F1206E0R20FWTR

Accu-Guard® SMD Thin-Film Fuse ACCU-GUARD® TECHNOLOGY The Accu-Guard series of fuses is based on thin-film techniques. This technology provides a level of control on the component electrical and physical characteristics that is generally not possible with standard fuse technologies. This has allowed AVX to offer a series of devices which are designed for modern surface mount circuit boards which require protection. ® APPLICATIONS • • • • • • • • • • • Cellular Telephones Two-Way Radios Computers Battery Chargers Rechargeable Battery Packs Hard Disk Drives PDA’s LCD Screens SCSI Interface Digital Cameras Video Cameras FEATURES • Accurate current rating • Fast acting • Small-standard 0402, 0603, 0805, 1206 and 0612 chip sizes • Taped and reeled • Completely compatible with all soldering systems used for SMT • Lead Free Series (F0402E, F02402G, F0603E, F0805B, F1206B) APPROVAL FILE NUMBERS • UL, cUL: RCD#E143842 • UL (F0402G): RCD#E141069 millimeters (inches) F0603C, F0805B, F1206A and F1206B B1 DIMENSIONS F0402E and F0603E B F0402G S A B H W T T B2 L W L T L W F0402G 1.00±0.05 L (0.039±0.002) 0.58±0.04 W (0.023±0.002) 0.35±0.05 T (0.014±0.002) 0.48±0.05 B (0.019±0.002) 0.20±0.05 A (0.008±0.002) 0.05±0.05 S, H (0.002±0.002) F0402E 1.00±0.10 (0.039±0.004) 0.55±0.07 (0.022±0.003) 0.40±0.10 (0.016±0.004) 0.20±0.10 (0.008±0.004) F0603E 1.60±0.10 (0.063±0.004) 0.81±0.10 (0.032±0.004) 0.63±0.10 (0.025±0.004) 0.35±0.15 (0.014±0.006) F0603C 1.65±0.25 (0.065±0.010) 0.80±0.15 (0.031±0.006) 0.90±0.2 (0.035±0.008) 0.35±0.15 (0.014±0.006) F0805B 2.1±0.2 (0.083±0.008) 1.27±0.1 (0.050±0.004) 0.90±0.2 (0.035±0.008) 0.30±0.15 (0.012±0.006) F1206A/B 3.1±0.2 (0.122±0.008) 1.6±0.1 (0.063±0.004) 1.2±0.2 (0.047±0.008) 0.43±0.25 (0.017±0.010) F0612D 1.65±0.25 (0.065±0.010) 3.1±0.2 (0.122±0.008) 0.90±0.2 (0.036±0.008) 0.35±0.15 (0.014±0.006) HOW TO ORDER F 1206 A 0R20 F W TR Product Fuse Size See table for standard sizes Fuse Version A=Accu-Guard® B=Accu-Guard® II C=Accu-Guard® II 0603 D=Accu-Guard® II 0612 E=Accu-Guard® II 0402, 0603 G=Accu-Guard® II 0402 Low Current Rated Current Current expressed in Amps. Letter R denotes decimal point. e.g. 0.20A=0R20 1.75A=1R75 Fuse Speed F=Fast Termination S=Nickel/Lead-Free Solder coated (Sn 100) W=Nickel/solder coated (Sn 63, Pb 37) Packaging TR=Tape and reel 2 Accu-Guard® II Lead-Free SMD Thin-Film Fuse FUSE PRE-ARC JOULE INTEGRALS VS PRE-ARC TIME FOR TYPE F0402E (TYPICAL) 100 100 0 10 1 0 PreArc I2t, A2sec 10 10 10 -1 -2 2.0A 0 1.5A -3 0 1.0A 10 -4 0 0.75A 0 10 10 -5 0.5A 0.25A -6 0 0 0 0 0 0 0 0 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 1 10 Pre-Arc Time, sec Accu-Guard® II Lead-Free SMD Thin-Film Fuse FUSE TIME – CURRENT CHARACTERISTICS FOR TYPE F0603E (TYPICAL) 10 3.0 A 2.5 A 1 2.0 A 1.75A 10-1 1.5 A 1.25 A 1.0 A PreArc Time, sec 10-2 0.7 5A 0.5 A 0.375A 10 -3 0.2 5A 10-4 10-5 10-6 0.1 1 Current, Amp 10 100 12 Accu-Guard® II Lead-Free SMD Thin-Film Fuse FUSE PRE-ARC JOULE INTEGRALS VS CURRENT FOR TYPE F0603E (TYPICAL) 100 10 1 3.0A 2.5A 2.0A 1.75A Pre-Arc I2t, A2sec 10-1 10-2 10 -3 1.5A 1.25A 1.0A 0.75A 10-4 10-5 0.5A 0.375A 0.25A 10-6 0 10 20 30 40 50 60 Current, Amp Accu-Guard® II Lead-Free SMD Thin-Film Fuse FUSE PRE-ARC JOULE INTEGRALS VS PRE-ARC TIME FOR TYPE F0603E (TYPICAL) 100 3.0A 10 1 2.5A 2.0A 1.75A 10 PreArc I2t, A2sec -1 1.5A 1.25A 10 -2 1.0A 10 -3 0.75A 0.5A 10 -4 0.375A 0.25A 10 -5 10 -6 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 1 10 Pre-Arc Time, sec 14 Accu-Guard® II SMD Thin-Film Fuse FUSE TIME - CURRENT CHARACTERISTICS FOR TYPE F0603C (TYPICAL) 10 1 10-1 Pre-Arc Time, Seconds 0.15A 0.25A 0.375A 0.50A 0.75A 1.00A 1.25A 1.5A 1.75A 2.0A 2.5A 3.0A 10-2 10-3 10-4 10-5 10-6 0.1 1 Current, Amp 10 100 Accu-Guard® II SMD Thin-Film Fuse FUSE PRE-ARC JOULE INTEGRALS VS. CURRENT FOR TYPE F0603C (TYPICAL) 100 10 1 10-1 10-2 Pre-Arc I2t, A2sec 10-3 10-4 10-5 10-6 0 10 20 30 Current, Amp 40 50 3.00A 2.50A 2.00A 1.75A 1.50A 1.25A 1.00A 0.75A 0.50A 0.375A 0.25A 0.15A 60 16 Accu-Guard® II SMD Thin-Film Fuse FUSE PRE-ARC JOULE INTEGRALS VS. PRE-ARC TIME FOR TYPE F0603C (TYPICAL) 100 10 1 Pre-Arc I2t, A2sec 10-1 10-2 10-3 10-4 10-5 10-6 10-7 3.00A 2.50A 2.00A 1.75A 1.50A 1.25A 1.00A 0.75A 0.50A 0.375A 0.25A 0.15A 10-6 10-5 10-4 10-3 10-2 10-1 1 10 Pre-Arc Time, Seconds Accu-Guard® II SMD Thin-Film Fuse FUSE TIME - CURRENT CHARACTERISTICS FOR TYPES F0805B AND F1206B (TYPICAL) 10 0.15A 1 0.25A 0.50A 0.75A 1.00A 1.25A 1.5A 2.0A 2.5A 3.0A 10-1 Pre-Arc Time, Seconds 10-2 10-3 10-4 10-5 10-6 0.1 1 Current, Amp 10 100 18 Accu-Guard® II SMD Thin-Film Fuse FUSE PRE-ARC JOULE INTEGRALS VS. CURRENT TIME FOR TYPES F0805B AND F1206B (TYPICAL) 100 10 1 10-1 10-2 3.00A 2.50A 2.00A 1.50A 1.25A 1.00A 0.75A 0.50A 0.25A 0.15A 0 10 20 30 Current, Amp 40 50 60 Pre-Arc I2t, A2sec 10-3 10-4 10-5 10-6 Accu-Guard® II SMD Thin-Film Fuse FUSE PRE-ARC JOULE INTEGRALS VS. PRE-ARC TIME FOR TYPES F0805B AND F1206B (TYPICAL) 100 10 1 Pre-Arc I2t, A2sec 10-1 10-2 10-3 10-4 10-5 10-6 10-7 3.00A 2.50A 2.00A 1.50A 1.25A 1.00A 0.75A 0.50A 0.25A 0.15A 10-6 10-5 10-4 10-3 10-2 10-1 1 10 Pre-Arc Time, Seconds 20 Accu-Guard® II SMD Thin-Film Fuse FUSE TIME - CURRENT CHARACTERISTICS FOR TYPE F0612D (TYPICAL) 10 1 10-1 Pre-Arc Time, Seconds 10-2 10-3 5.0A 4.0A 10-4 10-5 1 10 Current, Amp 100 Accu-Guard® II SMD Thin-Film Fuse FUSE PRE-ARC JOULE INTEGRALS VS. PRE-ARC TIME FOR TYPE F0612D (TYPICAL) 1000 100 10 Pre-Arc I2t, A2sec 1 5.00A 10-1 4.00A 10-2 10-3 10-4 10-5 10-6 10-5 10-4 10-3 10-2 10-1 1 10 Pre-Arc Time, Seconds 22 Accu-Guard® II SMD Thin-Film Fuse FUSE PRE-ARC JOULE INTEGRALS VS. CURRENT FOR TYPE F0612D (TYPICAL) 1000 100 10 Pre-Arc i2t, A2sec 1 5.00A 10-1 4.00A 10-2 10-3 10-4 10-5 0 10 20 30 Current, Amp 40 50 60 Accu-Guard® SMD Thin-Film Fuse QUALITY & RELIABILITY Accu-Guard® series of fuses is based on established thin-film technology and materials used in the semiconductor industry. • In-line Process Control: This program forms an integral part of the production cycle and acts as a feedback system to regulate and control production processes. The test procedures, which are integrated into the production process, were developed after long research and are based on the highly developed semiconductor industry test procedures and equipment. These measures help AVX/Kyocera to produce a consistent and high yield line of products. • Final Quality Inspection: Finished parts are tested for standard electrical parameters and visual/mechanical characteristics. Each production lot is 100% evaluated for electrical resistance. In addition, each production lot is evaluated on a sample basis for: • Insulation resistance (post fusing) • Blow time for 2 x rated current • Endurance test: 125°C, rated current, 4 hours COMPONENT PAD DESIGN Component pads must be designed to achieve good joints and minimize component movement during soldering. Pad designs are given below for both wave and reflow soldering. The basis of these designs are: a. Pad width equal to component width. It is permissible to decrease this to as low as 85% of component width but it is not advisable to go below this. b. Pad overlap 0.5mm. c. Pad extension 0.5mm for reflow. Pad extension about 1.0mm for wave soldering. PREHEAT & SOLDERING The rate of preheat in production should not exceed 4°C/second. It is recommended not to exceed 2°C/ second. Temperature differential from preheat to soldering should not exceed 150°C. For further specific application or process advice, please consult AVX. HANDLING AND SOLDERING SMD chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pick-ups is strongly recommended for individual components. Bulk handling should ensure that abrasion and mechanical shock are minimized. For automatic equipment, taped and reeled product is the ideal medium for direct presentation to the placement machine. HAND SOLDERING & REWORK Hand soldering is permissible. Preheat of the PCB to 100°C is required. The most preferable technique is to use hot air soldering tools. Where a soldering iron is used, a temperature controlled model not exceeding 30 watts should be used and set to not more than 260°C. Maximum allowed time at temperature is 1 minute. CIRCUIT BOARD TYPE All flexible types of circuit boards may be used (e.g. FR-4, G-10). For other circuit board materials, please consult factory. COOLING After soldering, the assembly should preferably be allowed to cool naturally. In the event of assisted cooling, similar conditions to those recommended for preheating should be used. WAVE SOLDERING Dimensions: millimeters (inches) 0402 0805 0603 0.8 (0.031) 2.1 (0.083) 0.5 (0.020) 0.8 (0.031) 0.59 (0.023) 3.1 (0.122) 1.25 (0.049) 1.5 (0.059) 0.6 (0.024) 4.0 (0.157) 1.0 (0.039) 1.25 (0.049) REFLOW SOLDERING Dimensions: millimeters (inches) 0402 0603 0805 0.6 (0.024) 0.85 (0.033) 1.7 (0.068) 0.5 (0.020) 2.3 (0.091) 0.6 (0.024) 0.85 (0.033) 1.0 (0.039) 1.0 (0.039) 3.0 (0.118) 1.0 (0.039) 0.6 (0.024) 0.59 (0.023) 0.8 (0.031) 1.5 (0.059) 0.8 (0.031) 1.25 (0.049) 1206 1.5 (0.059) 1206 1.25 (0.049) 1.0 (0.039) 0612 2.3 (0.091) 0.85 (0.033) 0.6 (0.024) 0.85 (0.033) 3.1 (0.122) 0612 5.0 (0.197) 2.0 (0.079) 1.25 (0.049) 0.6 (0.024) 1.25 (0.049) 3.1 (0.122) 4.0 (0.157) 2.0 (0.079) 3.1 (0.122) 1.0 (0.039) 1.5 (0.059) 1.6 (0.063) 1.6 (0.063) 28 Accu-Guard® SMD Thin-Film Fuse RECOMMENDED SOLDERING PROFILES IR REFLOW 220 210 200 190 180 170 160 150 140 130 120 110 100 90 80 70 60 50 40 30 20 0 Assembly exits heat– no forced cooldown CLEANING RECOMMENDATIONS Care should be taken to ensure that the devices are thoroughly cleaned of flux residues, especially the space beneath the device. Such residues may otherwise become conductive and effectively offer a lousy bypass to the device. Various recommended cleaning conditions (which must be optimized for the flux system being used) are as follows: Cleaning liquids . . . . . . . .i-propanol, ethanol, acetylacetone, water, and other standard PCB cleaning liquids. Ultrasonic conditions . . . .power – 20w/liter max. frequency – 20kHz to 45kHz. Temperature . . . . . . . . . .80°C maximum (if not otherwise limited by chosen solvent system). Time . . . . . . . . . . . . . . . .5 minutes max. COMPONENT LAND TEMP (DEG C) Assembly enters the preheat zone Additional soak time to allow uniform heating of the substrate 45-60 sec. above solder melting point 186°C solder melting temperature Soak time 1) Activates the flux 2) Allows center of board temperatures to catch up with corners 0.5 1 1.5 2 2.5 Time (mins) 3 3.5 4 4.5 STORAGE CONDITIONS Recommended storage prior to use are as follows: Temperature Humidity Air Pressure conditions for Accu-Guard® 15°C to 35°C ≤65% 860mbar to 1060mbar WAVE SOLDERING 3–5 seconds 260 240 220 200 180 160 140 120 100 80 60 40 20 0 10 20 100°C TEMPERATURE °C Natural Cooling Enter Wave Time (seconds) 30 40 50 60 70 80 90 100 110 120 VAPOR PHASE 215°C 200 TEMPERATURE °C 180 160 140 120 100 80 60 40 20 0 Time (minutes) Preheat Transfer from preheat with min. delay & temp. loss 215°C 200 180 160 140 120 100 80 60 40 20 0 Reflow Duration varies with thermal mass of assembly 10–60 secs typical Natural Cooling Enter Vapor 10 20 30 40 50 Time (seconds) 60 70 Accu-Guard® SMD Thin-Film Fuse PACKAGING Automatic Insertion Packaging Tape & Reel: All tape and reel specifications are in compliance with EIA 481-1 — 8mm carrier — Reeled quantities: Reels of 3,000 or 10,000 pieces (for F0402: 5,000 or 20,000 pieces) G MAX. B* A D* C E FULL RADIUS *DRIVE SPOKES OPTIONAL IF USED, ASTERISKED DIMENSIONS APPL . Y F REEL DIMENSIONS: A(1) 180 + 1.0 (7.087 + 0.039) millimeters (inches) C 13 ± 0.2 (0.512 ± 0.008) D* 20.2 min. (0.795 min.) E 50 min. (1.969 min.) F 9.4 ± 1.5 (0.370 ± 0.050) G 14.4 max. (0.567 max.) B* 1.5 min. (0.059 min.) Metric dimensions will govern. Inch measurements rounded for reference only. (1) 330mm (13 inch) reels are available. 10 PITCHES CUMULATIVE TOLERANCE ON TAPE ±0.2 C W L P DIRECTION OF FEED CENTER LINES OF CAVITY B A E F TOP TAPE D P = 4mm except 0402 where P = 2mm CARRIER DIMENSIONS: millimeters (inches) A B C D E F 8.0 ± 0.3 3.5 ± 0.05 1.75 ± 0.1 2.0 ± 0.05 4.0 ± 0.1 1.5 +0.1 -0.0 (0.315 ± 0.012) (0.138 ± 0.002) (0.069 ± 0.004) (0.079 ± 0.002) (0.157 ± 0.004) (0.059 +0.004 ) -0.000 Note: The nominal dimensions of the component compartment (W,L) are derived from the component size. Note: AVX reserves the right to change the information published herein without notice. 30 Accu-Guard® SMD Thin-Film Fuse HOW TO CHOOSE THE CORRECT ACCU-GUARD® FUSE FOR CIRCUIT PROTECTION Correct choice of an Accu-Guard® fuse for a given application is fairly straightforward. The factor of pre-arc I2t, however, requires clarification. The proper design for pre-arc I2t is presented by way of example. 5. Switch-on and Other Pulse Current Many circuits generate a large current pulse when initially connected to power. There are also circuits which are subject to momentary current pulses due to external sources; telephone line cards which are subject to lightning-induced pulses are one example. These current pulses must be passed by the fuse without causing actuation. These pulses may be so large that they are the determining factor for choosing the Accu-Guard® current rating; not necessarily steady state current. In order to design for current pulses, the concept of fuse pre-arc Joule integral, I2t, must be understood. Fuse current rating is defined by the requirement that 2 x IR will cause actuation in