HSMW-CL25

HSMW-CL25 0.25mm White Leadframe-Based Surface Mount ChipLED Data Sheet Description Features The HSMW-CL25 series of parts is designed with an ultra small form factor to allow this miniaturization. The HSMWCL25 series is the thinnest available top emitting package in the market with high brightness InGaN die technology. The leadframe construction of this package allows the part to transfer heat from the package, thus it is able to survive temperature conditions of -40°C to 85°C despite its small size. • Small size top firing The target applications are Keypad backlighting, Push button backlighting and Status indicators. The target markets are Mobile Handsets, Communications, Office Automation, Industrial and Commercial automations, Home Market appliances, Networking, Medical Instruments, and Mobile Computing. This product is competitively priced, and production is geared towards short lead times and ample capacity. • Small 1.6 (L) x 0.8 (W) x 0.25 (H) mm package • Diffused optics • Compatible with IR Reflow • High brightness using InGaN die technology • Available in 8mm Tape on 7” (178 mm) Diameter Reels Advantages • High package thermal dissipation capability due to the superior package leadframe design • Small footprint to overcome space count • Low thickness to overcome space constrains • Short lead times and competitive pricing CAUTION: HSMW-CL25 LEDs are Class 1B ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.  Package Dimensions Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ±0.1mm (±0.004 in.) unless otherwise specified Device Selection Guide Package Dimension (mm) Die Technology Colors Testing Current (mA) Parts per Reel Package Description 1.6 (L) x 0.8 (W) x 0.25 (H) InGaN White 5 4000 Untinted, Diffused Absolute Maximum Ratings at TA = 25°C Parameter HSMW-CL25 Units DC Forward Current[1] 10 mA Power Dissipation 39 mW Reverse Voltage (IR = 100mA) 5 V LED Junction Temperature 95 °C -40 to +85 °C -40 to +85 °C Operating Temperature Range Storage Temperature Range Soldering Temperature Notes: 1. Derate linearly as shown in Figure 4.  See reflow soldering profile (Figure 7 & 8) Electrical Characteristics at TA = 25°C Forward Voltage VF (Volts) [1] @ IF =5mA Part Number Typ. Max. Reverse Breakdown VR (Volts) @ IR = 100mA Min. Thermal Resistance RqJ-PIN (°C/W) Typ. HSMW-CL25 2.85 3.15 5 300 Chromaticity Coordinates[2] Notes: 1. Vf tolerance : ±0.1V Optical Characteristics at TA = 25°C Luminous Intensity IV [1] (mcd) @ 5mA Part Number Min. Typ. Bin Viewing Angle[3] (°) Typ. HSMW-CL25 28.5 70.0 A1 – D2 (Refer to Figure 1) 120 Notes: 1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the LED package. 2. The chromaticity coordinates, are derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. q1/2 is the off-axis angle where the luminous intensity is ½ the peak intensity. Light Intensity (IV) Bin Limits Bin ID Forward Voltage (VF) Bin Limits Intensity (mcd) Bin ID Minimum Maximum Minimum Maximum N 28.50 45.00 1 2.55 2.75 P 45.00 71.50 2 2.75 2.95 Q 71.50 112.50 3 2.95 3.15 Tolerance : ±15% Tolerance : ±0.1V 0.38 Rank A1 0.36 0.34 Y - COORDINATE 0.32 C1 0.30 0.28 0.26 B1 A1 0.24 0.22 D1 A2 D2 B1 B2 C2 C1 B2 A2 C2 0.20 D1 0.18 0.16 0.24 D2 0.26 0.28 0.3 X - COORDINATE 0.32 0.34 Figure 1. SMT White Color Bin Structure (CIE 1931 Chromaticity Diagram) [Tolerance = +/- 0.02]  Forward Voltage (V) X Y X Y X Y X Y X Y X Y X Y X Y Chromaticity Coordinates 0.2700 0.2700 0.2500 0.2455 0.2780 0.2500 0.2700 0.2700 0.2500 0.2455 0.2130 0.1850 0.2700 0.2700 0.2900 0.2455 0.2780 0.3060 0.2700 0.2700 0.2900 0.2455 0.2130 0.2410 0.2900 0.3100 0.3100 0.3060 0.3355 0.3030 0.2900 0.3100 0.3100 0.2410 0.2705 0.3030 0.3100 0.3100 0.3300 0.3030 0.3355 0.3650 0.3100 0.3100 0.3300 0.3030 0.2705 0.3000 0.2500 0.2175 0.2500 0.2175 0.2900 0.2735 0.2900 0.2735 0.2900 0.2735 0.2900 0.2735 0.3300 0.3325 0.3300 0.3325 100 2.0 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 5 mA) FORWARD CURRENT - mA 1.8 10 1 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.1 2.0 2.5 3.0 3.5 FORWARD VOLTAGE - V 0 4.0 Figure 2. Forward voltage vs. forward current 2 4 6 8 DC FORWARD CURRENT - mA 10 Figure 3. Luminous intensity vs. forward current 12 1 0.9 NORMALIZED INTENSITY 10 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 5 mA) 0 8 6 4 2 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 20 40 60 80 DC FORWARD CURRENT - mA Figure 4. Maximum forward current vs. ambient temperature 0.8 (0.031) 0.8 (0.031) 0.7 (0.028) 0.8 (0.031) Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1mm (±0.004in.) unless otherwise specified. Figure 6. Recommended soldering land pattern.  100 0 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES Figure 5. Radiation Pattern 90 10 SEC. MAX. 10 - 30 SEC. 255 - 260 ˚C 140-160 oC 4o C/SEC MAX. -3o C/SEC MAX. 4o C/SEC MAX. TEMPERATURE TEMPERATURE 230o C MAX. OVER 2 MIN. 217 ˚C 200 ˚C 3 ˚C/SEC. MAX. -6 ˚C/SEC. MAX. 150 ˚C 3 ˚C/SEC. MAX. 60 - 120 SEC. 100 SEC. MAX. TIME TIME Figure 7. Recommended reflow soldering profile Figure 8. Recommended Pb-free reflow soldering profile. USER FEED DIRECTION PRINTED LABEL (Acc. to J-STD-020C) xxx xxxxx xxxxx xxxxx xxxxx xx CATHODE SIDE Figure 9. Reeling orientation. ∅ 13.1 ± 0.5 (∅ 0.516 ± 0.020) ∅ 20.20 MIN. (∅ 0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) 6 PS 5.0 ± 0.5 (0.197 ± 0.020) 10.50 ± 1.0 (0.413 ± 0.039) Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1mm (±0.004in.) unless otherwise specified. Figure 10. Reel dimensions.  8.0 ± 1.0 (0.315 ± 0.039) DIM. A 1.75 (0.069) ± 0.10 (0.004) PART NUMBER HSMW-CL25 DIM. B 0.88 (0.035) ± 0.10 (0.004) DIM. C 0.40 (0.016) ± 0.10 (0.004) Figure 11. Tape Dimensions END THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 12. Tape leader and trailer dimensions. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Reflow Soldering: Storage Condition: 5 to 30°C @ 60%RH max. For more information on reflow soldering, refer to Application Note AN-1060, Surface Mounting SMT LED Indicator Components. Baking is required before mounting, if: 1. Humidity Indicator Card is > 10% when read at 23 ± 5°C. 2. Device expose to factory conditions