HSMS-A100-K30J2

HSMx-A10x-xxxxx PLCC-2, Surface Mount LED Indicator Data Sheet Description Features This family of SMT LEDs is packaged in the industry standard PLCC-2 package. These SMT LEDs have high reliability performance and are designed to work under a wide range of environmental conditions. This high reliability feature makes them ideally suited to be used under harsh interior automotive as well as interior signs application conditions. • Industry standard PLCC-2 package To facilitate easy pick & place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel will be shipped in single intensity and color bin, except red color, to provide close uniformity. • Available in 8 mm carrier tape on 7 inch reel (2000 pieces) These LEDs are compatible with IR solder reflow process. Due to the high reliability feature of these products, they can also be mounted using through-the-wave soldering process. The super wide viewing angle at 120˚ makes these LEDs ideally suited for panel, push button, or general backlighting in automotive interior, office equipment, industrial equipment, and home appliances. The flat top emitting surface makes it easy for these LEDs to mate with light pipes. With the built-in reflector pushing up the intensity of the light output, these LEDs are also suitable to be used as LED pixels in interior electronic signs. • High reliability LED package • High brightness using AlInGaP and InGaN dice technologies • Available in full selection of colors • Super wide viewing angle at 120˚ • Compatible with both IR and TTW soldering process Applications • Interior automotive – Instrument panel backlighting – Central console backlighting – Cabin backlighting • Electronic signs and signals – Interior full color sign – Variable message sign • Office automation, home appliances, industrial equipment – Front panel backlighting – Push button backlighting – Display backlighting CAUTION: HSMN,M,K and E-A10x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details. Package Dimensions 2.8 ± 0.2 2.2 ± 0.2 3.2 ± 0.2 1.9 ± 0.2 0.1 TYP. 0.8 ± 0.1 3.5 ± 0.2 0.8 ± 0.3 0.5 ± 0.1 CATHODE MARKING (ANODE MARKING FOR AlGaAs DEVICES) TOP MOUNT 2.8 ± 0.2 2.2 ± 0.2 1.9 ± 0.2 5.2 ± 0.2 3.2 ± 0.2 0.1 TYP. CATHODE MARKING 0.5 ± 0.1 REVERSE MOUNT NOTE: ALL DIMENSIONS IN MILLIMETERS. 2 Table 1. Device Selection Guide Red Part Number Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology HSMS-A100-J00J1 4.50 15.00 - 20 GaP HSMS-A100-L00J1 11.20 15.00 - 20 GaP HSMS-A100-J80J2 5.60 - 14.00 10 GaP HSMH-A100-L00J1 11.20 15.00 - 20 AlGaAs HSMH-A100-N00J1 28.50 50.00 - 20 AlGaAs HSMC-A100-Q00J1 71.50 100.00 - 20 AlInGaP HSMC-A100-R00J1 112.50 140.00 - 20 AlInGaP HSMC-A101-S00J1 180.00 220.00 - 20 AlInGaP HSMZ-A100-T00J1 285.00 350.00 - 20 AlInGaP Red Orange Part Number Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology HSMJ-A100-Q00J1 71.50 100.00 - 20 AlInGaP HSMJ-A101-S00J1 180.00 200.00 - 20 AlInGaP HSMJ-A100-T40J1 285.00 - 715.00 20 AlInGaP HSMV-A100-T00J1 285.00 350.00 - 20 AlInGaP HSMJ-A100-R40J1 112.50 - 285.00 20 AlInGaP Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology HSMD-A100-J00J1 4.50 15.00 - 20 GaP HSMD-A100-L00J1 11.20 15.00 - 20 GaP HSMD-A100-K4PJ2 7.20 - 18.00 10 GaP HSML-A100-Q00J1 71.50 100.00 - 20 AlInGaP HSML-A101-S00J1 180.00 220.00 - 20 AlInGaP Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology HSMY-A100-J00J1 4.50 12.00 - 20 GaP HSMY-A100-L00J1 11.20 12.00 - 20 GaP HSMA-A100-Q00J1 71.50 100.00 - 20 AlInGaP HSMA-A101-S00J1 180.00 220.00 - 20 AlInGaP HSMU-A100-S00J1 180.00 320.00 - 20 AlInGaP HSMA-A101-R8WJ1 140.00 - 355.00 20 AlInGaP Orange Part Number Yellow / Amber Part Number 3 Table 1. Device Selection Guide (Cont.) Yellow Green Part Number Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology HSMG-A100-J02J1 4.50 HSMG-A100-K72J2 9.00 18.00 - 20 GaP - 18.00 10 GaP HSME-A100-M02J1 18.00 70.00 - 20 AlInGaP HSME-A100-N82J1 35.50 - 90.00 20 AlInGaP Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology HSMG-A100-H01J1 2.80 8.00 - 20 GaP HSME-A100-L01J1 11.20 40.00 - 20 AlInGaP HSME-A100-M3PJ1 18.00 - 35.50 20 AlInGaP Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology HSMM-A101-R00J1 112.50 200.00 - 20 InGaN HSMM-A100-S00J1 180.00 350.00 - 20 InGaN HSMM-A100-U4PJ1 450.00 - 1125.00 20 InGaN Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology HSMN-A101-N00J1 28.50 50.00 - 20 InGaN HSMN-A100-P00J1 45.00 70.00 - 20 InGaN HSMN-A100-R4YJ1 112.50 - 285.00 20 InGaN HSMN-A100-S4YJ1 180.00 - 450.00 20 InGaN HSMN-A100-R8YJ1 140.00 - 355.00 20 InGaN Emerald Green Part Number Green Part Number Blue Part Number 4 Part Numbering System HSM x 1 - A x 2 x 3 x 4 - x 5 x 6 x 7 x 8 x 9 Packaging Option Color Bin Selection Intensity Bin Select Device Specific Configuration Package Type LED Chip Color Absolute Maximum Ratings (TA = 25°C) Parameters DC Forward Current [1] Peak Forward Current [2] Power Dissipation Reverse Voltage Junction Temperature HSMS/D/Y/G HSMH HSMC/J/L/A HSME HSMZ/V/U HSMM/N 30 mA 30 mA 30 mA [3,4] 20 mA [4] 30 mA [3,4] 30 mA 100 mA 100 mA 100 mA 100 mA 100 mA 100 mA 63 mW 60 mW 63 mW 48 mW 63 mW 114 mW 5V 110°C Operating Temperature –55°C to +100°C Storage Temperature –55°C to +100°C Notes: 1. Derate linearly as shown in Figure 4. 2. Duty factor = 10%, Frequency = 1 kHz. 3. Drive current between 10 mA and 30 mA is recommended for best long term performance. 4. Operation at current below 5 mA is not recommended. 5 Optical Characteristics (TA = 25˚C) Color Part Number Red Dice Technology Peak Wavelength λPEAK (nm) Typ. Dominant Wavelength [1] λD (nm) Typ. Viewing Angle 2 θ1/2 [2] (Degrees) Typ. Luminous Efficacy ηv [3] (lm/W) Typ. Luminous Intensity/ Total Flux Iv(mcd)/Φv(mlm) Typ. HSMS-A100 GaP 635 626 120 120 0.45 HSMH-A100 AlGaAs 645 637 120 63 0.45 HSMC-A10x AlInGaP 635 626 120 150 0.45 HSMZ-A100 AlInGaP 635 626 120 155 0.45 Red HSMJ-A10x AlInGaP 621 615 120 240 0.45 Orange HSMV-A100 AlInGaP 623 617 120 263 0.45 Orange HSMD-A100 GaP 600 602 120 380 0.45 HSML-A10x AlInGaP 609 605 120 320 0.45 HSMY-A100 GaP 583 585 120 520 0.45 HSMA-A10x AlInGaP 592 590 120 480 0.45 Amber HSMU-A100 AlInGaP 594 592 120 500 0.45 Yellow HSMG-A100 GaP 565 569 120 590 0.45 Green HSME-A100 AlInGaP 575 570 120 560 0.45 Emerald HSMG-A100 GaP 558 560 120 650 0.45 Green HSME-A100 AlInGaP 566 560 120 610 0.45 Green HSMM-A10x InGaN 523 525 120 500 0.45 Blue HSMN-A10x InGaN 468 470 120 75 0.45 Notes: 1. The dominant wavelength, λD, is derived from the CIE Chromaticity Diagram and represents the color of the device. 2. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 3. Radiant intensity, Ie in watts/steradian, may be calculated from the equation Ie = Iv/ηv, where Iv is the luminous intensity in candelas and ηv is the luminous efficacy in lumens/watt. Electrical Characteristics (TA = 25˚C) Forward Voltage VF (Volts) @ IF = 20 mA Part Number Typ. Max. Reverse Voltage VR @ 100 μA Min. HSMS/D/Y/G 2.2 2.6 5 — 180 HSMH 1.9 2.6 5 — 180 HSMC/J/L/A/E 1.9 2.4 5 — 280 HSMZ/V/U 1.9 2.4 5 — 280 HSMM/N 3.4 4.05 — 5 280 6 Reverse Voltage VR @ 10 μA Min. Thermal Resistance RθJP (°C/W) 1.0 0.8 GREEN 0.7 RELATIVE INTENSITY EMERALD GREEN YELLOW GREEN BLUE 0.9 AMBER 0.6 0.5 ORANGE 0.4 RED ORANGE RED 0.3 0.2 0.1 0 380 480 430 1.0 580 630 WAVELENGTH – nm 680 730 780 GaP EMERALD GREEN 0.8 RELATIVE INTENSITY 530 GaP YELLOW GREEN 0.6 GaP YELLOW GaP ORANGE 0.4 GaP RED 0.2 0 380 480 430 530 580 630 WAVELENGTH – nm 680 730 780 Figure 1. Relative intensity vs. wavelength. 35 1.8 HSMS/D/Y/G RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) FORWARD CURRENT – mA 30 1.6 25 20 HSMH 15 HSMC/J/L/A/E/Z/V/U HSMM/N 10 5 0 1 0 2 3 FORWARD VOLTAGE – V 4 0.8 0.6 0.4 0 5 10 20 25 15 DC FORWARD CURRENT – mA 35 30 Figure 3. Relative intensity vs. forward current. 35 30 30 HSMS/D/G/ Y/H/Z/V/U 25 HSMC/J/L/A 20 HSME 15 HSMM/N 20 10 5 5 20 40 60 80 TEMPERATURE (°C) 100 120 Figure 4. Maximum forward current vs. ambient temperature. Derated based on TJMAX = 110˚C, RθJA = 500˚C/W. HSME HSMM/N 15 10 0 HSMS/D/G/Y/H HSMC/J/L/A HSMZ/V/U 25 CURRENT - mA CURRENT - mA InGaN 1.0 0 5 35 7 1.2 Gap 0.2 Figure 2. Forward current vs. forward voltage. 0 AlInGaP AlGaAs 1.4 0 0 20 40 60 80 TEMPERATURE (°C) 100 120 Figure 4b. Maximum Forward Current Vs. Solder Point Temperature. Derated based on TJMAX = 110°C, RθJP = 180°C/W or 280°C/W. 540 0.5 GREEN 520 DELTA VF (NORMALIZED AT 25°C) DOMINANT WAVELENGTH – nm 530 510 CYAN 500 490 480 BLUE 470 460 0 5 10 20 15 CURRENT – mA 25 0.3 0.2 0.1 0 GaP/AlGaAs/ AlInGaP -0.1 -0.2 -0.3 -100 35 30 0.4 Figure 5. Dominant wavelength vs. forward current – InGaN devices. InGaN/GaN 0 50 TEMPERATURE – °C -50 100 150 Figure 6. Forward voltage shift vs. temperature. 1.0 NORMALIZED INTENSITY 0.8 0.6 0.4 0.2 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGULAR DISPLACEMENT – DEGREES Figure 7. Radiation Pattern. LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE 250 217 C 200 C 200 255 - 260 C 3 C/SEC. MAX. 6 C/SEC. MAX. 150 C TEMPERATURE – C TEMPERATURE 10 to 30 SEC. 150 FLUXING 100 3 C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. (Acc. to J-STD-020C) Figure 8. Recommended Pb-free reflow soldering profile. Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components. Reflow soldering must not be done more than 2 times. Do observe necessary precautions of handling moisture sensitive device as stated in below section. BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD PREHEAT 0 TIME 8 50 30 10 20 30 60 40 50 TIME – SECONDS 70 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150C (100C PCB) SOLDER WAVE TEMPERATURE = 245C AIR KNIFE AIR TEMPERATURE = 390C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 LEADED SOLDER: SN63; FLUX: RMA LEAD-FREE SOLDER: 96.5 wt% SN, 3 wt% Ag, 0.5 wt% Cu NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. Figure 9. Recommended wave soldering profile. 80 90 100 4.50 1.50 2.60 SOLDER RESIST Figure 10. Recommended soldering pad pattern TRAILER COMPONENT LEADER 480 mm MIN. FOR Ø180 REEL. 960 mm MIN. FOR Ø330 REEL. 200 mm MIN. FOR Ø180 REEL. 200 mm MIN. FOR Ø330 REEL. C A USER FEED DIRECTION Figure 11. Tape leader and trailer dimensions 4 ± 0.1 4 ± 0.1 2 ± 0.05 2.29 ± 0.1 1.75 ± 0.1 +0.1 Ø 1.5 –0 C 3.5 ± 0.05 +0.3 8 –0.1 3.81 ± 0.1 A 3.05 ± 0.1 +0.1 Ø1 –0 8° 0.229 ± 0.01 Figure 12. Tape dimensions 9 2 +0.5 –0 Ø 20.5 ± 0.3 62.5 180 +0 –2.5 Ø 13 ± 0.2 +1.50 8.4 –0.00 (MEASURED AT OUTER EDGE) 14.4 (MAX. MEASURED AT HUB) LABEL AREA (111 mm x 57 mm) WITH DEPRESSION (0.25 mm) 7.9 (MIN.) 10.9 (MAX.) Figure 13. Reel dimensions. USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 14. Reeling orientation. 10 Intensity Bin Select (X5X6) Intensity Bin Limits Individual reel will contain parts from one half bin only. X5 Min Iv Bin Bin ID X6 Min. (mcd) Max. (mcd) G1 1.80 2.24 G2 2.24 2.80 H1 2.80 3.55 H2 3.55 4.50 0 Full Distribution J1 4.50 5.60 2 2 half bins starting from X51 J2 5.60 7.20 3 3 half bins starting from X51 K1 7.20 9.00 4 4 half bins starting from X51 K2 9.00 11.20 5 5 half bins starting from X51 L1 11.20 14.00 6 2 half bins starting from X52 L2 14.00 18.00 7 3 half bins starting from X52 M1 18.00 22.40 8 4 half bins starting from X52 M2 22.40 28.50 9 5 half bins starting from X52 N1 28.50 35.50 N2 35.50 45.00 P1 45.00 56.00 P2 56.00 71.50 Q1 71.50 90.00 Q2 90.00 112.50 R1 112.50 140.00 R2 140.00 180.00 S1 180.00 224.00 S2 224.00 285.00 T1 285.00 355.00 T2 355.00 450.00 U1 450.00 560.00 U2 560.00 715.00 V1 715.00 900.00 V2 900.00 1125.00 W1 1125.00 1400.00 W2 1400.00 1800.00 X1 1800.00 2240.00 X2 2240.00 2850.00 Tolerance of each bin limit = ± 12% 11 Color Bin Select (X7) Individual reel will contain parts from one full bin only. X7 Color Bin Limits Blue Color Bin Limits Min. (nm) Max. (nm) Amber Min. (nm) Max. (nm) A 460.0 465.0 A 582.0 584.5 B 465.0 470.0 B 584.5 587.0 0 Full Distribution C 470.0 475.0 C 587.0 589.5 Z A and B only D 475.0 480.0 D 589.5 592.0 Y B and C only E 592.0 594.5 W C and D only F 594.5 597.0 Cyan Min. (nm) Max. (nm) V D and E only U E and F only A 490.0 495.0 T F and G only B 495.0 500.0 Orange Min. (nm) Max. (nm) S G and H only C 500.0 505.0 A 597.0 600.0 Q A, B, and C only D 505.0 510.0 B 600.0 603.0 C 603.0 606.0 D 606.0 609.0 E 609.0 612.0 P B, C, and D only N C, D, and E only M D, E, and F only L E, F, and G only K F, G, and H only 1 A, B, C, and D only 2 E, F, G, and H only 3 B, C, D, and E only 4 C, D, E, and F only Max. (nm) A, B, C, D, and E only Emerald Green Min. (nm) 5 6 B, C, D, E, and F only A 552.5 555.5 B 555.5 558.5 C 558.5 561.5 D 561.5 564.5 Yellow Green Min. (nm) Max. (nm) E 564.5 567.5 F 567.5 570.5 G 570.5 573.5 H 573.5 576.5 12 Green Min. (nm) Max. (nm) A 515.0 520.0 B 520.0 525.0 C 525.0 530.0 Red Orange Min. (nm) Max. (nm) D 530.0 535.0 A 611.0 616.0 B 616.0 620.0 Red Min. (nm) Max. (nm) Full Distribution Tolerance of each bin limit = ± 1 nm. Moisture Sensitivity Packaging Option (X8X9) Option Test Current Package Type Reel Size J1 20 mA Top Mount 7 inch J4 20 mA Top Mount 13 inch H1 20 mA Reverse Mount 7 inch H4 20 mA Reverse Mount 13 inch J2 10 mA Top Mount 7 inch J5 10 mA Top Mount 13 inch H2 10 mA Reverse Mount 7 inch H5 10 mA Reverse Mount 13 inch L2 2 mA Top Mount 7 inch This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use - Unopen moisture barrier bag (MBB) can be stored at