HSMW-A400-U00M2

HSMW-A400-xxxxx Surface Mount LED Indicator Data Sheet Description Features The Avago Technologies PLCC-4 family of SMT LEDs is packaged in the industry standard PLCC-4 Package and is a extension of our PLCC-2 SMT LEDs. The product is able to dissipate heat more efficiently compared to the conventional PLCC-2 SMT LEDs. In proportion to the increase in driving current, this family of LEDs is able to produce higher light output compared to the conventional PLCC-2 SMT LEDs. • Industry Standard PLCC-4 These SMT LEDs have higher reliability and better performance and are designed to work under a wide range of environment conditions. This higher reliability makes them suitable for use in harsh conditions such as the Interior Automotive, Electronics Signs and Signals and Office automation and Industrial applications. The wide viewing angle at 120° makes these LEDs ideally suited for panel, push button, or general backlighting in automotive interior, office equipment, industrial equipment, and home appliances. The flat top emitting surface makes it easy for these LEDs to mate with light pipes. With the built-in reflector pushing up the intensity of the light output, these LEDs are also suitable to be used as LED pixels in interior electronic signs. These super high brightness LEDs can be used in localized area ambience lighting in applications such as vanity mirror light, cabin light, and car door puddle light. The white color backlighting is suitable to backlight color LCD screens in applications such as GPS (global positioning system) screens in cars. To facilitate easy pick and place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel will be shipped in single intensity and color bin, to provide close uniformity. • High reliability LED package • High brightness using InGaN dice technologies • High optical efficiency • Wide viewing angle at 120° • Available in 8mm carrier tape on 7-inch reel • Tight White color Binning • Compatible with both Reflow and TTW soldering process Applications • Interior automotive - Instrument panel backlighting - Central console backlighting - Cabin lighting - Navigation and audio system - Dome lighting - Push button backlighting • Electronic signs and signals - Variable message sign - Garden lighting • Office automation, home appliances, industrial equipment - Front panel backlighting - Push button backlighting These LEDs are compatible with IR solder reflow process. Due to the high reliability feature of these products, they can also be mounted using through-the-wave soldering process. CAUTION: HSMW-A40x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details Package Dimensions 2.8 ± 0.2 1.9 ± 0.2 2.2 ± 0.2 A 0.1 TYP. 0.8 ± 0.1 C 3.2 ± 0.2 3.5 ± 0.2 0.8 ± 0.3 C C 0.5 ± 0.1 0.7 ± 0.1 CATHODE MARKING NOTE: ALL DIMENSIONS IN mm. Device Selection Guide Color Part Number Min. IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology White HSMW-A400-U00M2 450.00 700.00 - 30 InGaN Notes: 1. The luminous intensity IV, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned with this axis. 2. IV tolerance = ±12 %. Absolute Maximum Ratings (TA=25°C) Parameters HSMW DC Forward Current [1] 30 mA Peak Forward Current [2] 100 mA Power Dissipation 114 mW Reverse Voltage 5V Junction Temperature 110 °C Operating Temperature - 40 °C to + 100 °C Storage Temperature - 40 °C to + 100 °C Notes: 1. Derate linearly as shown in Figure 3 2. Duty factor = 10%, Frequency = 1kHz  Optical Characteristics (TA = 25 °C) Color Part Number Dice Technology White HSMW-A400 InGaN Typical Chromaticity Coordinates [1] Viewing Angle 2q½ [2] (Degrees) Luminous Efficiency he (lm/W) Total Flux / Luminous Intensity FV (lm) / IV (cd) x y Typ. Typ. Typ. 0.31 0.31 120 18 2.4 Notes: 1. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device. 2. θ½ is the off-axis angle where the luminous intensity is ½ the peak intensity. Electrical Characteristics (TA = 25 °C) Forward VoltageVF (Volts) @ IF =30 mA Reverse Voltage VR @ 10 mA Part Number Typ. Max. Min. HSMW 3.8 4.6 5 35 1.2 1.0 25 RELATIVE INTENSITY FORWARD CURRENT (mA) 30 20 15 10 0.6 0.4 0.2 5 0 0.8 0 0.5 1 1.5 2 2.5 3 FORWARD VOLTAGE (V) 3.5 4 0 4.5 Figure 1. Forward Current Vs. Forward Voltage. 10 15 20 CURRENT (mA) 25 30 35 1.0 0.9 Rθ JA = 300°C/W 0.8 30 RELATIVE INTENSITY MAXIMUM FORWARD CURRENT - mA 5 Figure 2. Relative Intensity Vs. Forward Current 40 Rθ JA = 350°C/W 20 Rθ JA = 470°C/W 10 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 20 40 60 80 AMBIENT TEMPERATURE - °C Figure 4. Radiation Pattern  0 100 120 0 -90 -60 -30 0 30 ANGLE (DEGREE) 60 90 Figure 3. Maximum Forward Current Vs. Ambient Temperature. Derated Based on TJMAX = 110°C. 10 to 20 SEC. 217 ˚C TEMPERATURE 240 ˚C MAX. 3˚C/SEC. MAX. 100-150 ˚C TEMPERATURE 20 SEC. MAX. 183 ˚C - 6˚C/SEC. MAX. 3˚C/SEC. MAX. 120 SEC. MAX. 255 ˚C +5 ˚C -0 ˚C 3 ˚C/SEC. MAX. 125 ˚C ± 25 ˚C 6 ˚C/SEC. MAX. MAX. 120 SEC. 60 to 150 SEC. 60-150 SEC. TIME TIME * THE TIME FROM 25 ˚C TO PEAK TEMPERATURE = 6 MINUTES MAX. Figure 5b. Recommended Pb-free Reflow Soldering Profile. Figure 5a. Recommended SnPb Reflow Soldering Profile. TURBULENT WAVE TEMPERATURE - C 250 BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD 200 150 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150C (100C PCB) SOLDER WAVE TEMPERATURE = 245 C AIR KNIFE AIR TEMPERATURE = 390 C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA FLUXING 100 50 30 NOTE: ALLOW FOR BOARDS TO BE SUFFICENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 01 0 20 30 40 50 60 TIME - SECONDS Figure 6. Recommended Wave Soldering Profile.  LAMINAR WAVE HOT AIR KNIFE 70 80 90 100 X 2.60 (0.103) X 0.40 (0.016) 1.10 (0.043) 0.50 (0.020) Y 4.50 (0.178) 1.50 (0.059) Y DIMENSIONS IN mm (INCHES). SOLDER RESIST REPRESENTS ELECTRICAL CONNECTIVITY BETWEEN PADS Figure 7a. Recommended Soldering Pad Pattern. X X 0.5 (0.020) 6.1 (0.240) 2.8 (0.110) Y 2.0 (0.079) 6.0 (0.236) 3.0 (0.118) Y DIMENSIONS IN mm (INCHES). Thermal Resistance Solder Pad Area (xy) 300 C/W >16 mm2 350 C/W >12 mm2 470 C/W >8 mm2 Figure 7b. Recommended soldering pad pattern (TTW).  1.0 (0.039) 2.0 (0.079) SOLDER RESIST REPRESENTS ELECTRICAL CONNECTIVITY BETWEEN PADS TRAILER COMPONENT LEADER 200 mm MIN. FOR ∅ 180 REEL. 200 mm MIN. FOR ∅ 330 REEL. 480 mm MIN. FOR ∅ 180 REEL. 960 mm MIN. FOR ∅ 330 REEL. C A USER FEED DIRECTION Figure 8. Tape leader and trailer dimensions. Ø1.5 4 ± 0.1 4 ± 0.1 +0.1 –0 2 ± 0.05 1.75 ± 0.1 2.29 ± 0.1 3.5 ± 0.05 8 +0.3 –0.1 3.05 ± 0.1 +0.1 Ø1 –0 Figure 9. Tape Dimensions. USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 10. Reeling Orientation.  C C A 3.8 ± 0.1 0.229 ± 0.01 8° ALL DIMENSIONS IN mm. C Moisture Sensitivity This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use - Unopen moisture barrier bag (MBB) can be stored at