CM05X5R475M25AH

Multilayer Ceramic Chip Capacitors ■Features RoHS Compliant ●Kyocera's series of Multilayer Ceramic Chip Capacitors are designed to meet a wide variety of needs. We offer a complete range of products for both general and specialized applications. ●We have a network worldwide in order to supply our global customer bases quickly and efficiently. ●All our products are highly reliable due to their monolithic structure of high-purity and superfine uniform ceramics and their integral internal electrodes. ●Our stringent quality control in every phase of production from material procurement to shipping ensures consistent manufacturing and superior quality. ●Kyocera components are available in a wide choice of dimensions, temperature characteristics, rated voltages, and terminations to meet specific configurational requirements. ■KYOCERA PART NUMBER CM 03 X5R 225 M 06 A H □□□ ① ② ③ ①SERIES CODE CODE Type CM General CT Low Profile CU High-Q KNH Three Terminal Capacitors ④ ⑤ ⑥ ⑦ ⑧ OPTION ： ②SIZE CODE CODE 02 03 05 105 21 316 32 EIA 01005 0201 0402 0603 0805 1206 1210 Above digits are used to track individual specification or thickness. JIS 0402 0603 1005 1608 2012 3216 3225 ③DIELECTRIC CODE Temperature Compensation Type Temperature CODE ppm/℃ Range （℃） ±30 CG -55 to 125 0 ±60 CH ・ All parts of C0G will be marked as “CG” but will conform to the above table. ・ Temperature coefficients are determined by calculation based on measurement at 20℃ and 85℃. CODE X5R X6S X6T X7R X7S X7T ⑤TOLERANCE CODE Temperature Compensation Type （C0G） CODE Tolerance ±0.05pF A* ±0.1pF B ±0.25pF C ±0.5pF D ±2% G* ±5% J ±10% K * ： Option High Dielectric Constant Type Temperature Standard △C max. （%） Range （℃） Temperature （℃） -55 to 85 ±15 ±22 -55 to 105 +22/-33 25 ±15 -55 to 125 ±22 +22/-33 ⑥VOLTAGE CODE CODE 02 04 06 10 16 25 35 50 100 Rated Vltage 2.5Vdc 4Vdc 6.3Vdc 10Vdc 16Vdc 25Vdc 35Vdc 50Vdc 100Vdc ④CAPACITANCE CODE Capacitance expressed in pF. Two significant digits plus number of zeros. For Values < 10pF, Letter R denotes decimal point, (Example) CODE Capacitance R50 0.5pF 1R0 1pF 100 10pF 101 100pF 102 1nF 103 10nF 104 100nF 105 1µF 106 10µF 107 100µF ⑦TERMINATION CODE CODE A (Example) ①Series ： CM Series(General) ②Size ： 0201 ③Dielectric ： X5R ④Capacitance ： 2.2µF ⑤Tolerance ： ±20％ ⑥Voltage ： 6.3Vdc ⑦Termination ： Sn ⑧Packaging ： Cavity pitch 2mm / Reel Size φ180 Termination Nickel Barrier/ Tin ・ Please contact us if Au termination is needed. E STANDARD NUMBER E3 E6 E12 E24 1.0 1.0 1.1 1.0 1.2 1.2 1.3 1.0 1.5 1.5 1.6 1.5 1.8 1.8 2.0 2.2 2.2 2.4 2.2 2.7 2.7 3.0 2.2 3.3 3.3 3.6 3.3 3.9 3.9 4.3 4.7 4.7 5.1 4.7 5.6 5.6 6.2 4.7 6.8 6.8 7.5 6.8 8.2 8.2 9.1 ⑧PACKAGING CODE CODE T H Q P L N W Size Code 105 to 32 02 to 05 03/05 02 105 to 32 02 to 05 03/05 Cavity pitch Reel size 4mm 2mm φ180 1mm 1mm 4mm φ330 2mm 1mm High Dielectric Constant Type (X5R/X6S/X6T/X7R/X7S/X7T) CODE Tolerance ±5% J* ±10% K ±20% M * ： Option CATM2110MH29090E As of October 2021 Multilayer Ceramic Chip Capacitor Dimension ■CM/CT/CU Series ■ Packaging Code 20kp （ E 8 / 2 ） L � kp means Taping Material 1000 pieces Code Material Plas�c E Paper P T P Size 02 03 05 105 EIA P～P Code 01005 0201 JIS Dimension Code L W 0402 A 0.4±0.02 0.2±0.02 0.6±0.03 0.3±0.03 0.6±0.05 0.3±0.05 0.6±0.09 0.3±0.09 A B C D E F A B C D E F G H J K A B C D B C E F A B C A 1005 0603 1608 21 0805 2012 316 1206 3216 32 1210 3225 Pitch Code 1 2 4 Pitch 1mm 2mm 4mm P 0603 0402 Taping Width Code Width 4mm 4 8mm 8 1.0±0.05 0.5±0.05 1.0±0.10 1.0±0.15 0.5±0.05 0.5±0.15 1.0±0.20 0.5±0.20 1.6±0.10 0.8±0.10 1.6±0.15 1.6±0.20 2.0±0.10 2.0±0.15 0.8±0.15 0.8±0.20 1.25±0.10 1.25±0.15 2.0±0.20 1.25±0.20 3.2±0.20 3.2±0.30 3.2±0.30 1.6±0.15 1.6±0.20 1.6±0.30 2.5±0.20 Dimension (mm) T P min. P max. P to P min. 0.2±0.02 0.07 0.14 0.13 0.10 0.20 0.13 0.23 0.22 max. 0.3±0.03 0.3±0.05 0.22 max. 0.3±0.09 0.5±0.05 0.22 max. 0.33 max. 0.5±0.05 0.22 max. 0.5±0.15 0.33 max. 0.50 max. 0.55 max. 0.5±0.20 0.80 max. 0.55 max. 0.8±0.10 0.8±0.15 0.8±0.20 1.25±0.10 0.95 max. 0.95 max. 1.25±0.20 1.6±0.15 1.6±0.20 1.6±0.30 2.5±0.20 0.15 0.20 0.35 0.60 Quantity per reel φ180 Reel φ330 Reel 40kp（E4/1） 20kp（P8/2） 80kp（P8/2） 0.20 30kp（P8/1） 15kp（P8/2） 150kp（P8/1） 50kp（P8/2） 0.19 15kp（P8/2） 50kp（P8/2） ー 10kp（P8/2） ー 20kp（P8/1） 10kp（P8/2） 100kp（P8/1） 50kp（P8/2） 10kp（P8/2） 10kp（P8/2） 10kp（P8/2） 10kp（P8/2） 10kp（P8/2） 10kp（P8/2） 10kp（P8/2） 50kp（P8/2） 40kp（P8/2） 0.50 4kp（P8/4） 10kp（P8/4） 10kp（E8/4） 10kp（P8/4） 10kp（P8/4） 10kp（E8/4） 0.30 ー 50kp（P8/2） ー 40kp（P8/2） 30kp（P8/2） 0.20 0.75 0.70 3kp（E8/4） 4kp（P8/4） 4kp（P8/4） 3kp（E8/4） 0.30 0.85 1.40 2.5kp（E8/4） 5kp（E8/4） 0.30 0.30 0.85 1.00 1.90 1.40 2kp（E8/4） 1kp（E8/4） 4kp（E8/4） ー ■KNH Series L W R IN/ OUT IN/ OUT T P Size KNH 05 G Code EIA JIS 0402 1005 P Dimension Code A B C L 1.0±0.10 1.0±0.15 1.0±0.20 W 0.5±0.20 0.5±0.15 0.5±0.20 Dimension (mm) T 0.5 max. 0.5±0.15 0.5±0.20 Packaging G P R φ180 Reel φ330 Reel 0.3±0.10 0.15±0.10 ≧0.05 10kp(P8/2) ー CATM2110MH29090E As of October 2021 CT Series Low Profile CT Series 【RoHS Compliant Products】 ■Features This low profile series is ideal where height clearance is limited ■Applications Circuits requiring a compact, low-profile design, such as module and memory cards. X5R Dielectric Part Number List ： P24 ●Capacitance chart Standard Spec.1 CT03 CT05 CT105 Size (EIA Code) （0201） （0402） （0603） Rated Voltage（Vdc） Capacitance 104 224 474 105 225 475 106 0.10 µF 0.22 µF 0.47 µF 1.0 µF 2.2 µF 4.7 µF 10 µF 6.3 6.3 Standard Spec.2 CT21 （0805） 16 16 50 A8 A8 B8 E3 C8 F9 ＜Standard Capacitor Value ： E3 Series＞ Please contact for capacitance value other than standard. Please refer here for the test method and specifications of Standard Specification 1. Please refer here for the test method and specifications of Standard Specification 2. Tan δ Code 3 Two digits alphanumerics in capacitance chart denote dimensions and tan δ. Please refer to the above table for detail. 8 (Example) In case of "A8" for CT03; L: 0.6±0.03mm, W: 0.3±0.03mm, T: 0.22mm max., Tanδ: 12.5% max. Size Dimension Code 03 A 05 105 21 9 Dimension (mm) L W T 0.6±0.03 0.3±0.03 0.22 max. B 1.0±0.05 0.5±0.05 0.33 max. F A C E 1.0±0.20 1.6±0.10 2.0±0.15 2.0±0.20 0.5±0.20 0.8±0.10 1.25±0.15 1.25±0.20 0.33 max. 0.55 max. 0.95 max. 0.95 max. Code Quantity Q H Q H H T T T 30,000 15,000 20,000 10,000 10,000 4,000 4,000 4,000 φ180 Reel Taping Material Paper Paper Paper Paper Paper Paper Paper Paper Packaging Taping Width 8mm 8mm 8mm 8mm 8mm 8mm 8mm 8mm Cavity Pitch 1mm 2mm 1mm 2mm 2mm 4mm 4mm 4mm Code W N W N － L L L X6T Dielectric 0.10 µF 0.22 µF 0.47 µF 1.0 µF 2.2 µF 4.7 µF 10 µF 4 2.5 D8 4 D8 G8 Two digits alphanumerics in capacitance chart denote dimensions and tan δ. Please refer to the above table for detail. (Example) In case of "D8" for CT03; L: 0.6±0.09mm, W: 0.3±0.09mm, T: 0.22mm max., Tanδ: 12.5% max. Dimension Code 03 D D G 05 Cavity Pitch 1mm 2mm 1mm 2mm － 4mm 4mm 4mm CT05 （0402） ＜Standard Capacitor Value ： E3 Series＞ Please contact for capacitance value other than standard. Size 15.0% max. Optional Spec. CT03 Size (EIA Code) （0201） 104 224 474 105 225 475 106 Taping Width 8mm 8mm 8mm 8mm － 8mm 8mm 8mm 5.0% max. 12.5% max. Part Number List ： P24 ●Capacitance chart Rated Voltage（Vdc） Capacitance φ330 Reel Taping Material 150,000 Paper 50,000 Paper 100,000 Paper 50,000 Paper － － 10,000 Paper 10,000 Paper 10,000 Paper Quantity Tan δ Dimension (mm) L W T Code 0.6±0.09 1.0±0.10 1.0±0.20 0.3±0.09 0.5±0.05 0.5±0.20 0.22 max. 0.22 max. 0.50 max. H H H φ180 Reel Taping Quantity Material 15,000 Paper 10,000 Paper 10,000 Paper Packaging Taping Width 8mm 8mm 8mm Cavity Pitch 2mm 2mm 2mm Code Quantity N N N 50,000 50,000 50,000 φ330 Reel Taping Material Paper Paper Paper Tan δ Code Tan δ 8 12.5% max. Taping Width 8mm 8mm 8mm Cavity Pitch 2mm 2mm 2mm CATM2110MH29090E As of October 2021 Multilayer Ceramic Chip Capacitors Test Conditions and Standards Test Conditions and Specifications for High Dielectric Type (X5R, X7R, X7S) CM / CT Series (Standard Spec.1) Test Items Test Conditions Capacitance Value (C) Measure after heat treatment Capacitance C≤10µF Tanδ C>10µF Insulation Resistance (IR) Dielectric Resistance Appearance Termination Strength Bending Strength Vibration Test Soldering Heat Resistant Appearance ΔC Tanδ Appearance ΔC Tanδ IR Withstanding Voltage Solderablity Temperature Cycle Appearance ΔC Tanδ IR Withstanding Voltage Moisture Appearance Resistant Load ΔC Tanδ HighTemperature Load IR Appearance ΔC Tanδ IR Frequency 1kHz ±10% *1kHz±10% 120Hz±10% Specifications Within tolerance Volt 1.0±0.2Vrms 0.5±0.2Vrms 0.5±0.2Vrms *CM02X5R104□06A# The charge and discharge current of the capacitor must not exceed 50mA. Apply the rated voltage for 1 minute, and measure it in normal temperature and humidity. The charge and discharge current of the capacitor must not exceed 50mA. Apply *2.5 times of the rated voltage for 1 to 5 seconds. *CM316X5R225, CM316X7S225/100V: twice The charge and discharge current of the capacitor must not exceed 50mA. Microscope Apply a sideward force of 500g (5N) to a PCB-mounted sample. note : 2N for 0201 size, and 1N for 01005 size. Exclude CT series with thickness of less than 0.66mm. Glass epoxy PCB: Fulcrum spacing: 90mm, duration time 10 seconds. Exclude CT series with thickness of less than 0.66mm. Take the initial value after heat treatment. Vibration frequency: 10 to 55 (Hz) Amplitude: 1.5mm Sweeping condition: 10→55→10Hz/ 1 minute in X, Y and Z directions: 2 hours each, 6 hours in total, and place in normal temperature and humidity, then measure the sample after heat treatment. Take the initial value after heat treatment. Soak the sample in 260℃±5℃ solder for 10±0.5 seconds and place in normal temperature and humidity, and measure after heat treatment. (Pre-heating conditions) Order 1 2 Temperature 80 to 100℃ 150 to 200℃ Time 2 minutes 2 minutes Refer to capacitance chart Over 10000MΩ or 500MΩ・µF, whichever is less No problem observed No problem observed No problem observed No significant damage with 1mm bending No problem observed Within tolerance Within tolerance No problem observed Within±7.5% Within tolerance Over 10000MΩ or 500MΩ・µF, whichever is less The charge and discharge current of the capacitor must not exceed 50mA for IR and withstanding voltage measurement. Soaking condition Sn-3Ag-0.5Cu 245±5℃ 3±0.5 sec. 2±0.5 sec. Sn63 Solder 235±5℃ Take the initial value after heat treatment. (Cycle) Room temperature (3 min.)→ Lowest operation temperature (30 min.)→ Room temperature (3 min.)→ Highest operation temperature(30 min.) After 5 cycles, measure after heat treatment. The charge and discharge current of the capacitor must not exceed 50mA for IR and withstanding voltage measurement. Take the initial value after heat treatment. After applying rated voltage for 500+12/ −0 hours in the condition of 40℃±2℃ and 90 to 95%RH, and place in normal temperature and humidity, then measure the sample after heat treatment. The charge and discharge current of the capacitor must not exceed 50mA for IR measurement. Take the initial value after heat treatment. After applying *twice the rated voltage at the highest operation temperature for 1000+12/ −0 hours, and measure the sample after heat treatment in normal temperature and humidity. The charge and discharge current of the capacitor must not exceed 50mA for IR measurement. *Apply 1.5 times when the rated voltage is 10V or less. Applied voltages for respective products are indicated in the chart below. Resist without problem Solder coverage : 95% min. No problem observed Within±7.5% Within tolerance Over 10000MΩ or 500MΩ・µF, whichever is less Resist without problem No problem observed Within±12.5% 200% max. of initial value Over 500MΩ or 25MΩ・µF, whichever is less No problem observed Within±12.5% 200% max. of initial value Over 1000MΩ or 50MΩ・µF, whichever is less Expose sample in the temperature of 150+0/ −10℃ for 1 hour and leave the sample in normal temperature and humidity for 24±2 hours. Heat treatment Voltage to be applied in the High Temperature Load (Applied voltage is the multiple of the rated voltage) Applied Voltage Rated Voltage ×1.0 ×1.3 10V 100V 6.3V 16V ×1.5 25V 50V Products CM02X5R104 CM316X5R225, CM316X7S225 CM02X5R153-104, CT03X5R104 CM02X5R101-103, CM05X5R224, CM105X5R225, CM21X5R106, CM316X5R226, CM02X7R101-222, CM105X7R105, CM316X7R106, CM32X7R226, CT105X5R105, CT21X5R475 CM03X5R332-103, CM105X5R105, CM21X5R225-475, CM316X5R106, CM32X5R106-226, CM05X7R104, CM21X7R105-225, CM316X7R475, CM32X7R106 CM21X5R105, CM316X5R475, CM32X5R106, CM21X7R105, CM32X7R106, CT21X5R225, Please contact us for the optional specifications of the capacitance chart. CATM2110MH29090E As of October 2021 Multilayer Ceramic Chip Capacitors Test Conditions and Standards Test Conditions and Specifications for High Dielectric Type (X5R, X6S, X7R, X7S, X7T) CM / CT Series (Standard Spec.2) Test Items Capacitance Value (C) Test Conditions Measure after heat treatment Capacitance Frequency 1kHz ±10% *1kHz±10% 120Hz±10% C≤10µF Specifications Within tolerance Volt 1.0±0.2Vrms 0.5±0.2Vrms 0.5±0.2Vrms C>10µF *CM02X5R474M06A#, CM03X5R225□06A#, Tanδ Refer to capacitance chart CM03X5R225M06A#035, CM03X5R475M06A#055, CM03X5R475M04A#, CM05X5R106M06A#, CT05X5R475M06A#033 Insulation Resistance (IR) Dielectric Resistance Appearance Termination Strength Bending Strength Vibration Test Appearance ΔC Tanδ Soldering Heat Resistant Appearance ΔC Tanδ IR Withstanding Voltage Solderablity Temperature Cycle Appearance ΔC Tanδ IR Withstanding Voltage Moisture Appearance Resistant Load ΔC Tanδ HighTemperature Load IR Appearance ΔC Tanδ IR Heat treatment The charge and discharge current of the capacitor must not exceed 50mA. Apply the rated voltage for 1minute, and measure it in normal temperature and humidity. The charge and discharge current of the capacitor must not exceed 50mA. Apply *2.5 times of the rated voltage for 1 to 5 seconds. *CM21X7S105, CM316X7S475/100V: twice The charge and discharge current of the capacitor must not exceed 50mA. Microscope Apply a sideward force of 500g (5N) to a PCB-mounted sample. note : 2N for 0201 size, and 1N for 01005 size. Exclude CT series with thickness of less than 0.66mm. Glass epoxy PCB: Fulcrum spacing: 90mm, duration time 10 seconds. Exclude CT series with thickness of less than 0.66mm. Take the initial value after heat treatment. Vibration frequency: 10 to 55 (Hz) Amplitude: 1.5mm Sweeping condition: 10→55→10Hz/ 1 minute in X, Y and Z directions: 2 hours each, 6 hours in total, and place in normal temperature and humidity, then measure the sample after heat treatment. Take the initial value after heat treatment. Soak the sample in 260℃±5℃ solder for 10±0.5 seconds and place in normal temperature and humidity, and measure after heat treatment. (Pre-heating conditions) Order 1 2 Temperature 80 to 100℃ 150 to 200℃ Time 2 minutes 2 minutes Over 50MΩ・µF No problem observed No problem observed No problem observed No significant damage with 1mm bending No problem observed Within tolerance Within tolerance No problem observed Within±7.5% Within tolerance Over 50MΩ・µF The charge and discharge current of the capacitor must not exceed 50mA for IR and withstanding voltage measurement. Soaking condition Resist without problem Take the initial value after heat treatment. (Cycle) Room temperature (3 min.)→Lowest operation temperature (30 min.)→Room temperature (3 min.)→Highest operation temperature(30 min.) After 5 cycles, measure after heat treatment. The charge and discharge current of the capacitor must not exceed 50mA for IR and withstanding voltage measurement. No problem observed Sn-3Ag-0.5Cu Sn63 Solder 245±5℃ 235±5℃ 3±0.5 sec. 2±0.5 sec. Solder coverage : 95% min. Within±7.5% Within tolerance Over 50MΩ・µF Resist without problem Take the initial value after heat treatment. After applying rated voltage for 500+12/ −0 hours in the condition of 40℃±2℃ and 90 to 95%RH, and place in normal temperature and humidity, then measure the sample after heat treatment. The charge and discharge current of the capacitor must not exceed 50mA for IR measurement. Take the initial value after heat treatment. After applying *□ times the rated voltage at the highest operation temperature for 1000+12/ −0 hours, and measure the sample after heat treatment in normal temperature and humidity. The charge and discharge current of the capacitor must not exceed 50mA for IR measurement. *Apply 1.0 times when the rated voltage is 4V or less. Applied voltages for respective products are indicated in the chart below. No problem observed Within±12.5% 200% max. of initial value Over 10MΩ・µF No problem observed Within±12.5% 200% max. of initial value Over 10MΩ・µF Expose sample in the temperature of 150+0/ −10℃ for 1 hour and leave the sample in normal temperature and humidity for 24±2 hours. Voltage to be applied in the High Temperature Load (Applied voltage is the multiple of the rated voltage) Applied Rated Voltage Voltage 6.3V 10V ×1.0 16V 25V 35V 100V Products CM02X5R224, CM02X5R474, CM03X5R225, CM03X5R475, CM05X5R106 CM05X5R156, CM05X5R226, CM21X5R476, CM03X6S105, CM105X6S226 CT05X5R105, CT05X5R225, CT05X5R475 CM03X5R225, CM105X5R226, CM21X6S226 CM03X5R105, CM05X5R225, CM05X5R475, CM105X5R226 CM21X6S226, CM21X7R475 CM05X5R105, CM05X5R225, CM05X5R475,CM105X5R475 CM105X5R106, CM21X5R226 CM05X5R105, CM105X5R475, CM105X5R106 CM21X7S105, CM316X7S475 Please contact us for the optional specifications of the capacitance chart. 12 Applied Rated Voltage Voltage ×1.2 ×1.3 6.3V 6.3V 10V 16V 6.3V ×1.5 10V 25V 50V Products CM03X5R105 CM03X5R474 CM03X5R223-224, CM05X5R105-225 CM05X5R105 CM21X6S226, CM05X7S105 CM105X7T106, CM21X7T226 CM05X5R474, CM05X5R475, CM21X5R226 CM105X6S106, CM105X7T475 CM105X7R105, CM316X7R106 CM316X7R475 CATM2110MH29090E As of October 2021 Multilayer Ceramic Chip Capacitors Test Conditions and Standards Substrate for Adhesion Strength Test, Vibration Test, Soldering Heat Resistance Test, Temperature Cycle Test,Load Humidity Test, High-Temperature with Loading Test. Size (EIA Code) c a b (Unit: mm) a b c 02 (01005) 0.15 0.50 0.20 03 (0201) 0.26 0.92 0.32 05 (0402) 0.4 1.4 0.5 105 (0603) 1.0 3.0 1.2 21 (0805) 1.2 4.0 1.65 316 (1206) 2.2 5.0 2.0 32 (1210) 2.2 5.0 2.9 Substrate for Bending Test (Unit: mm) R5 Pressure a 1±0.1 Tes�ng Board Support φ5mm c 40 Soldering b 100 1.6* 90mm Tes�ng Table Tes�ng Board : Glass Epoxy Board (CE4 or FR4) Tes�ng Board Thickness : 1.6±0.2mm* Circuit Thickness : 0.04±0.01mm * 02, 03, 05 size 0.8±0.1mm ■Structure Plated Termina�on Internal Electrodes(Pd or Ni or Cu) Dielectric Ceramic Layer Temperature compensa�on: Titanate family Zirconate family High dielectric constant: Barium Titanate family External Termination Electrodes (Ag or Cu or CuNi) Ni Plating Sn Plating About official Standards Certification ・The sites that manufacture the products listed in this catalog have acquired ISO 9001 quality management system (certification). ・The production site is Kagoshima Kokubu Plant. CATM2110MH29090E As of October 2021 Multilayer Ceramic Chip Capacitors Packaging Options Tape and Reel Reel  W2 E C B D R A W1 (Unit: mm) Code Reel 7-inch Reel (CODE: T, H, Q) 7-inch Reel (CODE: P) 13-inch Reel (CODE: L, N, W) Code Reel 7-inch Reel (CODE: T, H, Q) 7-inch Reel (CODE: P) 13-inch Reel (CODE: L, N, W) A 180 B C D φ60 min. 13±0.5 21±0.8 W1 W2 R 10.5±1.5 16.5 max. 4.35±0.3 6.95±1.0 9.5±1.0 16.5 max. +0 −2.0 178±2.0 330±2.0 E 2.0±0.5 1.0 Carrier Tape (Unit: mm) F=1mm (02 Size) F=2mm (02, 03, 05 Size) Punched rectangular hole to hold Feed Hole J (Plas�c) Feed Hole E (Paper) E A D B D C A Punched rectangular hole to hold capacitor J C B F F H J Parts inser�on cavity D B F F  02 Size: 0.4 max. 03 Size: 0.6 max. 0.8 max.*1) * 1)Applicable to product thickness of 0.5±0.05 05 Size: 0.8 max. 1.0 max.*2) * 2)Applicable to product thickness of 0.8max. F=4mm (105, 21, 316, 32 Size) (Paper) Punched rectangular hole to hold capacitor Feed Hole J E A H 0.5 max. F=1mm (02, 03, 05 Size) Feed Hole F E A C D B (Paper) C F H G Holes only for plas�c carrier tape. f 0.3 min. 02 Size: 0.4 max. 03 Size: 0.5 max. 05 Size: 0.75 max. H (Plas�c) 2.8 max. 0.6 max. 1.2 max. (Unit: mm) Size (EIA Code) 02 (01005)* 03 (0201)* 05 (0402)* 105 (0603)* 21 (0805) 316 (1206) 32 (1210) * Option A B C D E F 0.24±0.02 0.25±0.03 0.44±0.02 0.45±0.03 4.0±0.08 8.0±0.3 8.0+0.3/-0.1 8.0±0.3 8.0±0.3 8.0±0.3 8.0±0.3 8.0+0.3/-0.1 1.8±0.02 3.5±0.05 0.9±0.05 1.75±0.1 1.0±0.02 2.0±0.05 1.0±0.05 2.0±0.05 2.0±0.05 2.0±0.05 2.0±0.05 1.0±0.05 0.37±0.03 0.39±0.03 0.42±0.03 0.44±0.05 0.65±0.1 0.75±0.1 0.8±0.1 1.0±0.2 1.1±0.2 0.67±0.03 0.69±0.03 0.72±0.03 0.74±0.05 1.15±0.1 1.3±0.1 1.8±0.2 1.9±0.2 1.75±0.1 1.75±0.1 1.75±0.1 1.75±0.1 ー ー ー ー ー 1.5+0.1/-0 1.5+0.1/-0 1.5+0.1/-0 1.5+0.1/-0 1.75±0.1 8.0±0.3 8.0±0.3 8.0±0.3 3.5±0.05 3.5±0.05 3.5±0.05 1.75±0.1 1.75±0.1 1.75±0.1 2.0±0.05 4.0±0.1 4.0±0.1 4.0±0.1 2.0±0.05 4.0±0.1 1.5+0.1/-0 3.5±0.05 1.75±0.1 4.0±0.1 2.0±0.05 4.0±0.1 1.5+0.1/-0 2.3±0.2 8.0±0.3 2.0±0.2 3.6±0.2 8.0±0.3 3.6±0.2 3.5±0.05 3.5±0.05 3.5±0.05 ー H 2.0±0.04 4.0±0.1 4.0±0.05 4.0±0.1 4.0±0.1 4.0±0.1 4.0±0.1 4.0±0.05 3.5±0.05 8.0±0.3 1.5±0.2 2.9±0.2 3.5±0.05 G Carrier Tape J Width Material 0.8±0.04 4mm Plastic 1.5+0.1/-0 8mm Paper 8.0±0.3 3.5±0.05 3.5±0.05 1.75±0.1 1.75±0.1 2.0±0.05 4.0±0.1 ー ー 2.0±0.05 2.0±0.05 2.0±0.05 4.0±0.1 4.0±0.1 4.0±0.1 4.0±0.1 4.0±0.1 1.5+0.1/-0 1.5+0.1/-0 1.5+0.1/-0 1.5+0.1/-0 1.5+0.1/-0 8mm Paper 8mm Paper 8mm 8mm 8mm 8mm 8mm 8mm Paper Paper Plastic Paper Plastic Plastic CATM2110MH29090E As of October 2021 Multilayer Ceramic Chip Capacitors Packaging Options Detail of leader and trailer Empty Pockets Components Leader End Start 160mm min. 100mm min. 400mm min. Adhesive tape 1) T  he exfoliative strength when peeling off the top tape from the carrier tape by the method of the following figure shall be *0.1 to 0.7N. *02 Size: 0.1 to 0.5N 2) W  hen the top tape is peeled off, the adhesive stays on the top tape. 3) Chip capacitors will be in a state free without being stuck on the thermal adhesive tape. Peeling Direc�on Top Tape Exfolia�ng angle: 165 to 180 degrees to the carrier tape. Exfolia�ng speed: 300 mm/min. 165°to 180° Carrier Tape Unrolling Direc�on Carrier tape 1) Chip will not fall off from carrier tape or carrier tape will not be damaged by bending than within a radius of 25mm. 2) The chip are inserted continuously without any empty pocket. 3) Chip will not be mis-mounted because of too big clearance between components and cavity. Also the waste of carrier tape will not fill a nozzle hole of mounting machine. CATM2110MH29090E As of October 2021 Multilayer Ceramic Chip Capacitors Surface Mounting Information Dimensions for recommended typical land Since the amount of solder (size of fillet) to be used has direct influence on the capacitor after mounting, the sufficient consideration is necessary. When the amounts of solder is too much, the stress that a capacitor receives becomes larger. It may become the cause of a crack in the capacitor. When the land design of printed wiring board is considered, it is necessary to set up the form and size of land pattern so that the amount of solder is suitable. General Size (EIA Code) 02 (01005) (Unit: mm) Dimension L 0.4±0.02 0.6±0.05 05 (0402) 1.0±0.15 (General) W 0.2±0.02 0.6±0.03 03 (0201) 0.3±0.03 0.3±0.05 0.6±0.09 0.3±0.09 1.0±0.05 0.5±0.05 0.5±0.15 1.0±0.20 0.5±0.20 1.6±0.15 0.8±0.15 1.6±0.10 105 (0603) Land Pa�ern Sample capacitor 21 (0805) b 316 (1206) a Soldering resist 32 (1210) a b c 0.13 to 0.20 0.12 to 0.18 0.20 to 0.23 0.20 to 0.25 0.25 to 0.35 0.30 to 0.40 0.23 to 0.30 0.25 to 0.35 0.30 to 0.45 0.30 to 0.50 0.35 to 0.45 0.40 to 0.60 0.40 to 0.60 0.40 to 0.50 0.50 to 0.75 0.8±0.10 0.70 to 1.00 0.80 to 1.00 0.60 to 0.90 1.6±0.20 0.8±0.20 0.80 to 1.00 0.80 to 1.00 0.80 to 1.10 2.0±0.10 1.25±0.10 1.00 to 1.30 1.00 to 1.20 1.00 to 1.45 2.0±0.20 1.25±0.20 1.6±0.25 c Recommended land dimensions 2.0±0.15 3.2±0.20 0.8±0.25 1.25±0.15 1.6±0.15 3.2±0.20 1.6±0.20 3.2±0.30 3.2±0.30 1.6±0.30 2.5±0.20 1.00 to 1.30 1.00 to 1.20 1.25 to 1.55 2.10 to 2.50 1.10 to 1.30 1.40 to 1.90 2.10 to 2.50 1.10 to 1.30 1.60 to 2.00 2.10 to 2.50 1.10 to 1.30 1.90 to 2.80 * Recommended land dimensions may differ depending on dimensional tolerance. Design of printed circuit and Soldering The recommended fillet height shall be 1/2 of the thickness of capacitors or 0.5mm. When mounting two or more capacitors in the common land, it is necessary to separate the land with the solder resist strike so that it may become the exclusive land of each capacitor. Ideal Solder Height Chip Capacitor T/ 2 or 0.5mm Solder T PCB Item Prohibited Recommended example : Separation by solder resist Solder resist Multiple parts mount Solder resist Mount with leaded parts Leaded parts Soldering iron Wire soldering after mounting Wire Solder resist Leaded parts Solder resist Solder resist Side by side layout CATM2110MH29090E As of October 2021 Multilayer Ceramic Chip Capacitors Surface Mounting Information Mounting Design The chip could crack if the PCB warps during processing after the chip has been soldered. Recommended chip position on PCB to minimize stress from PCB warpage (Not recommended) (Ideal) Actual Mounting 1) If the position of the vacuum nozzle is too low, a large force may be applied to the chip capacitor during mounting, resulting in cracking. 2) During mounting, set the nozzle pressure to a static load of 1 to 3 N. 3) To minimize the shock of the vaccum nozzle, provide a support pin on the back of the PCB to minimize PCB flexture. (Ideal) (Not recommended) Crack Support pin 4) Bottom position of pick up nozzle should be adjusted to the top surface of a substrate which camber is corrected. Resin Mold 1) If a large amount of resin is used for molding the chip, cracks may occur due to contraction stress during curing. To avoid such cracks, use a low shrinkage resin. 2) The insulation resistance of the chip will degrade due to moisture absorption. Use a low moisture absorption resin. 3) C  heck carefully that the resin does not generate a decomposition gas or reaction gas during the curing process or during normal storage. Such gases may crack the chip capacitor or damage the device itself. CATM2110MH29090E As of October 2021 Multilayer Ceramic Chip Capacitors Surface Mounting Information Soldering Method 1) C  eramic is easily damaged by rapid heating or cooling. If some heat shock is unavoidable, preheat enough to limit the temperature difference (Delta T) to within 150 degree Celsius. 2) T  he product size 1.6×0.8mm to 3.2×1.6mm can be used in reflow and wave soldering, and the product size of bigger than 3.2×1.6mm, or smaller than 1.6×0.8mm can be used in reflow. Circuit shortage and smoking can be created by using capacitors which are used neglecting the above caution. 3) P  lease see our recommended soldering conditions. 4) In case of using Sn-Zn Solder, please contact us in advance. 5) T  he following condition is recommended for spot heater application. ・ Recommended spot heater condition Item Condition Distance 5mm min. Angle 45° How to point spot heater Projection Temp. 400℃ max. Flow rate Set at the minimum Nozzle diameter 2φ to 4φ (Single hole type) Application time 10 sec. max. (1206 and smaller) 30 sec. max. (1210 and larger) Single hole nozzle Angle 45° Recommended Temperature Profile (Sn-3Ag-0.5Cu) Reflow Recommended Temperature Profile (63Sn Solder) Reflow Peak temperature 230℃±5℃ 15 sec. max. Peak temperature 250℃±10℃ 5 to 10 sec. max. Cool at normal room temperature ∆T 1 to 3℃/ sec. 170 to 180℃ 100 More than 220℃ 90 sec. max. Temperature　(℃) Temperature　( ℃) 200 50 200 ∆T 150 100 More than180℃, 40 sec. max. 50 0 0 60 sec. 60 sec. 90±30 sec. ① Minimize soldering �me. ② Ensure that allowable temperature difference does not exceed 150℃. ③ Ensure that allowable temperature difference does not exceed 130℃ for 3.2×2.5mm size or larger. ④ MLCC can withstand the above reflow conditions up to 3 times. ⑤ N₂ atmosphere is recommended for reflow of products of 0.4mm×0.2mm size or smaller. Wave ① Minimize soldering �me. ② Ensure that the temperature difference (∆T) does not exceed 150℃. ③ Ensure that the temperature difference (∆T) does not exceed 130℃ for 3.2×2.5mm size or larger. ④ MLCC can withstand the above reflow conditions up to 3 times. Wave Preheat 250 200 300 Peak Temperature 245℃ to 260℃ ∆T 150 100 Cool at normal room temperature 50 Preheat Peak Temperature 230℃ to 260℃ 250 Temperature　(℃ ) 300 Temperature　(℃ ) Cool at normal room temperature 250 250 150 Preheat 300 Preheat 300 ∆T 200 150 100 Cool at normal room temperature 50 0 0 60 to 120 sec. 5 sec. max. ① Ensure that the chip capacitor is preheated adequately. ② Ensure that the temperature difference (∆T) does not exceed 150℃. ③ Cool naturally a�er soldering. ④ Wave soldering is not applicable for chips with size of 3.2×2.5mm or larger of 1.0×0.5mm or smaller and capacitor arrays. 60 to 120 sec. 5 sec. max. ① Ensure that the chip capacitor is preheated adequately. ② Ensure that the temperature difference (∆T) does not exceed 150℃. ③ Cool naturally a�er soldering. ④ Wave soldering is not applicable for chips with size of 3.2×2.5mm or larger of 1.0×0.5mm or smaller and capacitor arrays. CATM2110MH29090E As of October 2021 Multilayer Ceramic Chip Capacitors Precautions Circuit Design 1. Once application and assembly environments have been checked, the capacitor may be used in conformance with the rating and performance which are provided in both the catalog and the specifications. Use exceeding that which is specified may result in inferior performance or cause a short, open, smoking, or flaming to occur, etc. 2. P  lease consult the manufacturer in advance when the capacitor is used in devices such as: devices which deal with human life, i.e. medical devices; devices which are highly public orientated; and devices which demand a high standard of liability. Accident or malfunction of devices such as medical devices, space equipment and devices having to do with atomic power could generate grave consequence with respect to human lives or, possibly, a portion of the public. Capacitors used in these devices may require high reliability design different from that of general purpose capacitors. 3. P  lease use the capacitors in conformance with the operating temperature provided in both the catalog and the specifications. Be especially cautious not to exceed the maximum temperature. In the situation the maximum temperature set forth in both the catalog and specifications is exceeded, the capacitor's insulation resistance may deteriorate, power may suddenly surge and short-circuit may occur. The capacitor has a loss, and may self-heat due to equivalent series resistance when alternating electric current is passed therethrough. As this effect becomes especially pronounced in high frequency circuits, please exercise caution. When using the capacitor in a (self-heating) circuit, please make sure the surface of the capacitor remains under the maximum temperature for usage. Also, please make certain temperature rises remain below 20℃. 4. P  lease keep voltage under the rated voltage which is applied to the capacitor. Also, please make certain the peak voltage remains below the rated voltage when AC voltage is super-imposed to the DC voltage. In the situation where AC or pulse voltage is employed, ensure average peak voltage does not exceed the rated voltage. Exceeding the rated voltage provided in both catalog and specifications may lead to defective withstanding voltage or, in worst case situations, may cause the capacitor to smoke or flame. 5. W  hen the capacitor is to be employed in a circuit in which there is continuous application of a high frequency voltage or a steep pulse voltage, even though it is within the rated voltage, please inquire to the manufacturer. In the situation the capacitor is to be employed using a high frequency AC voltage or a extremely fast rising pulse voltage, even though it is within the rated voltage, it is possible capacitor reliability will deteriorate. 6. It is a common phenomenon of high-dielectric products to have a deteriorated amount of static electricity due to the application of DC voltage. Due caution is necessary as the degree of deterioration varies depending on the quality of capacitor materials, capacity, as well as the load voltage at the time of operation. 7. D  o not use the capacitor in an environment where it might easily exceed the respective provisions concerning shock and vibration specified in the catalog and specifications. In addition, it is a common piezo phenomenon of high dielectric products to have some voltage due to vibration or to have noise due to voltage change. Please contact sales in such case. 8. If the electrostatic capacity value of the delivered capacitor is within the specified tolerance, please consider this when designing the respective product in order that the assembled product function appropriately. 9. Please contact us upon using conductive adhesives. Storage Please note the following regarding the storage of delivered products. 1. Set the storage temperature to + 5 to + 40 °C and humidity to 20 ~ 70% RH. Other meteorological conditions are in accordance with classification 1 K2 of JIS C 60721 -3 -1. 2. S  tore in a place where corrosive gas (H₂S, SO₂, NO₂, Cl₂, etc.) does not exist in the atmosphere. Also, avoid exposure to salty moisture. In either case, this may cause oxidation corrosion of the terminal electrode, reducing solderability. If you store the above delivered products according to the conditions listed above, it will satisfy the solderability standard for 6 months from the shipping date. Safety application guideline and detailed information of electrical properties are also provided in kyocera web site; URL: https://ele.kyocera.com/en/product/capacitor/ CATM2110MH29090E As of October 2021 Part Number List Low Profile CT03Series　Size (JIS Code) ： 0201(0603)　# Packaging Code (Packaging quantity) ： H(15,000pcs.) / N(50,000pcs.) / Q(30,000pcs.) / W(150,000pcs.) Dielectric code X5R X6T Capacitance 0.1µF 1.0µF □:Tolerance Voltage [V] Part Number Tanδ [％ ] K:±10% / M:±20% M:±20% 6.3 4 CT03X5R104□06A#022 CT03X6T105M04A#022 12.5 12.5 # Packaging Code (quantity) H/N/Q/W H/N Dimension L[mm] 0.6±0.03 0.6±0.09 W[mm] 0.3±0.03 0.3±0.09 T[mm] 0.22 max. 0.22 max. Low Profile CT05 Series　Size (JIS Code) ： 0402(1005)　# Packaging Code (Packaging quantity) ： H(10,000pcs.) / N(50,000pcs.) / Q(20,000pcs.) / W(100,000pcs.) Dielectric code X5R X6T Capacitance 1.0µF 2.2µF 4.7µF 1.0µF 10µF □:Tolerance Voltage [V] Part Number Tanδ [％ ] K:±10% / M:±20% M:±20% M:±20% M:±20% M:±20% 6.3 6.3 6.3 4 2.5 CT05X5R105□06A#033 CT05X5R225M06A#033 CT05X5R475M06AH033 CT05X6T105M04A#022 CT05X6T106M02A#050 12.5 12.5 15.0 12.5 12.5 # Packaging Code (quantity) H/N/Q/W H/N/Q/W H H/N H/N Dimension L[mm] 1.0±0.05 1.0±0.05 1.0±0.20 1.0±0.10 1.0±0.20 W[mm] 0.5±0.05 0.5±0.05 0.5±0.20 0.5±0.05 0.5±0.20 T[mm] 0.33 max. 0.33 max. 0.33 max. 0.22 max. 0.50 max. Low Profile CT105 Series　Size (JIS Code) ： 0603(1608) 　# Packaging Code (Packaging quantity) ： T(4,000pcs.) / L(10,000pcs.) Dielectric code X5R Capacitance 1.0µF □:Tolerance Voltage [V] K:±10%/M:±20% 16 Part Number CT105X5R105□16A#055 Tanδ [％ ] 12.5 # Packaging Code (quantity) T/L Dimension L[mm] 1.6±0.10 W[mm] 0.8±0.10 T[mm] 0.55 max. Low Profile CT21 Series　Size (JIS Code) ： 0805(2012) 　# Packaging Code (Packaging quantity) ： T(4,000pcs.) / L(10,000pcs.) Dielectric code X5R Capacitance 2.2µF 4.7µF □:Tolerance Voltage [V] K:±10% / M:±20% 50 16 Part Number CT21X5R225□50A#095 CT21X5R475□16A#095 Tanδ [％ ] 5.0 12.5 Dimension L[mm] 2.0±0.20 2.0±0.15 W[mm] 1.25±0.20 1.25±0.15 T[mm] 0.95 max. 0.95 max. # Packaging Code (quantity) T/L T/L CATM2110MH29090E As of October 2021 Notes for Using the Catalog 1. Specifications described in this catalog are for references. Products specifications shall be based on written documents agreed by each party. 2. Contents in this catalog are subject to change without notice. It is recommended to confirm the latest information at the time of usage. Also, Kyocera Electronic Components Catalog is revised once a year. We may not be able to accept requests based on old catalogs. 3. Products in this catalog are intended to be used in general electronic equipment such as office equipment, audio and visual equipment, communication equipment, measurement instrument and home appliances. It is absolutely recommended to consult with our sales representatives in advance upon planning to use our products in applications which require extremely high quality and reliability such as aircraft and aerospace equipment, traffic systems, safety systems, power plant and medical equipment including life maintenance systems. 4. Even though we strive for improvements of quality and reliability of products, it is requested to design with enough safety margin in equipment or systems in order not to threaten human lives directly or damage human bodies or properties by an accidental result of products. 5. It is requested to design based on guaranteed specifications for such as maximum ratings, operating voltage and operating temperature. It is not the scope of our guarantee for unsatisfactory results due to misuse or inadequate usage of products in the catalog. 6. Operation summaries and circuit examples in this catalog are intended to explain typical operation and usage of the product. It is recommended to perform circuit and assembly design considering surrounding conditions upon using products in this catalog. 7. Technical information described in this catalog is meant to explain typical operations and applications of products, and it is not intended to guarantee or license intellectual properties or other industrial rights of the third party or Kyocera. 8. Trademarks, logos and brand names used in this catalog are owned by Kyocera or the corresponding third party. 9. Certain products in this catalog are subject to the Foreign Exchange and Foreign Trade Control Act of Japan, and require the license from Japanese Government upon exporting the restricted products and technical information under the law. Besides, it is requested not to use products and technical information in the catalog for the development and/or manufacture of weapons of mass destruction or other conventional weapons, nor to provide them to any third party with the possibility of having such purposes. 10. It is prohibited to reprint and reproduce a part or whole of this catalog without permission. 11. Contents described herein are as of October 2021. CATM2110MH29090E As of October 2021