HSMW-Bxxx
Bluish White ChipLEDs
Data Sheet
HSMW-B191, HSMW-B265, HSMW-B197,
HSMW-B120
Description
Features
These pastel ChipLEDs come in unique shades of
white and provide product differentiation for backlighting applications. They are designed in industry
standard packages for ease of handling and use.
• Unique pastel white colors
• Small size
• Industry standard footprint
• Compatible with IR soldering
These chipLEDs come in either top emitting
packages (HSMW-B191, 265 & 197) or in a side
emitting package (HSMW-B120).
The packages are compatible with IR reflow
soldering processes and comes in 8 mm tape on 7"
diameter reels. They are compatible with automatic
placement equipment.
In order to facilitate pick and place operation, these
chipLEDs are shipped in tape and reel with 4000
units per reel for HSMW-B191, 197, and 120
packages, and 3000 units per reel for HSMW-B265
packages.
• Compatible with automatic placement equipment
• Operating temperature range -30˚C to +85˚C
• Come in 8 mm tape on 7" diameter reels
Applications
• LCD backlighting
• Keypad backlighting
• Pushbutton backlighting
• Symbol backlighting
CAUTION: HSMW-Bxxx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe
appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.
Package Dimensions
CATHODE
MARK
LED DIE
CATHODE
MARK
LED DIE
0.8 (0.031)
1.25 (0.049)
0.4 (0.016)
1.6
(0.063 )
3.4 (0.134 )
1.0
(0.039)
POLARITY
0.3 (0.012)
DIFFUSED
EPOXY
POLARITY
1.2
(0.047)
1.1 (0.043)
DIFFUSED EPOXY
1.1 (0.043)
PC BOARD
PC BOARD
0.6 (0.023)
0.3 (0.012)
CATHODE LINE
0.30 ± 0.15
(0.012 ± 0.006)
0.30 ± 0.15
(0.012 ± 0.006)
0.3 (0.012)
CATHODE LINE
0.50 ± 0.15
(0.020 ± 0.006)
0.50 ± 0.15
(0.020 ± 0.006)
0.7 (0.028) MIN.
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMW-B191
HSMW-B265
LED DIE
LED DIE
0.3 (0.012)
0.6 (0.024)
0.8 (0.031)
1.6 (0.063)
1.6
(0.063 )
0.4 (0.016)
POLARITY
1.2 (0.047)
POLARITY
0.16 (0.006)
DIFFUSED
EPOXY
DIFFUSED
EPOXY
1.0 (0.039)
PC BOARD
PC BOARD
0.4 (0.016)
0.5 (0.020)
CATHODE LINE
0.3 ± 0.15
(0.012 ± 0.006)
CATHODE LINE
0.7 (0.028) MIN.
SOLDERING
TERMINAL
HSMW-B197
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. TOLERANCE ± 0.1 mm UNLESS OTHERWISE NOTED.
2
SOLDERING
TERMINAL
HSMW-B120
3 – 0.3 (0.012)
Device Selection Guide
Package Dimension (mm)
1.6 (L) x 0.8 (W) x 0.6 (H)
3.4 (L) x 1.25 (W) x 1.1 (H)[2]
1.6 (L) x 0.8 (W) x 0.4 (H)
1.6 (L) x 0.6 (W) x 1.0 (H)[1]
Bluish White
HSMW-B191
HSMW-B265
HSMW-B197
HSMW-B120
Package Description
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Notes:
1. Right angle package.
2. Reverse mount package.
Absolute Maximum Ratings at TA = 25˚C
Parameter
DC Forward Current[1]
Power Dissipation
HSMW-Bxxx
20
78
Units
mA
mW
Reverse Voltage (IR = 100 µA)
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
10)
5
V
95
˚C
–30 to +85
˚C
–40 to +85
˚C
See reflow soldering profile (Figures 9 &
Note:
1. Derate linearly as shown in Figure 4.
Electrical Characteristics at TA = 25˚C
Part Number
HSMW-Bxxx
Forward
Voltage
VF (Volts)
@ IF = 20 mA[1]
Typ.
Max.
3.6
3.9
Reverse
Breakdown
VR (Volts)
@ IR = 100 µA
Min.
5
Capacitance C
(pF), VF = 0,
f = 1 MHz
Typ.
55
Thermal
Resistance
RθJ-PIN (˚C/W)
Typ.
450
Note:
1. VF tolerance: ± 0.1 V
Optical Characteristics at TA = 25˚C
Part Number
HSMW-B191
HSMW-B265
HSMW-B120
HSMW-B197
Luminous Intensity
Iv (mcd)
@ 20 mA[1, 4]
Min.
Typ.
28.5
110.0
28.5
110.0
28.5
110.0
28.5
110.0
Chromaticity
Coordinates[2]
Typ.
x
y
0.20
0.19
0.20
0.19
0.20
0.19
0.20
0.19
Viewing Angle
2 θ1/2 Degrees[3]
Typ.
140
150
155
130
Luminous
Efficacy
ηv (lm/w)
Typ.
170
170
170
170
Notes:
1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp
package.
2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
4. Luminous intensity (Iv) tolerance: ± 15%.
3
Light Intensity (Iv) Bin Limits[1]
Bin ID
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Intensity (mcd)
Min.
Max.
0.11
0.18
0.18
0.29
0.29
0.45
0.45
0.72
0.72
1.10
1.10
1.80
1.80
2.80
2.80
4.50
4.50
7.20
7.20
11.20
11.20
18.00
18.00
28.50
28.50
45.00
45.00
71.50
71.50
112.50
112.50
180.00
180.00
285.00
285.00
450.00
450.00
715.00
715.00
1125.00
1125.00
1800.00
1800.00
2850.00
2850.00
4500.00
Tolerance: ± 15%
Note:
1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your
Avago representative for information on
currently available bins.
4
SMT BLUISH WHITE COLOR BIN STRUCTURES
C
0.16
0.14
0.12
0.10
A
B
0.18
0.20
0.22
10
1
0.1
0.24
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
0.24
0.22
0.20
0.18
0.08
0.06
0.16
2.5
3.0
0.6
0.4
0.2
0
5
10
15
RELATIVE INTENSITY – %
90
20
15
10
5
80
70
60
50
40
30
20
10
0
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0 10 20 30 40 50 60 70 80 90 100
TA – AMBIENT TEMPERATURE – °C
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 5. Relative intensity vs. angle for HSMW-B191.
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 6. Relative intensity vs. angle for HSMW-B265.
20
Figure 3. Luminous intensity vs. forward
current.
100
25
100
RELATIVE INTENSITY – %
0.8
IF – FORWARD CURRENT – mA
Figure 2. Forward current vs. forward
voltage.
Figure 4. Maximum forward current vs.
ambient temperature.
5
4.0
3.5
VF – FORWARD VOLTAGE – V
Figure 1. Color bin limits (CIE 1931
Chromaticity Diagram) [Tolerance: ± 0.02].
1.0
0
2.0
X-COORDINATE
IF MAX. – MAXIMUM FORWARD CURRENT – mA
1.2
100
IF – FORWARD CURRENT – mA
Y-COORDINATE
0.30
0.28
0.26
25
100
RELATIVE INTENSITY – %
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 7. Relative intensity vs. angle for HSMW-B197.
100
RELATIVE INTENSITY
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0
10 20 30 40 50 60 70 80 90
ANGLE
100
RELATIVE INTENSITY
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 8. Relative intensity vs. angle for HSMW-B120.
6
TEMPERATURE
10 - 30 SEC.
TEMPERATURE
10 SEC. MAX.
230°C MAX.
4°C/SEC. MAX.
140-160°C
217 °C
200 °C
255 - 260 °C
3 °C/SEC. MAX.
6 °C/SEC. MAX.
150 °C
3 °C/SEC. MAX.
–3°C/SEC.
4°C/SEC.
MAX.
100 SEC. MAX.
60 - 120 SEC.
OVER 2 MIN.
TIME
TIME
(Acc. to J-STD-020C)
Figure 10. Recommended Pb-free reflow soldering profile.
Figure 9. Recommended reflow soldering profile.
2.2 (0.087) DIA. PCB HOLE
0.8 (0.031)
1.25 (0.049)
0.8
(0.031)
0.7
(0.028)
0.8
(0.031)
1.4
(0.055)
Figure 11. Recommended soldering pattern
for HSMW-B191 and HSMW-B197.
0.4 (0.016)
0.7 (0.028)
0.15 (0.006)
CENTERING
BOARD
1.2
(0.047)
0.8
(0.031)
Figure 13. Recommended soldering pad pattern for HSMW-B120.
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS (INCHES).
7
1.4
(0.055)
Figure 12. Recommended soldering pad
pattern for HSMW-B265.
0.4 (0.016)
0.8
(0.031)
2.3
(0.091)
USER FEED DIRECTION
CATHODE SIDE
xxx
xxxxx
xx xx
xxxxxx
xxxxx
xx
PRINTED LABEL
Figure 14. Reeling orientation.
;
;;
;;
;;
;;
;;;
;;
8.0 ± 1.0 (0.315 ± 0.039)
10.50 ± 1.0 (0.413 ± 0.039)
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
3.0 ± 0.5
(0.118 ± 0.020)
59.60 ± 1.00
(2.346 ± 0.039)
178.40 ± 1.00
(7.024 ± 0.039)
4.0 ± 0.5
(0.157 ± 0.020)
6
PS
Figure 15. Reel dimensions.
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS (INCHES).
8
5.0 ± 0.5
(0.197 ± 0.020)
;;;
;;;;;;
;;;
;;;;;;;;;
4.00 (0.157)
DIM. C
(SEE TABLE 1)
CATHODE
1.50 (0.059)
0.20 ± 0.05
(0.008 ± 0.002)
1.75 (0.069)
3.50 ± 0.05
(0.138 ± 0.002)
DIM. A
(SEE TABLE 1)
8.00 ± 0.30
(0.315 ± 0.012)
;;;
;;;
;;
;;
;;;;;;
;;
;;;;;;
;;
;;;;;
DIM. B
(SEE TABLE 1)
CARRIER TAPE
USER FEED
DIRECTION
2.00 ± 0.05
(0.079 ± 0.002)
COVER TAPE
4.00 (0.157)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
DIM. A
DIM. B
DIM. C
± 0.10 (± 0.004) ± 0.10 (± 0.004) ± 0.10 (± 0.004)
PART NUMBER
HSMW-B120
POSITION IN
CARRIER TAPE
HSMW-B191 SERIES
1.85 (0.073)
0.88 (0.035)
0.85 (0.033)
HSMW-B197 SERIES
HSMW-B120 SERIES
1.75 (0.069)
1.90 (0.075)
0.95 (0.037)
1.15 (0.045)
0.60 (0.024)
0.80 (0.031)
DIM. A
(SEE TABLE 1)
DIM. B
(SEE TABLE 1)
HSMW-B120
R 0.5 ± 0.05
(0.020 ± 0.002)
4.00 (0.157)
CATHODE
1.50 (0.059)
DIM. C
(SEE TABLE 1)
0.20 ± 0.05
(0.008 ± 0.002)
1.75 (0.069)
3.50 ± 0.05
(0.138 ± 0.002)
DIM. A
(SEE TABLE 1)
8.00 ± 0.30
(0.315 ± 0.012)
DIM. B
(SEE TABLE 1)
2.00 ± 0.05
(0.079 ± 0.002)
CARRIER TAPE
USER FEED
DIRECTION
4.00 (0.157)
PART NUMBER
HSMx-C265 SERIES
Figure 16. Tape dimensions.
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS (INCHES).
9
COVER TAPE
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
DIM. A
DIM. B
DIM. C
± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004)
3.70 (0.146)
1.45 (0.057)
1.30 (0.051)
END
START
Convective IR Reflow
Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060, Surface
Mounting SMT LED Indicator
Components.
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
Figure 17. Tape leader and trailer dimensions.
For product information and a complete list of distributors, please go to our website:
Storage Condition:
5 to 30˚C @ 60% RH max.
Baking is required under the condition:
1. Humidity Indicator Card is
>10% when read at 23± 5°C.
2. Device expose to factory conditions
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