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HSMW-B265

HSMW-B265

  • 厂商:

    AVAGO(博通)

  • 封装:

  • 描述:

    LED Uni-Color White 2-Pin Chip LED T/R

  • 数据手册
  • 价格&库存
HSMW-B265 数据手册
HSMW-Bxxx Bluish White ChipLEDs Data Sheet HSMW-B191, HSMW-B265, HSMW-B197, HSMW-B120 Description Features These pastel ChipLEDs come in unique shades of white and provide product differentiation for backlighting applications. They are designed in industry standard packages for ease of handling and use. • Unique pastel white colors • Small size • Industry standard footprint • Compatible with IR soldering These chipLEDs come in either top emitting packages (HSMW-B191, 265 & 197) or in a side emitting package (HSMW-B120). The packages are compatible with IR reflow soldering processes and comes in 8 mm tape on 7" diameter reels. They are compatible with automatic placement equipment. In order to facilitate pick and place operation, these chipLEDs are shipped in tape and reel with 4000 units per reel for HSMW-B191, 197, and 120 packages, and 3000 units per reel for HSMW-B265 packages. • Compatible with automatic placement equipment • Operating temperature range -30˚C to +85˚C • Come in 8 mm tape on 7" diameter reels Applications • LCD backlighting • Keypad backlighting • Pushbutton backlighting • Symbol backlighting CAUTION: HSMW-Bxxx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details. Package Dimensions CATHODE MARK LED DIE CATHODE MARK LED DIE 0.8 (0.031) 1.25 (0.049) 0.4 (0.016) 1.6 (0.063 ) 3.4 (0.134 ) 1.0 (0.039) POLARITY 0.3 (0.012) DIFFUSED EPOXY POLARITY 1.2 (0.047) 1.1 (0.043) DIFFUSED EPOXY 1.1 (0.043) PC BOARD PC BOARD 0.6 (0.023) 0.3 (0.012) CATHODE LINE 0.30 ± 0.15 (0.012 ± 0.006) 0.30 ± 0.15 (0.012 ± 0.006) 0.3 (0.012) CATHODE LINE 0.50 ± 0.15 (0.020 ± 0.006) 0.50 ± 0.15 (0.020 ± 0.006) 0.7 (0.028) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMW-B191 HSMW-B265 LED DIE LED DIE 0.3 (0.012) 0.6 (0.024) 0.8 (0.031) 1.6 (0.063) 1.6 (0.063 ) 0.4 (0.016) POLARITY 1.2 (0.047) POLARITY 0.16 (0.006) DIFFUSED EPOXY DIFFUSED EPOXY 1.0 (0.039) PC BOARD PC BOARD 0.4 (0.016) 0.5 (0.020) CATHODE LINE 0.3 ± 0.15 (0.012 ± 0.006) CATHODE LINE 0.7 (0.028) MIN. SOLDERING TERMINAL HSMW-B197 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. TOLERANCE ± 0.1 mm UNLESS OTHERWISE NOTED. 2 SOLDERING TERMINAL HSMW-B120 3 – 0.3 (0.012) Device Selection Guide Package Dimension (mm) 1.6 (L) x 0.8 (W) x 0.6 (H) 3.4 (L) x 1.25 (W) x 1.1 (H)[2] 1.6 (L) x 0.8 (W) x 0.4 (H) 1.6 (L) x 0.6 (W) x 1.0 (H)[1] Bluish White HSMW-B191 HSMW-B265 HSMW-B197 HSMW-B120 Package Description Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Notes: 1. Right angle package. 2. Reverse mount package. Absolute Maximum Ratings at TA = 25˚C Parameter DC Forward Current[1] Power Dissipation HSMW-Bxxx 20 78 Units mA mW Reverse Voltage (IR = 100 µA) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature 10) 5 V 95 ˚C –30 to +85 ˚C –40 to +85 ˚C See reflow soldering profile (Figures 9 & Note: 1. Derate linearly as shown in Figure 4. Electrical Characteristics at TA = 25˚C Part Number HSMW-Bxxx Forward Voltage VF (Volts) @ IF = 20 mA[1] Typ. Max. 3.6 3.9 Reverse Breakdown VR (Volts) @ IR = 100 µA Min. 5 Capacitance C (pF), VF = 0, f = 1 MHz Typ. 55 Thermal Resistance RθJ-PIN (˚C/W) Typ. 450 Note: 1. VF tolerance: ± 0.1 V Optical Characteristics at TA = 25˚C Part Number HSMW-B191 HSMW-B265 HSMW-B120 HSMW-B197 Luminous Intensity Iv (mcd) @ 20 mA[1, 4] Min. Typ. 28.5 110.0 28.5 110.0 28.5 110.0 28.5 110.0 Chromaticity Coordinates[2] Typ. x y 0.20 0.19 0.20 0.19 0.20 0.19 0.20 0.19 Viewing Angle 2 θ1/2 Degrees[3] Typ. 140 150 155 130 Luminous Efficacy ηv (lm/w) Typ. 170 170 170 170 Notes: 1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 4. Luminous intensity (Iv) tolerance: ± 15%. 3 Light Intensity (Iv) Bin Limits[1] Bin ID A B C D E F G H J K L M N P Q R S T U V W X Y Intensity (mcd) Min. Max. 0.11 0.18 0.18 0.29 0.29 0.45 0.45 0.72 0.72 1.10 1.10 1.80 1.80 2.80 2.80 4.50 4.50 7.20 7.20 11.20 11.20 18.00 18.00 28.50 28.50 45.00 45.00 71.50 71.50 112.50 112.50 180.00 180.00 285.00 285.00 450.00 450.00 715.00 715.00 1125.00 1125.00 1800.00 1800.00 2850.00 2850.00 4500.00 Tolerance: ± 15% Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. 4 SMT BLUISH WHITE COLOR BIN STRUCTURES C 0.16 0.14 0.12 0.10 A B 0.18 0.20 0.22 10 1 0.1 0.24 LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 0.24 0.22 0.20 0.18 0.08 0.06 0.16 2.5 3.0 0.6 0.4 0.2 0 5 10 15 RELATIVE INTENSITY – % 90 20 15 10 5 80 70 60 50 40 30 20 10 0 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 TA – AMBIENT TEMPERATURE – °C 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5. Relative intensity vs. angle for HSMW-B191. 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 6. Relative intensity vs. angle for HSMW-B265. 20 Figure 3. Luminous intensity vs. forward current. 100 25 100 RELATIVE INTENSITY – % 0.8 IF – FORWARD CURRENT – mA Figure 2. Forward current vs. forward voltage. Figure 4. Maximum forward current vs. ambient temperature. 5 4.0 3.5 VF – FORWARD VOLTAGE – V Figure 1. Color bin limits (CIE 1931 Chromaticity Diagram) [Tolerance: ± 0.02]. 1.0 0 2.0 X-COORDINATE IF MAX. – MAXIMUM FORWARD CURRENT – mA 1.2 100 IF – FORWARD CURRENT – mA Y-COORDINATE 0.30 0.28 0.26 25 100 RELATIVE INTENSITY – % 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 7. Relative intensity vs. angle for HSMW-B197. 100 RELATIVE INTENSITY 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE 100 RELATIVE INTENSITY 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 8. Relative intensity vs. angle for HSMW-B120. 6 TEMPERATURE 10 - 30 SEC. TEMPERATURE 10 SEC. MAX. 230°C MAX. 4°C/SEC. MAX. 140-160°C 217 °C 200 °C 255 - 260 °C 3 °C/SEC. MAX. 6 °C/SEC. MAX. 150 °C 3 °C/SEC. MAX. –3°C/SEC. 4°C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. OVER 2 MIN. TIME TIME (Acc. to J-STD-020C) Figure 10. Recommended Pb-free reflow soldering profile. Figure 9. Recommended reflow soldering profile. 2.2 (0.087) DIA. PCB HOLE 0.8 (0.031) 1.25 (0.049) 0.8 (0.031) 0.7 (0.028) 0.8 (0.031) 1.4 (0.055) Figure 11. Recommended soldering pattern for HSMW-B191 and HSMW-B197. 0.4 (0.016) 0.7 (0.028) 0.15 (0.006) CENTERING BOARD 1.2 (0.047) 0.8 (0.031) Figure 13. Recommended soldering pad pattern for HSMW-B120. NOTE: 1. DIMENSIONS ARE IN MILLIMETERS (INCHES). 7 1.4 (0.055) Figure 12. Recommended soldering pad pattern for HSMW-B265. 0.4 (0.016) 0.8 (0.031) 2.3 (0.091) USER FEED DIRECTION CATHODE SIDE xxx xxxxx xx xx xxxxxx xxxxx xx PRINTED LABEL Figure 14. Reeling orientation. ; ;; ;; ;; ;; ;;; ;; 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) Ø 20.20 MIN. (Ø 0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) 6 PS Figure 15. Reel dimensions. NOTE: 1. DIMENSIONS ARE IN MILLIMETERS (INCHES). 8 5.0 ± 0.5 (0.197 ± 0.020) ;;; ;;;;;; ;;; ;;;;;;;;; 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) ;;; ;;; ;; ;; ;;;;;; ;; ;;;;;; ;; ;;;;; DIM. B (SEE TABLE 1) CARRIER TAPE USER FEED DIRECTION 2.00 ± 0.05 (0.079 ± 0.002) COVER TAPE 4.00 (0.157) TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM. A DIM. B DIM. C ± 0.10 (± 0.004) ± 0.10 (± 0.004) ± 0.10 (± 0.004) PART NUMBER HSMW-B120 POSITION IN CARRIER TAPE HSMW-B191 SERIES 1.85 (0.073) 0.88 (0.035) 0.85 (0.033) HSMW-B197 SERIES HSMW-B120 SERIES 1.75 (0.069) 1.90 (0.075) 0.95 (0.037) 1.15 (0.045) 0.60 (0.024) 0.80 (0.031) DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) HSMW-B120 R 0.5 ± 0.05 (0.020 ± 0.002) 4.00 (0.157) CATHODE 1.50 (0.059) DIM. C (SEE TABLE 1) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) CARRIER TAPE USER FEED DIRECTION 4.00 (0.157) PART NUMBER HSMx-C265 SERIES Figure 16. Tape dimensions. NOTE: 1. DIMENSIONS ARE IN MILLIMETERS (INCHES). 9 COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM. A DIM. B DIM. C ± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004) 3.70 (0.146) 1.45 (0.057) 1.30 (0.051) END START Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 17. Tape leader and trailer dimensions. For product information and a complete list of distributors, please go to our website: Storage Condition: 5 to 30˚C @ 60% RH max. Baking is required under the condition: 1. Humidity Indicator Card is >10% when read at 23± 5°C. 2. Device expose to factory conditions
HSMW-B265 价格&库存

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