-323/SOT-363 Forward Current (1 µs Pulse) Peak Inverse Voltage Junction Temperature Storage Temperature Thermal Resistance[2] Amp V °C °C °C/W 1 Same as VBR 150 -65 to 150 500 1 Same as VBR 150 -65 to 150 150 Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. TC = +25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board. ESD WARNING: Handling Precautions Should Be Taken To Avoid Static Discharge. Electrical Specifications TC = 25°C, Single Diode[3] Part Number HSMS[4] Package Marking Code Lead Code 2810 2812 2813 2814 2815 2817 2818 281B 281C 281E 281F 281K B0 B2 B3 B4 B5 B7 B8 B0 B2 B3 B4 BK 0 2 3 4 5 7 8 B C E F K 281L BL L Test Conditions Configuration Single Series Common Anode Common Cathode Unconnected Pair Ring Quad[4] Bridge Quad[4] Single Series Common Anode Common Cathode High Isolation Unconnected Pair Unconnected Trio Minimum Breakdown Voltage VBR (V) Maximum Forward Voltage VF (mV) 20 410 IR = 10 mA IF = 1 mA Maximum Forward Voltage VF (V) @ IF (mA) 1.0 35 Maximum Reverse Leakage IR (nA) @ VR (V) 200 Notes: 1. ∆VF for diodes in pairs and quads in 15 mV maximum at 1 mA. 2. ∆C TO for diodes in pairs and quads is 0.2 pF maximum. 3. Effective Carrier Lifetime (τ) for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA. 4. See section titled “Quad Capacitance.” 5. R D = R S + 5.2 Ω at 25°C and I f = 5 mA. 15 Maximum Capacitance CT (pF) Typical Dynamic Resistance RD (Ω) [5] 1.2 15 VF = 0 V f = 1 MHz IF = 5 mA 3 Quad Capacitance Capacitance of Schottky diode quads is measured using an HP4271 LCR meter. This instrument effectively isolates individual diode branches from the others, allowing accurate capacitance measurement of each branch or each diode. The conditions are: 20 mV R.M.S. voltage at 1 MHz. Avago defines this measurement as “CM”, and it is equivalent to the capacitance of the diode by itself. The equivalent diagonal and adjacent capacitances can then be calculated by the formulas given below. In a quad, the diagonal capacitance is the capacitance between points A and B as shown in the figure below. The diagonal capacitance is calculated using the following formula C1 x C2 C3 x C4 CDIAGONAL = _______ + _______ C1 + C2 C3 + C4 1 CADJACENT = C1 + ____________ 1 1 1 –– + –– + –– C2 C 3 C4 A C1 C3 C2 C4 C Linear Equivalent Circuit, Diode Chip Rj RS Cj RS = series resistance (see Table of SPICE parameters) C j = junction capacitance (see Table of SPICE parameters) Rj = The equivalent adjacent capacitance is the capacitance between points A and C in the figure below. This capacitance is calculated using the following formula 8.33 X 10-5 nT Ib + Is where Ib = externally applied bias current in amps Is = saturation current (see table of SPICE parameters) T = temperature, °K n = ideality factor (see table of SPICE parameters) Note: To effectively model the packaged HSMS-281x product, please refer to Application Note AN1124. B SPICE Parameters Parameter BV CJ0 EG IBV IS N RS PB PT M Units HSMS-281x V pF eV A A 25 1.1 0.69 E-5 4.8E - 9 1.08 10 0.65 2 0.5 Ω V 4 Typical Performance, TC = 25°C (unless otherwise noted), Single Diode 100,000 1 TA = +125°C TA = +75°C TA = +25°C TA = –25°C 0 1000 100 TA = +125°C TA = +75°C TA = +25°C 10 1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 5 10 VR – REVERSE VOLTAGE (V) VF – FORWARD VOLTAGE (V) 30 IF - FORWARD CURRENT (mA) 1.25 1 0.75 0.50 0.25 0 0 2 4 6 8 10 12 14 VR – REVERSE VOLTAGE (V) Figure 4. Total Capacitance vs. Reverse Voltage. 16 IF (Left Scale) 10 ∆VF (Right Scale) 1 0.3 0.2 1 0.4 0.6 0.8 1.0 1.2 1 10 Figure 3. Dynamic Resistance vs. Forward Current. 30 10 10 I F – FORWARD CURRENT (mA) Figure 2. Reverse Current vs. Reverse Voltage at Temperatures. Figure 1. Forward Current vs. Forward Voltage at Temperatures. 100 1 0.1 15 0.3 1.4 VF - FORWARD VOLTAGE (V) Figure 5. Typical Vf Match, Pairs and Quads. ∆VF - FORWARD VOLTAGE DIFFERENCE (mV) 0.1 0.01 C T – CAPACITANCE (pF) RD – DYNAMIC RESISTANCE (Ω) 1000 10,000 10 I R – REVERSE CURRENT (nA) I F – FORWARD CURRENT (mA) 100 100 5 Applications Information Introduction — Product Selection Avago’s family of Schottky products provides unique solutions to many design problems. The first step in choosing the right product is to select the diode type. All of the products in the HSMS-282x family use the same diode chip, and the same is true of the HSMS-281x and HSMS-280x families. Each family has a different set of characteristics which can be compared most easily by consulting the SPICE parameters in Table 1. A review of these data shows that the HSMS-280x family has the highest breakdown voltage, but at the expense of a high value of series resistance (Rs). In applications which do not require high voltage the HSMS-282x family, with a lower value of series resistance, will offer higher current carrying capacity and better performance. The HSMS281x family is a hybrid Schottky (as is the HSMS-280x), offering lower 1/f or flicker noise than the HSMS-282x family. In general, the HSMS-282x family should be the designer’s first choice, with the -280x family reserved for high voltage applications and the HSMS-281x family for low flicker noise applications. Assembly Instructions SOT-323 PCB Footprint A recommended PCB pad layout for the miniature SOT-323 (SC-70) package is shown in Figure 6 (dimensions are in inches). This layout provides ample allowance for package placement by automated assembly equipment without adding parasitics that could impair the performance. 0.026 0.079 0.039 0.022 Dimensions in inches Figure 6. Recommended PCB Pad Layout for Avago’s SC70 3L/SOT-323 Products. Assembly Instructions SOT-363 PCB Footprint A recommended PCB pad layout for the miniature SOT-363 (SC-70, 6 lead) package is shown in Figure 7 (dimensions are in inches). This layout provides ample allowance for package placement by automated assembly equipment without adding parasitics that could impair the performance. 0.026 Table 1. Typical SPICE Parameters. Parameter Units HSMS-280x HSMS-281x HSMS-282x BV CJ0 EG IBV IS N RS PB (VJ) PT (XTI) M V pF eV A A 75 1.6 0.69 1 E-5 3 E-8 1.08 30 0.65 2 0.5 25 1.1 0.69 1 E-5 4.8 E-9 1.08 10 0.65 2 0.5 15 0.7 0.69 1 E-4 2.2 E-8 1.08 6.0 0.65 2 0.5 Ω V 0.079 0.039 0.018 Dimensions in inches Figure 7. Recommended PCB Pad Layout for Avago’s SC70 6L/SOT-363 Products. 6 SMT Assembly Avago’s SOT diodes have been qualified to the time-temperature profile shown in Figure 8. This profile is representative of an IR reflow type of surface mount assembly process. Reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including: method of heating (e.g., IR or vapor phase reflow, wave soldering, etc.) circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity and thermal mass of components. Components with a low mass, such as the SOT package, will reach solder reflow temperatures faster than those with a greater mass. After ramping up from room temperature, the circuit board with components attached to it (held in place with solder paste) passes through one or more preheat zones. The preheat zones increase the temperature of the board and components to prevent thermal shock and begin evaporating solvents from the solder paste. 250 TMAX TEMPERATURE (°C) 200 150 Reflow Zone 100 Preheat Zone Cool Down Zone 50 0 0 60 120 180 TIME (seconds) Figure 8. Surface Mount Assembly Profile. Part Number Ordering Information Part Number No. of Devices Container HSMS-281x-TR2* HSMS-281x-TR1* 10000 3000 13" Reel 7" Reel HSMS-281x-BLK * 100 antistatic bag x = 0, 2, 3, 4, 5, 7, 8, B, C, E, F, K, L For lead-free option, the part number will have the character "G" at the end, eg. HSMS-281x-TR2G for a 10,000 lead-free reel. 240 300 The reflow zone briefly elevates the temperature sufficiently to produce a reflow of the solder. The rates of change of temperature for the ramp-up and cooldown zones are chosen to be low enough to not cause deformation of the board or damage to components due to thermal shock. The maximum temperature in the reflow zone (TMAX) should not exceed 235°C. These parameters are typical for a surface mount assembly process for Avago diodes. As a general guideline, the circuit board and components should be exposed only to the minimum temperatures and times necessary to achieve a uniform reflow of solder. 7 Package Dimensions Outline 23 (SOT-23) Outline SOT-323 (SC-70 3 Lead) e2 e1 e1 E E E1 XXX E1 XXX e e L L B B C D C DIMENSIONS (mm) DIMENSIONS (mm) D A A1 Notes: XXX-package marking Drawings are not to scale SYMBOL A A1 B C D E1 e e1 e2 E L MIN. 0.79 0.000 0.37 0.086 2.73 1.15 0.89 1.78 0.45 2.10 0.45 MAX. 1.20 0.100 0.54 0.152 3.13 1.50 1.02 2.04 0.60 2.70 0.69 Outline 143 (SOT-143) A A1 Notes: XXX-package marking Drawings are not to scale SYMBOL A A1 B C D E1 e e1 E L MIN. MAX. 0.80 1.00 0.00 0.10 0.15 0.40 0.10 0.20 1.80 2.25 1.10 1.40 0.65 typical 1.30 typical 1.80 2.40 0.425 typical Outline SOT-363 (SC-70 6 Lead) e2 DIMENSIONS (mm) e1 B1 E HE SYMBOL E D HE A A2 A1 Q1 e b c L E E1 XXX e L B e C DIMENSIONS (mm) D A A1 Notes: XXX-package marking Drawings are not to scale D MIN. MAX. 1.15 1.35 1.80 2.25 1.80 2.40 0.80 1.10 0.80 1.00 0.00 0.10 0.10 0.40 0.650 BCS 0.15 0.30 0.10 0.20 0.10 0.30 SYMBOL A A1 B B1 C D E1 e e1 e2 E L MIN. 0.79 0.013 0.36 0.76 0.086 2.80 1.20 0.89 1.78 0.45 2.10 0.45 MAX. 1.097 0.10 0.54 0.92 0.152 3.06 1.40 1.02 2.04 0.60 2.65 0.69 Q1 A1 A2 b c A L 8 For Outlines SOT-23, -323 Device Orientation REEL TOP VIEW END VIEW 4 mm CARRIER TAPE 8 mm USER FEED DIRECTION ABC ABC ABC Note: "AB" represents package marking code. "C" represents date code. COVER TAPE For Outline SOT-143 For Outline SOT-363 TOP VIEW END VIEW TOP VIEW 4 mm END VIEW 4 mm ABC ABC ABC ABC 8 mm ABC Note: "AB" represents package marking code. "C" represents date code. 8 mm ABC ABC ABC ABC Note: "AB" represents package marking code. "C" represents date code. 9 Tape Dimensions and Product Orientation For Outline SOT-23 P P2 D E P0 F W D1 t1 Ko 9° MAX 13.5° MAX 8° MAX B0 A0 DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES) CAVITY LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER A0 B0 K0 P D1 3.15 ± 0.10 2.77 ± 0.10 1.22 ± 0.10 4.00 ± 0.10 1.00 + 0.05 0.124 ± 0.004 0.109 ± 0.004 0.048 ± 0.004 0.157 ± 0.004 0.039 ± 0.002 PERFORATION DIAMETER PITCH POSITION D P0 E 1.50 + 0.10 4.00 ± 0.10 1.75 ± 0.10 0.059 + 0.004 0.157 ± 0.004 0.069 ± 0.004 CARRIER TAPE WIDTH THICKNESS W t1 8.00 +0.30 –0.10 0.229 ± 0.013 0.315 +0.012 –0.004 0.009 ± 0.0005 DISTANCE BETWEEN CENTERLINE CAVITY TO PERFORATION (WIDTH DIRECTION) F 3.50 ± 0.05 0.138 ± 0.002 CAVITY TO PERFORATION (LENGTH DIRECTION) P2 2.00 ± 0.05 0.079 ± 0.002 For Outline SOT-143 P D P2 P0 E F W D1 t1 K0 9° MAX 9° MAX A0 B0 DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES) CAVITY LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER A0 B0 K0 P D1 3.19 ± 0.10 2.80 ± 0.10 1.31 ± 0.10 4.00 ± 0.10 1.00 + 0.25 0.126 ± 0.004 0.110 ± 0.004 0.052 ± 0.004 0.157 ± 0.004 0.039 + 0.010 PERFORATION DIAMETER PITCH POSITION D P0 E 1.50 + 0.10 4.00 ± 0.10 1.75 ± 0.10 0.059 + 0.004 0.157 ± 0.004 0.069 ± 0.004 CARRIER TAPE WIDTH THICKNESS W t1 8.00 +0.30 –0.10 0.254 ± 0.013 0.315+0.012 –0.004 0.0100 ± 0.0005 DISTANCE CAVITY TO PERFORATION (WIDTH DIRECTION) F 3.50 ± 0.05 0.138 ± 0.002 CAVITY TO PERFORATION (LENGTH DIRECTION) P2 2.00 ± 0.05 0.079 ± 0.002 Tape Dimensions and Product Orientation For Outlines SOT-323, -363 P P2 D P0 E F W C D1 t1 (CARRIER TAPE THICKNESS) Tt (COVER TAPE THICKNESS) K0 An A0 DESCRIPTION B0 SYMBOL SIZE (mm) SIZE (INCHES) CAVITY LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER A0 B0 K0 P D1 2.40 ± 0.10 2.40 ± 0.10 1.20 ± 0.10 4.00 ± 0.10 1.00 + 0.25 0.094 ± 0.004 0.094 ± 0.004 0.047 ± 0.004 0.157 ± 0.004 0.039 + 0.010 PERFORATION DIAMETER PITCH POSITION D P0 E 1.55 ± 0.05 4.00 ± 0.10 1.75 ± 0.10 0.061 ± 0.002 0.157 ± 0.004 0.069 ± 0.004 CARRIER TAPE WIDTH THICKNESS W t1 8.00 ± 0.30 0.254 ± 0.02 0.315 ± 0.012 0.0100 ± 0.0008 COVER TAPE WIDTH TAPE THICKNESS C Tt 5.4 ± 0.10 0.062 ± 0.001 0.205 ± 0.004 0.0025 ± 0.00004 DISTANCE CAVITY TO PERFORATION (WIDTH DIRECTION) F 3.50 ± 0.05 0.138 ± 0.002 CAVITY TO PERFORATION (LENGTH DIRECTION) P2 2.00 ± 0.05 0.079 ± 0.002 FOR SOT-323 (SC70-3 LEAD) An 8°C MAX ANGLE FOR SOT-363 (SC70-6 LEAD) An 10°C MAX For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies, Limited. All rights reserved. Obsoletes 5989-2493EN 5989-4021EN August 14, 2006