MGA-12516-TR1G

MGA-12516 High Gain, Matched-Pair Dual, Very Low Noise Amplifier Data Sheet Description Features Avago Technologies’ MGA-12516 is an economical, easyto-use GaAs MMIC matched-pair dual Low Noise Amplifier (LNA). The LNA has very low noise, high gain and excellent isolation achieved through the use of Avago Technologies’ proprietary 0.25um GaAs Enhancement-mode pHEMT process. It is housed in a miniature 4.0 x 4.0 x 0.85mm 16pin Small Leadless Package (SLP) package. The compact footprint and low profile coupled with ultra-low noise and high gain make the MGA-12516 an ideal choice as a low noise amplifier for cellular infrastructure for GSM, CDMA ,TD-SCDMA and WiMAX applications. • Dual, matched-pair LNAs Pin Configuration and Package Marking • High gain • Excellent isolation • GaAs E-pHEMT Technology[1] • Low cost small package size: 4.0x4.0x0.85 mm3 • Excellent uniformity in product specifications Specifications • 0.58 dB Noise Figure • 24 dB Gain nc Pin 16 nc Pin 15 nc Pin 14 nc Pin 13 • 38.6 dB Isolation RFout1 Pin 12 Pin 1 RFin1 nc Pin 11 Pin 2 nc GND nc Pin 10 RFout2 Pin 9 Pin 5 nc Pin 6 nc Pin 7 nc Pin 8 nc TOP VIEW • Very low noise figure 1.95GHz; 4V, 50mA per channel (typ) 4.0 x 4.0 x 0.85 mm3 16-lead SLP KC2 YYWW XXXX • Optimum frequency of operation 800MHz-3GHz • 33.3 dBm Output IP3 • 18.4 dBm Output Power at 1dB gain compression Pin 3 nc Applications Pin 4 RFin2 • Balanced dual low noise amplifier for cellular infrastructure for GSM, CDMA, TD-SCDMA and WiMAX used with 3-dB hybrid couplers at inputs and outputs nc = not connected BOTTOM VIEW Notes: Package marking provides orientation and identification “KC2” = Product Code “YYWW” = Work Week and Year of manufacture “XXXX” = Last 4 digit of Lot number Attention: Observe precautions for handling electrostatic sensitive devices. ESD Machine Model = 70 V ESD Human Body Model = 200 V Refer to Avago Application Note A004R: Electrostatic Discharge, Damage and Control. Notes: 1. Enhancement mode technology employs positive gate bias, thereby eliminating the need of negative gate voltage associated with conventional depletion mode devices. Simplified Schematic VGG VDD PACKAGE CHN#1 CHN#2 IN1 OUT1 IN2 OUT2 VGG VDD MGA-12516 Absolute Maximum Rating [1] Symbol Parameter Units Absolute Max. VDD Device Voltage, RF output to ground V 6 VGG Gate Voltage V 0.8 Pin,max (ON) CW RF Input Power (at VDD=4V, VGG=0.58V). dBm 18 Pin,max (OFF) CW RF Input Power( at VDD=4V, VGG=0V) dBm 28 Pdiss Total Power Dissipation [2] W 1.2 Tj Junction Temperature oC 150 TSTG Storage Temperature oC -65 to 150 Thermal Resistance [3], θjc = 34 ºC/Wat VDD= 4V, IDD=50mA per channel Notes: 1. Operation of this device in excess of any of these limits may cause permanent damage. 2. Power dissipation with both channels turned on. Board temperature TB is 25 oC. Derate 29.5mW/ oC for TB>109 oC. 3. Thermal resistance measured using Infra-red measurement technique, with both channels turned on, hence IDDtotal=100mA. Electrical Specifications RF performance at 4V, 50mA,1.95 GHz, TA = 25 °C, given for each RF channel, measured on the demo board in Fig. 28 with component list in Table 1, for 1.95GHz matching. Symbol Parameter and Test Condition Units Min. Typ. Max. VGG Operational Gate Voltage (to adjust for given IDD) V 0.43 0.58 0.7 NF[4] Noise Figure dB 0.58 0.9 Gain Gain dB 24 25.8 OIP3[5] Output Third Order Intercept Point dBm 33.3 OP1dB Output Power at 1dB Gain Compression dBm 18.4 IRL Input Return Loss, 50Ω source dB 13.5 ORL Output Return Loss, 50Ω load dB 4.6 |S12| Reverse Isolation dB 38.6 |ISOL1-2| Isolation between IN1 and IN2 dB 43 22.3 Notes: 4. Board transmission line losses have been deembedded. 5. 1.95GHz IP3 test condition: ftone1 = 1.950 GHz, ftone2 = 1.951 GHz with input power of -20dBm per tone.      Product Consistency Distribution Charts [1]          TA = 25 °C, 1.95GHz, Vdd = 4V, Idd = 50mA, FRF=1.95GHz, unless stated otherwise.          Figure 1. Gain at 1.95 GHz , VDD=4V; IDD=50mA Figure 2. NF at 1.95 GHz , VDD=4V; IDD= 50mA           Figure 3. VGG at 1.95 GHz , VDD=4V; IDD= 50mA Notes: 1. Distribution data sample size are 500 samples taken from 3 different wafer lots, measured on a production test board with contactor. Future wafers allocated to this product may have nominal values anywhere between the upper and lower limit. 160 0.60V 140 0.60V 120 IDD(mA)   0.55V 100 0.55V 80 60 0.50V 0.50V 0.45V 0.45V 0.40V 40 20 0.40V 0 0 1 2 3 VDD(V) 4 5 6 Figure 4. IDD vs VDD vs VGG, All Channels Terminated at 50ohm (both Channels turn on)  MGA-12516 Typical Performance Measured on demo board in Fig. 28 with component list in Table 1, for 1.95GHz matching. TA = +25 oC, VDD = 4V, IDD = 50mA per channel, Frequency=1.95GHz, unless stated otherwise. 1.6 30 1.4 25 1.2 Gain(dB) NF(dB) 1 0.8 0.6 0.4 CHN#1 0.2 CHN#2 5 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2 2.1 2.2 Frequency(GHz) 45 35 P1dB(dBm) OIP3 (dBm) 40 30 25 CHN#1 CHN#2 15 10 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2 Frequency(GHz) 2.1 2.2 22 20 18 16 14 12 10 8 CHN#1 6 4 CHN#2 2 0 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2 2.1 2.2 8 ORL(dB) 15 IRL(dB) 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2 2.1 2.2 Frequency(GHz) 10 20 10 CHN#1 5 CHN#2 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2 2.1 2.2 Frequency(GHz) Figure 9. IRL vs Frequency vs Channel  CHN#2 Frequency(GHz) Figure 8. OP1dB vs Frequency vs Channel Figure 7. OIP3 vs Frequency vs Channel 0 CHN#1 Figure 6. Gain vs Frequency vs Channel 50 20 15 10 0 Figure 5. Noise Figure vs Frequency vs Channel 20 6 4 CHN#1 2 0 0.9 CHN#2 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2 Frequency(GHz) Figure 10. ORL vs Frequency vs Channel 2.1 2.2 MGA-12516 Typical Performance Measured on demo board in Fig. 28 with component list in Table 1, for 1.95GHz matching. TA = +25 oC, VDD = 4V, IDD = 50mA per channel, Frequency=1.95GHz, unless stated otherwise. -30 60 50 -35 |ISOL|dB S12(dB) 40 -40 -45 30 20 ISO(IN1-IN2) CHN#1 10 CHN#2 ISO(OUT1-OUT2) 0 -50 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2 2.1 2.2 Frequency(GHz) 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2 2.1 2.2 Frequency(GHz) Figure 11. S12 vs Frequency vs Channel Figure 12. Channel Isolation vs Frequency, at Inputs and Outputs 30 1.6 1.2 NF(dB) 1 25 +25ºC +85ºC 20 Gain(dB) 1.4 -40ºC 0.8 0.6 10 0.4 0 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2 2.1 2.2 Frequency(GHz) Figure 13. Noise Figure vs Frequency vs Temperature 35 25 P1dB(dBm) OIP3(dBm) 30 20 15 -40ºC +25ºC 5 +85ºC 0 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2 Frequency(GHz) Figure 15. OIP3 vs Frequency vs Temperature  +25ºC +85ºC 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2 2.1 2.2 Frequency(GHz) Figure 14. Gain vs Frequency vs Temperature 40 10 -40ºC 5 0.2 0 15 2.1 2.2 25 23 21 19 17 15 13 11 9 7 5 -40ºC +25ºC +85ºC 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2 2.1 2.2 Frequency(GHz) Figure 16. OP1dB vs Frequency vs Temperature MGA-12516 Typical Performance 1 30 0.8 25 0.6 20 Gain(dB) NF(dB) Measured on demo board in Fig. 28 with component list in Table 1, for 1.95GHz matching. TA = +25 oC, VDD = 4V, IDD = 50mA per channel, Frequency=1.95GHz, unless stated otherwise. 0.4 3V 4V 5V 0.2 0 5 35 40 45 50 IDD(mA) 55 60 35 65 50 IDD(mA) 55 60 65 20 P1dB(dBm) 30 OIP3(dBm) 45 25 35 25 20 15 5 35 40 45 50 IDD(mA) 55 60 10 4V 5 5V 0 65 Figure 19. OIP3 vs IDD vs VDD 35 40 45 50 IDD(mA) 55 60 65 Figure 20. OP1dB vs IDD vs VDD 30 25 Gain(dB) 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 35 15 3V 3V 4V 5V 10 NF(dB) 40 Figure 18. Gain vs IDD vs VDD 40 20 15 -40ºC -40ºC +25ºC 40 45 50 IDD(GHz) 55 60 +25ºC 10 +85ºC Figure 21. Noise Figure vs IDD vs Temperature  3V 4V 5V 10 Figure 17. Noise Figure vs IDD vs VDD 0 15 +85ºC 65 5 35 40 45 50 IDD(GHz) Figure 22. Gain vs IDD vs Temperature 55 60 65 MGA-12516 Typical Performance 45 45 40 40 30 30 OIP3 (dBm) OIP3 (dBm) Measured on demo board in Fig. 28 with component list in Table 1, for 1.95GHz matching. TA = +25 oC, VDD = 4V, IDD = 50mA per channel, Frequency=1.95GHz, unless stated otherwise. 25 20 15 10 5 40 45 50 IDD (mA) 55 20 15 -40ºC +25ºC 10 +25ºC +85ºC 5 +85ºC -40ºC 0 35 25 60 0 65 Figure 23. OIP3 vs IDD vs Temperature 35 40 45 50 IDD (mA) 55 60 65 Figure 24. OP1dB vs IDD vs Temperature MGA-12516 Typical Performance 1.4 15 1.2 10 1 Gain 5 0.8 40 22 35 19 OIP3(dBm) 20 NF(dB) 1.6 Gain(dB) 25 30 16 25 OIP3 NF 0 2.2 OP1dB 0.6 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3 Figure 25. Gain/Noise Figure vs Frequency 0 14 -5 IRL -15 S12 -20 6 -25 4 -30 2 -35 0 2.2 -40 2.3 2.4 2.5 2.6 2.7 Frequency(GHz) Figure 27. IRL/ORL/S12 vs Frequency  2.8 2.9 3 S12(dB) IRL&ORL(dB) -10 ORL 8 2.4 2.6 Figure 26. OIP3/OP1dB vs Frequency 16 10 20 2.2 Frequency(GHz) Frequency(GHz) 12 13 2.8 10 3 OP1dB(dBm) Measured on demo board in Fig. 27 with component list in Table 1, for 2.4GHz matching. TA = +25 oC, VDD = 4V, IDD = 50mA per channel, Frequency=2.4GHz, unless stated otherwise. VDD VDD VSENSE GND GND VGG Demo Board Layout IN1 OUT1 OUT IN IN2 KCD3 MILS W 21.7 G 19.2 H 10 e 3.48 June 2006 CST Avago Technologies Figure 28. Demo board layout - for single-ended measurements. PCB uses 10 mils Rogers RO4350 material.  OUT2 Demo Board Schematic Note there are 2 different matchings, at 1.95GHz and 2.4GHz: VGG C4 VDD C8 R2 R1 C6 C2 L2 L4 PACKAGE C1 IN1 C5 OUT1 C13 OUT2 L3 IN2 C9 L7 L8 L6 C10 R3 R4 VGG C14 VDD C12 C16 Figure 29. Demo board schematic diagram and SMT list. Table 1. SMT Component list for 1.95GHz and 2.4GHz matching 1.95GHz Matching 2.4GHz Matching Component Size Value Value C1, C5, C9, C13 0402 100pF (Rohm MCH155A101JK) 100pF (Rohm MCH155A101JK) C2, C10 0402 22pF (Rohm MCH155A220JK) 22pF (Rohm MCH155A220JK) C6, C14 0402 1000pF (Rohm MCH155CN102KK) 1000pF (Rohm MCH155CN102KK) C4, C8, C12, C16 0402 10nF (Murata GRM155R71E103KA01) 10nF (Murata GRM155R71E103KA01) R1, R3 0402 33Ω (Rohm MCR01MZSJ330) 33Ω (Rohm MCR01MZSJ330) R2, R4 0402 0Ω (Rohm MCR03EZHJ000) 0Ω (Rohm MCR03EZHJ000) L2, L6 0402 6.2nH (Coilcraft 0402CS-6N2XJLU) 7.5nH (Coilcraft 0402CS-7N5XJLU) L3, L7 0402 2.7nH (Toko LLP1005-FH2N7B) in parallel with 91Ω (Rohm MCR01MZSJ910)[8] 1.8nH (Toko LLP1005-FH1N8B) in parallel with 160Ω (Rohm MCR01MZSJ161)[1] L4, L8 0402 82nH (Toko LL1005-FHL82NJ) 82nH (Toko LL1005-FHL82NJ) Notes: 1. Inductor and resistor are stacked-up, in parallel.  MGA-12516 Typical Scattering and Noise parameters Reference planes at package pins, measured at TA = +25 °C, VDD = 3V, IDD = 50mA per channel. FREQ (GHz) S11 Mag 0.1 0.5 0.7 0.9 1.1 1.5 1.7 1.9 2.1 2.5 2.7 2.9 3.3 3.5 3.9 4.7 5.5 6.1 6.5 7.1 7.5 8.1 8.5 9.1 9.5 10 0.96 0.84 0.76 0.69 0.63 0.56 0.54 0.53 0.51 0.49 0.48 0.48 0.48 0.49 0.49 0.52 0.59 0.69 0.73 0.73 0.76 0.82 0.85 0.87 0.87 0.87 10 Ang S21 Mag -8.89 -38.37 -49.14 -57.95 -64.99 -77.36 -82.96 -87.96 -89.34 -100.62 -106.20 -111.65 -124.37 -131.55 -146.21 -178.01 148.00 121.85 104.32 85.10 76.76 61.68 54.17 41.85 36.24 28.87 33.30 27.23 23.89 20.88 18.38 14.76 13.35 12.31 11.20 9.78 9.08 8.63 7.77 7.53 6.95 6.24 5.45 4.86 4.28 3.18 2.61 2.00 1.70 1.29 1.11 0.91 Ang S12 Mag 169.67 128.05 113.62 100.85 89.91 70.72 62.29 54.31 45.85 30.68 23.56 16.18 2.10 -4.54 -18.97 -49.89 -85.06 -111.59 -132.00 -158.82 -172.89 167.29 155.55 138.15 128.22 116.99 0.00 0.00 0.01 0.01 0.01 0.01 0.01 0.01 0.02 0.02 0.02 0.02 0.02 0.02 0.03 0.04 0.06 0.07 0.08 0.09 0.09 0.09 0.10 0.10 0.10 0.10 Ang S22 Mag Ang 67.40 64.80 64.38 61.57 59.42 57.53 56.12 54.76 50.47 47.24 46.17 45.81 43.47 43.29 41.99 35.46 23.67 10.90 -2.94 -19.63 -27.68 -40.78 -47.97 -58.91 -65.09 -73.10 0.85 0.79 0.77 0.76 0.77 0.76 0.77 0.77 0.75 0.75 0.75 0.74 0.73 0.74 0.73 0.79 0.84 0.89 0.89 0.90 0.90 0.92 0.92 0.92 0.93 0.92 -0.82 -17.65 -23.70 -29.63 -34.90 -46.00 -51.49 -57.22 -68.57 -79.82 -85.46 -91.33 -101.59 -106.66 -117.20 -145.24 178.56 148.54 128.09 102.85 88.75 71.98 63.00 50.30 42.50 33.20 MGA-12516 Typical Scattering and Noise parameters Reference planes at package pins, measured at TA = +25 °C, VDD = 4V, IDD = 50mA per channel. FREQ (GHz) S11 Mag 0.1 0.5 0.7 0.9 1.1 1.5 1.7 1.9 2.1 2.5 2.7 2.9 3.3 3.5 3.9 4.7 5.5 6.1 6.5 7.1 7.5 8.1 8.5 9.1 9.5 10 0.97 0.83 0.75 0.69 0.63 0.56 0.53 0.52 0.49 0.48 0.47 0.46 0.46 0.46 0.46 0.48 0.54 0.64 0.68 0.70 0.74 0.80 0.83 0.86 0.86 0.86 11 Ang S21 Mag -8.41 -37.03 -47.45 -55.83 -62.45 -74.23 -79.16 -83.93 -84.50 -94.89 -100.24 -105.13 -116.94 -123.70 -137.65 -168.07 157.80 130.77 112.56 92.09 82.58 66.61 58.96 45.63 39.65 31.95 35.51 28.17 24.62 21.50 18.87 15.09 13.69 12.61 11.48 10.02 9.34 8.89 8.03 7.76 7.20 6.53 5.90 5.37 4.81 3.66 3.05 2.35 2.01 1.53 1.31 1.08 Ang S12 Mag 168.94 128.32 114.02 101.47 90.84 72.01 63.70 56.02 47.68 32.89 25.97 18.85 5.22 -1.33 -15.34 -44.99 -79.27 -105.46 -126.29 -154.20 -169.37 169.71 157.44 138.63 127.90 115.89 0.00 0.00 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.02 0.02 0.02 0.02 0.02 0.03 0.05 0.07 0.08 0.08 0.09 0.09 0.09 0.10 0.10 0.10 Ang S22 Mag Ang 70.66 59.52 64.80 64.04 62.26 57.56 57.67 56.32 53.32 51.44 50.02 49.37 49.61 48.96 48.73 43.67 32.99 20.11 6.11 -11.43 -20.19 -34.04 -41.68 -53.42 -59.94 -68.20 0.88 0.82 0.81 0.80 0.80 0.80 0.80 0.80 0.78 0.78 0.78 0.78 0.76 0.77 0.76 0.83 0.88 0.93 0.93 0.94 0.93 0.95 0.94 0.94 0.94 0.94 -1.36 -16.83 -22.50 -28.27 -33.37 -44.30 -49.41 -54.93 -66.05 -76.85 -82.38 -88.01 -97.83 -102.56 -112.46 -138.95 -173.86 156.64 136.03 109.41 94.31 76.33 67.03 53.65 45.44 35.33 MGA-12516 Typical Scattering and Noise parameters Reference planes at package pins, measured at TA = +25 °C, VDD = 5V, IDD =50mA per channel. FREQ (GHz) S11 Mag 0.1 0.5 0.7 0.9 1.1 1.5 1.7 1.9 2.1 2.5 2.7 2.9 3.3 3.5 3.9 4.7 5.5 6.1 6.5 7.1 7.5 8.1 8.5 9.1 9.5 10 0.97 0.83 0.75 0.68 0.62 0.54 0.52 0.50 0.48 0.46 0.44 0.44 0.44 0.44 0.43 0.45 0.51 0.60 0.64 0.67 0.72 0.78 0.81 0.85 0.85 0.85 12 Ang S21 Mag -8.30 -37.22 -47.40 -55.80 -62.65 -73.90 -78.64 -83.19 -83.51 -93.34 -98.41 -102.90 -114.12 -120.51 -133.87 -163.65 162.57 135.17 117.25 95.74 86.15 69.36 61.39 48.03 41.90 33.92 35.83 28.27 24.78 21.53 18.91 15.16 13.72 12.59 11.50 10.04 9.30 8.91 8.04 7.79 7.23 6.60 6.03 5.58 5.09 3.94 3.31 2.56 2.19 1.67 1.45 1.18 Ang S12 Mag 168.76 128.38 114.23 101.54 90.90 72.40 64.13 56.52 48.39 33.96 26.98 19.98 6.61 0.37 -13.42 -42.62 -76.07 -102.32 -122.96 -151.73 -166.87 170.91 158.29 138.61 127.69 114.87 0.00 0.00 0.00 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.02 0.02 0.02 0.03 0.05 0.06 0.07 0.08 0.08 0.09 0.09 0.10 0.10 0.10 Ang S22 Mag Ang 112.69 66.07 63.18 61.61 62.92 59.20 58.37 56.71 58.16 53.84 54.40 52.62 52.71 52.33 53.13 48.59 39.22 26.22 12.31 -5.35 -14.66 -29.24 -37.32 -49.19 -56.12 -64.59 0.89 0.84 0.82 0.82 0.82 0.82 0.82 0.82 0.81 0.80 0.80 0.79 0.78 0.79 0.78 0.85 0.90 0.95 0.96 0.97 0.96 0.97 0.96 0.96 0.96 0.95 -1.60 -16.43 -21.81 -27.49 -32.49 -43.05 -48.24 -53.52 -64.64 -75.32 -80.86 -86.27 -95.78 -99.94 -109.76 -135.08 -169.14 161.74 141.01 113.61 97.90 78.93 69.21 55.44 46.88 37.11 Package Dimensions Pin 1 Dot by marking 2.200 Exp.DAP 0.30 0.20 Ref 4.00 ± 0.10 Pin #1 Identification Chamfer 0.450 x 45º 0.55 4.00 ± 0.10 KC2 YYWW XXXX 2.200 Exp.DAP 0.65 Bsc 0.00 ± 0.05 0.85 ± 0.05 Bottom View Side View Top View 1.95 Ref PCB Land Patterns and Stencil Design 0.650 0.300 0.650 0.270 2.400 0.650 2.160 0.485 2.400 0.250 2.160 Stencil Outline PCB Land Pattern (Top View) 2.400 2.160 0.650 0.300 2.160 0.270 0.485 Combines PCB & Stencil Layouts All Dimension are in MM 13 2.400 0.402 Device Orientation REEL USER FEED DIRECTION KC2 YYWW XXXX CARRIER TAPE USER FEED DIRECTION KC2 YYWW XXXX KC2 YYWW XXXX TOP VIEW COVER TAPE END VIEW Tape Dimensions … 1.50 + .10 8.0 ±0.10 2.00 ±0.05 1.75 ±0.10 4.0 ±0.10 + + + + 5.50 ±.05 12.00 +0.30/-0.10 … 1.50 +0.25 .279 ±0.02 10º MAX. 10º MAX. 1.13 ±0.10 4.25 ±0.10 Ao Ko Part Number Ordering Information Part Number No. of Devices Container MGA-12516-TR1G 1000 7” Reel MGA-12516-TR2G 3000 13” Reel MGA-12516-BLKG 100 antistatic bag 14 4.25 ±0.10 Bo Reel Dimension - 7 inch 6.25mm EMBOSSED LETTERS LETTERING THICKNESS: 1.6mm SLOT HOLE "a" SEE DETAIL "X" Ø178.0±0.5 SLOT HOLE "b" FRONT BACK 6 PS SLOT HOLE(2x) 180° APART. SLOT HOLE "a": 3.0±0.5mm(1x) SLOT HOLE "b": 2.5±0.5mm(1x) FRONT VIEW 45° 1.5 MIN. +1.5* -0.0 +0.5 Ø13.0 -0.2 Ø20.2 MIN. 45° EMBOSSED RIBS RAISED: 0.25mm, WIDTH: 1.25mm BACK VIEW 15 BACK Ø55.0±0.5 FRONT Ø178.0±0.5 Ø51.2±0.3 SEE DETAIL "Y" 18.0* MAX. DETAIL "X" Ø178.0±0.5 R5.2 ° R10.65 120 65° 12.4 3.5 DETAIL "Y" (Slot Hole) 1.0 6 PS RECYCLE LOGO Reel Dimension - 13 inch 11 12 1 2 3 4 0 2 10 9 7 6 5 DATE CODE 12MM 8 EMBOSSED LETTERING 16.0mm HEIGHT x MIN. 0.4mm THICK. Ø329.0±1.0 HUB Ø100.0±0.5 6 PS 02 12 12 10 911 876534 MP N CPN EMBOSSED LETTERING 7.5mm HEIGHT EMBOSSED LETTERING 7.5mm HEIGHT 1.5 (MI N.) FRONT VIEW EMBOSSED LINE (2x) 89.0mm LENGTH LINES 147.0mm AWAY FROM CENTER POINT +0.5 -0.2 20.2(MIN.) Ø13.0 11.9-15.4** +2.0* 12.4 -0.0 Ø16.0 ESD LOGO 6 PS RECYCLE LOGO Detail "X" SEE DETAIL "X" Ø100.0±0.5 Ø329.0±1.0 6 PS R19.0±0.5 BACK VIEW SLOT 5.0±0.5(3x) Ø12.3±0.5(3x) For product information and a complete list of distributors, please go to our web site: 18.4 MAX.* www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved. AV02-1052EN - March 24, 2009