HSMW-C197

HSMW-C120, HSMW-C130, HSMW-C191, HSMW-C197, HSMW-C265 White ChipLEDs Data Sheet Description Features These white ChipLEDs come in unique shades of white and provide product differentiation for backlighting application. They are designed in industry standard package for ease of handling and use. x White color These chipLEDs come in either a side emitting package (HSMW-C120) or in top emitting packages (HSMWC130, C191, C197 and C265). The packages all compatible with IR reflow soldering process and come in 8 mm tape on 7" diameter reel. They are compatible with automatic placement equipment. In order to facilitate pick and place operation, these chipLEDs are shipped in tape and reel with 4000 units per reel for HSMW-C120, C130, C191 and C197 packages, and 3000 units per reel for HSMW-C265 package. x Small size x Industry standard footprint x Compatible with reflow soldering x Compatible with automatic placement equipment x Operating temperature range –40qC to +85qC x Come in 8 mm tape on 7" diameter reels Applications x LCD backlighting x Keypad backlighting x Pushbutton backlighting x Symbol backlighting CAUTION: HSMW-Cxxx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details. Package Dimensions CATHODE MARK LED Die 0.8 0.031 LED DIE 0.3 (0.012) (0.80) 0.6 (0.024) 1.6 0.063 1.6 (0.063) Polarity 1.15 0.045 POLARITY 1.2 (0.047) DIFFUSED EPOXY 0.23 0.009 DIFFUSED EPOXY 0.35 0.014 PCB BOARD 1.0 (0.039) PC BOARD 0.12 0.005 0.5 (0.020) CATHODE LINE CATHODE LINE 0.3±0.15 0.012±.006 0.3±0.15 0.012±.006 3 Ð 0.3 (0.012) 0.7 MIN. 0.028 SOLDERING TERMINAL SOLDERING TERMINAL HSMW-C120 HSMW-C130 CATHODE MARK LED DIE LED DIE 0.8 (0.031) 1.6 (0.063 ) 1.0 (0.039) 0.4 (0.016) 0.8 (0.031) 1.6 (0.063 ) 0.4 (0.016) POLARITY POLARITY 0.3 (0.012) 0.16 (0.006) DIFFUSED EPOXY DIFFUSED EPOXY PC BOARD PC BOARD CATHODE LINE 0.6 (0.023) 0.3 (0.012) 0.30 ± 0.15 (0.012 ± 0.006) 0.30 ± 0.15 (0.012 ± 0.006) 0.7 (0.028) MIN. 0.4 (0.016) CATHODE LINE 0.3 ± 0.15 (0.012 ± 0.006) 0.7 (0.028) MIN. SOLDERING TERMINAL HSMW-C191 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. TOLERANCE ±0.1 mm UNLESS OTHERWISE NOTED. 2 SOLDERING TERMINAL HSMW-C197 Package Dimensions, continued CATHODE MARK LED DIE 1.25 (0.049) 3.4 (0.134 ) DIFFUSED EPOXY POLARITY 1.2 (0.047) 1.1 (0.043) 1.1 (0.043) PC BOARD 0.3 (0.012) CATHODE LINE 0.50 ± 0.15 (0.020 ± 0.006) 0.50 ± 0.15 (0.020 ± 0.006) SOLDERING TERMINAL HSMW-C265 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. TOLERANCE ±0.1 mm UNLESS OTHERWISE NOTED. 3 Device Selection Guide Package Dimension (mm) White Package Description 1.6 (L) x 0.6 (W) x 1.0 (H) HSMW-C120 Untinted, Diffused 1.6 (L) x 0.8 (W) x 0.35 (H) HSMW-C130 Untinted, Diffused 1.6 (L) x 0.8 (W) x 0.6 (H) HSMW-C191 Untinted, Diffused 1.6 (L) x 0.8 (W) x 0.4 (H) HSMW-C197 Untinted, Diffused 3.4 (L) x 1.25 (W) x 1.1 (H)[2] HSMW-C265 Untinted, Diffused Notes: 1. Right angle package. 2. Reverse mount package. Absolute Maximum Ratings at TA = 25˚C Parameter HSMW-Cxxx Units DC Forward Current[1] 20 mA Power Dissipation 78 mW Reverse Voltage (IR = 100 μA) 5 V LED Junction Temperature 95 ˚C Operating Temperature Range –40 to +85 ˚C Storage Temperature Range –40 to +85 ˚C Soldering Temperature See reflow soldering profile (Figures 10 & 11) Note: 1. Derate linearly as shown in Figure 4. Electrical Characteristics at TA = 25˚C Part Number Forward Voltage VF (Volts) @ IF = 20 mA[1] Typ. Max. Reverse Breakdown VR (Volts) @ IR = 100 μA Min. Capacitance C (pF), VF = 0, f = 1 MHz Typ. Thermal Resistance RTJ-PIN (˚C/W) Typ. HSMW-Cxxx 3.6 5 55 450 3.9 Note: 1. VF tolerance: ± 0.1 V. Optical Characteristics at TA = 25˚C Part Number Luminous Intensity Iv (mcd) @ 20 mA[1, 4] Min. Typ. Chromaticity Coordinates[2] Typ.  x y Luminous Viewing Angle 2 T1/2 Degrees[3] Typ. Efficacy Kv (lm/w) Typ. HSMW-C120 45 160 0.29 0.27 155 240 HSMW-C130 45 150 0.29 0.27 145 240 HSMW-C191 71.5 200 0.29 0.27 140 240 HSMW-C197 45 160 0.29 0.27 130 240 HSMW-C265 71.5 180 0.29 0.27 150 240 Notes: 1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 4. Luminous intensity (Iv) tolerance: ± 15%. 4 Light Intensity (Iv) Bin Limits[1] Bin ID Intensity (mcd) Min. Max. Bin Limits (Chromaticity Coordinate) x y A 0.11 0.18 A1 0.270 0.246 B 0.18 0.29 0.270 0.278 0.250 0.250 0.250 0.218 0.270 0.246 C 0.29 0.45 D 0.45 0.72 E 0.72 1.10 F 1.10 1.80 0.270 0.213 G 1.80 2.80 0.250 0.185 0.250 0.218 0.270 0.246 0.278 H 2.80 4.50 J 4.50 7.20 A2 B1 K 7.20 11.20 0.270 L 11.20 18.00 0.290 0.306 0.290 0.274 0.270 0.246 71.50 0.270 0.213 M 18.00 28.50 N 28.50 45.00 B2 P 45.00 Q 71.50 112.50 0.290 0.241 R 112.50 180.00 0.290 0.274 0.290 0.306 C1 S 180.00 285.00 T 285.00 450.00 0.310 0.336 0.310 0.303 0.290 0.274 0.290 0.241 U 450.00 715.00 V 715.00 1125.00 C2 W 1125.00 1800.00 X 1800.00 2850.00 0.310 0.271 4500.00 0.310 0.303 0.290 0.274 0.310 0.303 0.310 0.336 0.330 0.365 0.330 0.333 0.310 0.303 0.310 0.271 0.330 0.300 0.330 0.333 Y 2850.00 Tolerance: ± 15% 1.2 LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.0 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 IF - FORWARD CURRENT - mA Figure 1. Color bin limits (CIE 1931 Chromaticity Diagram) [Tolerance: ± 0.02]. 5 D1 D2 IF MAX. - MAXIMUM FORWARD CURRENT - mA Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. 25 20 15 10 5 0 0 10 20 30 40 50 60 70 80 90 100 T A - AMBIENT TEMPERATURE - o C Figure 2. Forward current vs. forward voltage. 0.40 SMT WHITE COLOR BIN STRUCTURES 100 0.36 0.34 0.32 0.30 0.28 0.26 0.24 0.22 0.20 0.18 0.16 0.24 IF - FORWARD CURRENT - mA Y-COORDINATE 0.38 D1 C1 B1 A1 D2 C2 B2 A2 0.26 0.28 0.30 0.32 10 1 0.1 0.34 2.0 3.0 2.5 Figure 3. Luminous intensity vs. forward current. 90 RELATIVE INTENSITY 80 70 60 50 40 30 20 10 0 10 20 30 40 50 60 70 80 90 10 20 30 40 50 60 70 80 90 ANGLE 100 90 RELATIVE INTENSITY 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 ANGLE Figure 5. Relative intensity vs. angle for HSMW-C120. 6 4.0 Figure 4. Maximum forward current vs. ambient temperature. 100 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 3.5 V F - FORWARD VOLTAGE - V X-COORDINATE 100 90 RELATIVE INTENSITY - % 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 20 30 40 50 60 70 80 90 20 30 40 50 60 70 80 90 2 0 3 0 40 50 60 70 80 9 0 Figure 6. Relative intensity vs. angle for HSMW-C130. 100 RELATIVE INTENSITY - % 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 Figure 7. Relative intensity vs. angle for HSMW-C191. 100 RELATIVE INTENSITY - % 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 Figure 8. Relative intensity vs. angle for HSMW-C197. 100 90 RELATIVE INTENSITY - % 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -3 0 -20 -10 0 10 Figure 9. Relative intensity vs. angle for HSMW-C265. 7 TEMPERATURE 10 SEC. MAX. TEMPERATURE 10 SEC. MAX. 230 C MAX. 4 C/SEC. MAX. 140-160 C 217 C 200 C 255 - 260 C 3 C/SEC. MAX. 6 C/SEC. MAX. 150 C 3 C/SEC. MAX. 3 C/SEC. MAX. 4 C/SEC. MAX. 60 SEC. MAX. 60 - 120 SEC. OVER 2 MIN. TIME TIME Figure 11. Recommended Pb-free reflow soldering profile. Figure 10. Recommended reflow soldering profile. 0.4 (0.016) 0.4 (0.016) 0.8 (0.031) 0.7 (0.028) 0.15 (0.006) 0.8 (0.031) 1.2 (0.047) 0.8 (0.031) CENTERING BOARD Figure 12. Recommended soldering pad pattern for HSMW-C120. 2.2 (0.087) DIA. PCB HOLE 1.25 (0.049) 1.4 (0.055) 2.3 (0.091) 1.4 (0.055) Figure 14. Recommended soldering pad pattern for HSMW-C265. NOTE: 1. DIMENSIONS ARE IN MILLIMETERS (INCHES). 8 0.8 (0.031) 0.7 (0.028) 0.8 (0.031) Figure 13. Recommended soldering pattern for HSMW-C130, HSMW-C191, and HSMW-C197. USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 15. Reeling orientation. 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) Ø 20.20 MIN. (Ø 0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) Figure 16. Reel dimensions. NOTE: 1. DIMENSIONS ARE IN MILLIMETERS (INCHES). 9 6 PS 5.0 ± 0.5 (0.197 ± 0.020) 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) 8.00 ± 0.30 (0.315 ± 0.012) 4.00 (0.157) HSMx-C120 POSITION IN CARRIER TAPE COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER HSMx-C120 SERIES HSMx-C130 SERIES HSMx-C191 SERIES HSMx-C197 SERIES DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) CARRIER TAPE USER FEED DIRECTION DIM. A DIM. B DIM. C ± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004) 0.80 (0.031) 1.90 (0.075) 1.15 (0.045) 0.50 (0.020) 1.75 (0.069) 0.88 (0.035) 0.88 (0.035) 1.85 (0.073) 0.88 (0.035) 0.60 (0.024) 1.75 (0.069) 0.95 (0.037) FOR HSMx-C120 R 0.5 ± 0.05 (0.020 ± 0.002) 4.00 (0.157) CATHODE 1.50 (0.059) DIM. C (SEE TABLE 1) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) 8.00 ± 0.30 (0.315 ± 0.012) 4.00 (0.157) HSMx-C265 SERIES Figure 17. Tape dimensions. NOTE: 1. DIMENSIONS ARE IN MILLIMETERS (INCHES). COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER 10 CARRIER TAPE USER FEED DIRECTION DIM. A DIM. B DIM. C ± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004) 3.70 (0.146) 1.45 (0.057) 1.30 (0.051) 0.23 ± 0.05 (0.009 ± 0.002) FOR HSMR-C130 END THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 18. Tape leader and trailer dimensions. Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. For product information and a complete list of distributors, please go to our website: Storage Condition: 5 to 30°C @ 60% RH max. Baking is required under the condition: 1. Humidity Indicator Card is > 10% when read at 23±5°C. 2. Device expose to factory conditions < 30°C/60% RH more than 672 hours. Baking recommended condition: 60 ± 5°C for 20 hours. www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved. Obsoletes AV01-0685EN AV02-0186EN - May 5, 2010