F0603C2R00FWTR

Accu-Guard® SMD Thin-Film Fuse ACCU-GUARD® TECHNOLOGY The Accu-Guard series of fuses is based on thin-film techniques. This technology provides a level of control on the component electrical and physical characteristics that is generally not possible with standard fuse technologies. This has allowed AVX to offer a series of devices which are designed for modern surface mount circuit boards which require protection. ® APPLICATIONS • • • • • • • • • • • Cellular Telephones Two-Way Radios Computers Battery Chargers Rechargeable Battery Packs Hard Disk Drives PDA’s LCD Screens SCSI Interface Digital Cameras Video Cameras FEATURES • Accurate current rating • Fast acting • Small-standard 0402, 0603, 0805, 1206 and 0612 chip sizes • Taped and reeled • Completely compatible with all soldering systems used for SMT • Lead Free Series (F0402E, F0603E) APPROVAL FILE NUMBERS • UL, cUL: RCD#E143842 DIMENSIONS F0603C, F0805B, F1206A and F1206B B1 DIMENSIONS F0402E and F0603E B W T W T B2 L L STANDARD SIZES: L W T B F0402E 1.00±0.10 (0.039±0.004) 0.55±0.07 (0.022±0.003) 0.40±0.10 (0.016±0.004) 0.20±0.10 (0.008±0.004) millimeters (inches) F0603C 1.65±0.25 (0.065±0.010) 0.80±0.15 (0.031±0.006) 0.90±0.2 (0.035±0.008) 0.35±0.15 (0.014±0.006) F0805B 2.1±0.2 (0.083±0.008) 1.27±0.1 (0.050±0.004) 0.90±0.2 (0.035±0.008) 0.30±0.15 (0.012±0.006) F1206A/B 3.1±0.2 (0.122±0.008) 1.6±0.1 (0.063±0.004) 1.2±0.2 (0.047±0.008) 0.43±0.25 (0.017±0.010) F0603D 1.65±0.25 (0.065±0.010) 3.1±0.2 (0.122±0.008) 0.90±0.2 (0.036±0.008) 0.35±0.15 (0.014±0.006) F0603E 1.60±0.10 (0.063±0.004) 0.81±0.10 (0.032±0.004) 0.63±0.10 (0.025±0.004) 0.35±0.15 (0.014±0.006) HOW TO ORDER F 1206 A 0R20 F W TR Product Fuse Size See table for standard sizes Fuse Version Rated Current Fuse Speed F=Fast Termination S=Nickel/LeadFree Solder =coated (Sn 100) W=Nickel/solder =coated (Sn 63, Pb 37) Packaging TR=Tape and reel A=Accu-Guard® Current expressed in B=Accu-Guard® II Amps. Letter R C=Accu-Guard® II denotes decimal 0603 point. e.g. D=Accu-Guard® II 0.20A=0R20 0612 1.75A=1R75 E=Accu-Guard® II 0402, 0603 2 Accu-Guard® II SMD Thin-Film Fuse Accu-Guard® II is a version of Accu-Guard® fuses for a wider range of current and voltage ratings. Constructed on alumina substrates, Accu-Guard® II fuses display superior electrical, mechanical and environmental properties. Accu-Guard® II dimensions are standard 0402, 0603, 0805, 1206 and 0612 chip sizes, see page 2. For F1206B and F0805B at -55°C is 107% of rating, at +25°C 100% of rating, at +85°C 93% of rating, at +125°C 90% of rating. For F0805B 2.50A and 3.00A at +85°C 90% of rating, at +125°C 90% of rating. Interrupting rating: 50A. Insulation resistance: >20MΩ guaranteed (after fusing at rated voltage). For F0612D at -55°C 107% of rating, at +25°C 100% of rating, at +85°C 80% of rating, at +125°C 75% of rating. ELECTRICAL SPECIFICATIONS Operating temperature: -55°C to +125°C Current carrying capacity: For F0402E and F0603E at -55°C 107% of rating, at -25°C 100% of rating, at +125°C 80% of rating. For F0603C at -55°C is 107% of rating, at +25°C 100% of rating, at +85°C 90% of rating, at +125°C 75% of rating. Type Part Number F0402E0R25FSTR F0402E0R50FSTR F0402E0R75FSTR F0402E1R00FSTR F0402E1R50FSTR F0402E2R00FSTR F0603E0R25FSTR F0603E0R37FSTR F0603E0R50FSTR F0603E0R75FSTR F0603E1R00FSTR F0603E1R25FSTR F0603E1R50FSTR F0603E1R75FSTR F0603E2R00FSTR F0603E2R50FSTR F0603E3R00FSTR F0603C0R25FWTR F0603C0R37FWTR F0603C0R50FWTR F0603C0R75FWTR F0603C1R00FWTR F0603C1R25FWTR F0603C1R50FWTR F0603C1R75FWTR F0603C2R00FWTR F0603C2R50FWTR F0603C3R00FWTR F0805B0R25FWTR F0805B0R50FWTR F0805B0R75FWTR F0805B1R00FWTR F0805B1R25FWTR F0805B1R50FWTR F0805B2R00FWTR F0805B2R50FWTR F0805B3R00FWTR F1206B0R25FWTR F1206B0R50FWTR F1206B1R00FWTR F1206B1R50FWTR F1206B2R00FWTR F1206B3R00FWTR F0612D4R00FWTR F0612D5R00FWTR Current Resistance Rating 10% x I rated, 25°C A Ω (max.) 0.25 0.650 0.50 0.250 0.75 0.200 1.00 0.130 1.50 0.060 2.00 0.040 0.25 0.650 0.375 0.450 0.50 0.250 0.75 0.200 1.00 0.130 1.25 0.090 1.50 0.060 1.75 0.050 2.00 0.040 2.50 0.035 3.00 0.030 0.25 0.800 0.375 0.500 0.50 0.320 0.75 0.300 1.00 0.200 1.25 0.170 1.50 0.110 1.75 0.090 2.00 0.075 2.50 0.055 3.00 0.045 0.25 0.750 0.50 0.350 0.75 0.270 1.00 0.220 1.25 0.170 1.50 0.120 2.00 0.080 2.50 0.060 3.00 0.050 0.25 0.750 0.50 0.350 1.00 0.180 1.50 0.120 2.00 0.080 3.00 0.050 4.00 0.040 5.00 0.025 F0402E F0603E F0603C F0805B F1206B F0612D Voltage Drop Fusing Current @1 x I rated, 25°C (within 5 sec), 25°C mV (max.) A 220 0.625 180 1.25 180 1.875 160 2.50 140 3.75 120 5.00 220 0.625 220 0.940 180 1.25 180 1.875 160 2.50 140 3.125 140 3.75 120 4.375 120 5.00 100 6.25 100 7.50 280 0.50 280 0.75 280 1.00 280 1.50 240 2.00 240 2.50 240 3.00 240 3.50 240 4.00 200 5.00 200 6.00 280 0.50 280 1.00 280 1.50 280 2.00 280 2.50 240 3.00 220 4.00 220 5.00 220 6.00 280 0.50 280 1.00 240 2.00 240 3.00 220 4.00 220 6.00 260 10 200 12.5 Pre-Arc I2t @ 50A A2-sec 0.00005* 0.0003 0.003 0.008 0.03 0.06 0.00005* 0.0001 0.0003 0.003 0.008 0.01 0.03 0.04 0.06 0.12 0.25 0.00003* 0.0001 0.0002 0.0015 0.004 0.007 0.012 0.02 0.03 0.05 0.1 0.00003* 0.0002 0.001 0.003 0.007 0.010 0.030 0.050 0.10 0.00003 0.0002 0.003 0.010 0.030 0.10 0.10 0.25 Rated Voltage V 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 24 24 16 16 63 63 63 63 63 63 63 63 63 63 63 63 63 63 63 32 32 *Current is limited to less than 50A at 32V due to internal fuse resistance. 7 Accu-Guard® II SMD Thin-Film Fuse ENVIRONMENTAL CHARACTERISTICS Test Solderability Leach Resistance Conditions Components completely immersed in a solder bath at 235 ±5°C for 2 secs. Completely immersed in a solder bath at 260 ±5°C for 60 secs. 12 months minimum with components stored in “as received” packaging. Components mounted to a substrate. A force of 5N applied normal to the line joining the terminations and in a line parallel to the substrate. Components mounted to a substrate. 50 cycles -55°C to +125°C. Per Mil-Std-202F Method 201A and Method 204D Condition D. Tested as shown in diagram Requirement Terminations to be well tinned No visible damage Dissolution of termination ≤ 25% of area ∆R/R