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Accu-F® / Accu-P® Thin-Film Technology THE IDEAL CAPACITOR The non-ideal characteristics of a real capacitor can be ignored at low frequencies. Physical size imparts inductance to the capacitor and dielectric and metal electrodes result in resistive losses, but these often are of negligible effect on the circuit. At the very high frequencies of radio communication (>100MHz) and satellite systems (>1GHz), these effects become important. Recognizing that a real capacitor will exhibit inductive and resistive impedances in addition to capacitance, the ideal capacitor for these high frequencies is an ultra low loss component which can be fully characterized in all parameters with total repeatability from unit to unit. Until recently, most high frequency/microwave capacitors were based on fired-ceramic (porcelain) technology. Layers of ceramic dielectric material and metal alloy electrode paste are interleaved and then sintered in a high temperature oven. This technology exhibits component variability in dielectric quality (losses, dielectric constant and insulation resistance), variability in electrode conductivity and variability in physical size (affecting inductance). An alternate thin-film technology has been developed which virtually eliminates these variances. It is this technology which has been fully incorporated into Accu-F® and Accu-P® to provide high frequency capacitors exhibiting truly ideal characteristics. The main features of Accu-F® and Accu-P® may be summarized as follows: • High purity of electrodes for very low and repeatable ESR. • Highly pure, low-K dielectric for high breakdown field, high insulation resistance and low losses to frequencies above 40GHz. • Very tight dimensional control for uniform inductance, unit to unit. • Very tight capacitance tolerances for high frequency signal applications. This accuracy sets apart these Thin-Film capacitors from ceramic capacitors so that the term Accu has been employed as the designation for this series of devices, an abbreviation for “accurate.” THIN-FILM TECHNOLOGY Thin-film technology is commonly used in producing semiconductor devices. In the last two decades, this technology has developed tremendously, both in performance and in process control. Today’s techniques enable line definitions of below 1μm, and the controlling of thickness of layers at 100Å (10-2μm). Applying this technology to the manufacture of capacitors has enabled the development of components where both electrical and physical properties can be tightly controlled. The thin-film production facilities at AVX consist of: • Class 1000 clean rooms, with working areas under laminar-flow hoods of class 100, (below 100 particles per cubic foot larger than 0.5μm). • High vacuum metal deposition systems for high-purity electrode construction. • Photolithography equipment for line definition down to 2.0μm accuracy. • Plasma-enhanced CVD for various dielectric depositions (CVD=Chemical Vapor Deposition). • High accuracy, microprocessor-controlled dicing saws for chip separation. • High speed, high accuracy sorting to ensure strict tolerance adherence. 1 TERMINATION ALUMINA ELECTRODE SEAL ELECTRODE DIELECTRIC ALUMINA ACCU-P® CAPACITOR 6 Accu-F® / Accu-P® Thin-Film Chip Capacitors ACCU-F® TECHNOLOGY The use of very low-loss dielectric materials, silicon dioxide and silicon oxynitride, in conjunction with highly conductive electrode metals results in low ESR and high Q. These high-frequency characteristics change at a slower rate with increasing frequency than for ceramic microwave capacitors. Because of the thin-film technology, the above-mentioned frequency characteristics are obtained without significant compromise of properties required for surface mounting. The main Accu-F® properties are: • Internationally agreed sizes with excellent dimensional control. • Small size chip capacitors (0603) are available. • Tight capacitance tolerances. • Low ESR at VHF, UHF and microwave frequencies. • High stability with respect to time, temperature, frequency and voltage variation. • Nickel/solder-coated terminations to provide excellent solderability and leach resistance. ACCU-P® TECHNOLOGY As in the Accu-F® series the use of very low-loss dielectric materials (silicon dioxide and silicon oxynitride) in conjunction with highly conductive electrode metals results in low ESR and high Q. At high frequency these characteristics change at a slower rate with increasing frequency than conventional ceramic microwave capacitors. Using thin-film technology, the above-mentioned frequency characteristics are obtained without significant compromise of properties required for surface mounting. The use of high thermal conductivity materials results in excellent RF power handling capabilities. The main Accu-P® properties are: • Enhanced RF power handling capability. • Improved mechanical characteristics. • Internationally agreed sizes with excellent dimensional control. • Ultra Small size chip capacitors (0201) are available. • Tight capacitance tolerances. • Low ESR at UHF, VHF, and microwave frequencies. • High-stability with respect to time, temperature, frequency and voltage variation. • High temperature nickel/solder-coated terminations as standard to provide excellent solderability and leach resistance. 1 ACCU-F® FEATURES Accu-F® meets the fast-growing demand for low-loss (high-Q) capacitors for use in surface mount technology especially for the mobile communications market, such as cellular radio of 450 and 900 MHz, UHF walkie-talkies, UHF cordless telephones to 2.3 GHz, low noise blocks at 11-12.5 GHz and for other VHF, UHF and microwave applications. Accu-F® is currently unique in its ability to offer very low capacitance values (0.1pF) and very tight capacitance tolerances (±0.05pF). Typically Accu-F® will be used in small signal applications in VCO’s, matching networks, filters, etc. Inspection test and quality control procedures in accordance with ISO 9001, CECC, IECQ and USA MIL Standards yield products of the highest quality. ACCU-P® FEATURES • Minimal batch to batch variability of parameters at high frequency. • The Accu-P® has the same unique features as the Accu-F® capacitor such as low ESR, high Q, availability of very low capacitance values and very tight capacitance tolerances. • The RF power handling capability of the Accu-P® allows for its usage in both small signal and RF power applications. • Inspection, test and quality control procedures in accordance with ISO 9001, CECC, IECQ and USA MIL Standards guarantee product of the highest quality. • Hand soldering Accu-P®: Due to their construction utilizing relatively high thermal conductivity materials, Accu-P’s have become the preferred device in R & D labs and production environments where hand soldering is used. Accu-P’s are available in all sizes and are electrically identical to their Accu-F counterparts. APPLICATIONS Cellular Communications CT2/PCN (Cordless Telephone/Personal Comm. Networks) Satellite TV Cable TV GPS (Global Positioning Systems) Vehicle Location Systems Vehicle Alarm Systems Paging Military Communications Radar Systems Video Switching Test & Measurements Filters VCO’s Matching Networks APPLICATIONS Cellular Communications CT2/PCN (Cordless Telephone/Personal Comm. Networks) Satellite TV Cable TV GPS (Global Positioning Systems) Vehicle Location Systems Vehicle Alarm Systems Paging Military Communications Radar Systems Video Switching Test & Measurements Filters VCO's Matching Networks RF Amplifiers APPROVALS ISO 9001 APPROVALS ISO 9001 7 Accu-F® */ Accu-P® Thin-Film Chip Capacitors for RF Signal and Power Applications B1 W T B2 1 L ACCU-P® (Signal and Power Type Capacitors) 0201 0.60±0.05 L (0.023±0.002) 0.325±0.050 W (0.0128±0.002) 0.225±0.050 T (0.009±0.002) 0.10±0.10 B1 (0.004±0.004) 0.15±0.05 B2 (0.006±0.002) ACCU-F® *(Signal Type Capacitors) 0603 L W T B 1.60±0.1 (0.063±0.004) 0.81±0.1 (0.032±0.004) 0.63±0.1 (0.025±0.004) 0.30±0.1 (0.012±0.004) 0402* 1.00±0.1 (0.039±0.004) 0.55±0.07 (0.022±0.003) 0.40±0.1 (0.016±0.004) 0.00 +0.1 -0.0 (0.000+0.004) -0.000 0.20±0.1 (0.008±0.004) 0603* 1.60±0.1 (0.063±0.004) 0.81±0.1 (0.032±0.004) 0.63±0.1 (0.025±0.004) 0.35±0.15 (0.014±0.006) 0.35±0.15 (0.014±0.006) 0805* 2.01±0.1 (0.079±0.004) 1.27±0.1 (0.050±0.004) 0.93±0.2 (0.036±0.008) 0.30±0.1 (0.012±0.004) 0.30±0.1 (0.012±0.004) 1210 3.02±0.1 (0.119±0.004) 2.5±0.1 (0.100±0.004) 0.93±0.2 (0.036±0.008) 0.43±0.1 (0.017±0.004) 0.43±0.1 (0.017±0.004) 0805 2.01±0.1 (0.079±0.004) 1.27±0.1 (0.050±0.004) 0.63±0.1 (0.025±0.004) 0.30±0.1 (0.012±0.004) DIMENSIONS: millimeters (inches) *Not recommended for new designs. Accu-P’s are recommended. *Mount Black Side Up A Tolerance for C≤2.0pF* P = ±0.02pF Q = ±0.03pF A = ±0.05pF B = ±0.1pF C = ±0.25pF DIMENSIONS: millimeters (inches) HOW TO ORDER 0402 Size 0201* 0402* 0603 0805 1210* * Accu-P ONLY 3 Voltage 1 = 100V 5 = 50V 3 = 25V Y = 16V Z = 10V J Temperature Coefficient (1) 4R7 Capacitance B Specification Code A = Accu-F® technology B = Accu-P® technology S Termination Code TR Packaging Code Capacitance J = 0±30ppm/°C expressed in pF. (-55°C to (2 significant +125°C) digits + number K = 0±60ppm/°C of zeros) (-55°C to for values +125°C)