HSMW-B191/C191, HSMW-B197/C197,
HSMW-B120/C120, HSMW-C130 and HSMW-B265/C265
Surface Mount LED Indicator
Reliability Data Sheet
Description
Failure Rate Prediction
The following cumulative test results have been
obtained from testing performed at Agilent
Technologies in accordance with the latest revision of
MIL-STD-883. Agilent tests parts at the absolute
maximum rated conditions recommended for the
device. The actual performance you obtain from
Agilent parts depends on the electrical and
environmental characteristic of your application but
will probably be better than the performance outlined
in Table 1.
The failure rate of semiconductor devices is determined
by the junction temperature of the device. The
relationship between ambient temperature and actual
junction temperature is given by the following:
TJ(°C) = TA(°C) + θJA PAVG
Where
TA =
ambient temperature in (°C)
θJA =
thermal resistance of junction-to ambient in
°C/watt
PAVG = average power dissipated in watts
The estimated MTBF and failure rate at temperatures
lower than the actual stress temperature can be
determined by using an e Arrhenius model for
temperature acceleration. Results of such calculations
are shown on the following page using an activation
energy of 0.43eV (reference MIL-HDBK-217)
Table 1. Life Tests
Demonstrated Performance
Point Typical Performance
Colors
Stress Test
Conditions
Total Device
Hrs.
Units
Tested
Units
Failed
MTBF
Failure Rate
(%/1K Hours)
White and Bluish
white
TA = 25°C
IF = 20 mA
196,000
392
0
196,000
≤0.51%
White and Bluish
white
TA = 55°C
IF = 20 mA
182,000
364
0
182,000
≤0.55%
White and Bluish
white
TA = 40°C
IF = 20 mA
168,000
336
0
168,000
≤0.60%
Table 2. Failure Rate Prediction ( IF = 20mA)
Demonstrated Performance
Point Typical Performance in
Time [1] (60% Confidence)
Ambient
Junction
Temperature (°C) Temperature (°C)
MTBF
85
96
75
Performance in Time [2]
(90% Confidence)
Failure Rate
(%/1K Hours)
MTBF [2]
Failure Rate
(%/1K Hours)
216.700
0.46
86,300
1.16
97
210,500
0.48
83,800
1.19
65
97
204,400
0.49
81,400
1.23
55
98
198,600
0.50
79,000
1.27
[1]
45
88
288,100
0.35
114,700
0.87
35
78
427,000
0.23
170,000
0.59
25
68
647,500
0.15
257,800
0.39
Notes:
1. The point typical MTBF (which represents 60% confidence level) is the total device hours divided by the number of failures. In the case of
zero failures, one failure is assumed for this calculation.
2. The 90% Confidence MTBF represents the minimum level of reliability performance which is expected from 90% of all samples. This
confidence interval is based on the statistics of the distribution of failures. The assumed distribution of failures is exponential. This
particular distribution is commonly used in describing useful life failures. Refer to MIL-STD-690B for details on this methodology.
3. A failure is any LED which does not emit light .
Example of Failure Rate Calculation
Assume a device operating 8 hours/day, 5 days/week. The utilization factor, given 168 hours/week is:
(8 hours/day) x (5 days/week) / (168 hours/week) = 0.25
The point failure rate per year (8760 hours) at 25o C ambient temperature is:
(0.15 % / 1K hours) x 0.25 X (8760 hours/year) = 0.33 % per year
Similarly, 90% confidence level failure rate per year at 25o C:
(0.39 % / 1K hours) X 0.25 X (8760 hours/year) = 0.85 % per year
Table 3. Environmental Tests
Units
Tested
Units
Failed
-40°C to 85°C, 15 min.
dwell 5 min. transfer
air to air storage
100 cycles
11,192
0
JESD22-B102
8 hours aging and solder dip at
245°C for 5 seconds
10
0
Low Temperature Storage
JESD22-A103
-40°C
1000hrs
364
0
Humidity Storage
JESD22-A101
60°C/90% RH, 1000hrs
840
0
Humidity forward bias
JESD22-A101
60°C/90% RH, 10 mA 500hrs
56
0
Test Name
Reference
Test Conditions
Temperature Cycle
JESD22-A104
Solderability
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved.
AV01-0468EN - September 14, 2006
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