IDC Low Inductance Capacitors (RoHS)
IDC (InterDigitated Capacitors) 0306/0612/0508
GENERAL DESCRIPTION
Inter-Digitated Capacitors (IDCs) are used for both semiconductor package and
board level decoupling. The equivalent series inductance (ESL) of a single capacitor
or an array of capacitors in parallel determines the response time of a Power
Delivery Network (PDN). The lower the ESL of a PDN, the faster the response time. A
designer can use many standard MLCCs in parallel to reduce ESL or a low ESL InterDigitated Capacitor (IDC) device. These IDC devices are available in versions with a
maximum height of 0.95mm or 0.55mm.
0612
+
IDCs are typically used on packages of semiconductor products with power levels
of 15 watts or greater. Inter-Digitated Capacitors are used on CPU, GPU, ASIC, and
ASSP devices produced on 0.13μ, 90nm, 65nm, and 45nm processes. IDC devices
are used on both ceramic and organic package substrates. These low ESL surface
mount capacitors can be placed on the bottom side or the top side of a package
substrate. The low profile 0.55mm maximum height IDCs can easily be used on the
bottom side of BGA packages or on the die side of packages under a heat spreader.
+
–
0306
TYPICAL IMPEDANCE
10
Impedance (Ohms)
KYOCERA AVX IDC products are available with a lead-free finish of plated Nickel/
Tin.
–
0508
–
The Inter-Digitated Capacitor (IDC) technology was developed by KYOCERA AVX.
This is the second family of Low Inductance MLCC products created by KYOCERA
AVX. IDCs are a cost effective alternative to KYOCERA AVX’s first generation low ESL
family for high-reliability applications known as LICA (Low Inductance Chip Array).
+
+
IDCs are used for board level decoupling of systems with speeds of 300MHz or
greater. Low ESL IDCs free up valuable board space by reducing the number of
capacitors required versus standard MLCCs. There are additional benefits to
reducing the number of capacitors beyond saving board space including higher
reliability from a reduction in the number of components and lower placement costs
based on the need for fewer capacitors.
–
MLCC_1206
1
LICC_0612
0.1
IDC_0612
0.01
0.001
1
10
100
1000
Frequency (MHz)
HOW TO ORDER
W
3
L
1
6
D
225
M
A
T
3
Style
IDC Case
Size
Low
Inductance
Number of
Terminals
Voltage
Dielectric
Capacitance
Capacitance
Failure
Rate
Termination
Packaging
4 = 4V
C = X7R
Code (In pF)
Tolerance
6 = 6.3V
D = X5R
2 = 0508
1 = 8 Termi2 Sig. Digits +
M = ±20%
Z = 10V
Z = X7S
3 = 0612
nals
Number of
Y = 16V
4 = 0306
Zeros
3 = 25V
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
A = N/A
T =Plated Ni
and Sn
Available
1=7" Reel
3=13" Reel
A
Thickness
Max. Thickness
mm (in)
A=Standard
S=0.55 (0.022)
PERFORMANCE CHARACTERISTICS
Capacitance Tolerance
Operation
Temperature Range
Temperature
Coefficient
Voltage Ratings
Dissipation Factor
Insulation Resistance
(@+25°C, RVDC)
84
±20% Preferred
X7R = -55°C to +125°C
X5R = -55°C to +85°C
X7S = -55°C to +125°C
±15% (0VDC), ±22% (X7S)
4, 6.3, 10, 16, 25 VDC
≤ 6.3V = 6.5% max;
10V = 5.0% max;
≥ 16V = 3.5% max
100,000MΩ min, or 1,000MΩ per μF
min.,whichever is less
Dissipation Factor
No problems observed after 2.5 x RVDC for 5
seconds at 50mA max current
CTE (ppm/C)
12.0
Thermal Conductivity
4-5W/M K
Terminations
Available
Plated Nickel and Solder
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
– surface mount ceramic capacitor products –
IDC Low Inductance Capacitors (RoHS)
IDC (InterDigitated Capacitors) 0306/0612/0508
SIZE
mm
Max.
Thickness (in.)
WVDC
Cap (μF) 0.010
0.022
0.033
0.047
0.068
0.10
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
W4 = 0306
0.55
(0.022)
4
6.3
W2 = Thin 0508
0.55.
(0.022)
4 6.3 10 16 25
4
W2 = 0508
0.95
(0.037)
6.3 10 16
25
W3= Thin 0612
0.55
(0.022)
4 6.3 10 16
4
W3 = 0612
0.95
(0.037)
6.3 10 16
W3 = THICK 0612
1.22
(0.048)
25 4 6.3 10 16
Consult factory for
additional requirements
PHYSICAL DIMENSIONS AND PAD LAYOUT
= X7R
= X5R
= X7S
PHYSICAL CHIP DIMENSIONS
SIZE
0306
0508
0612
MILLIMETERS (INCHES)
W
L
BW
BL
P
1.60 ± 0.20
0.82 ± 0.10
0.25 ± 0.10
0.20 ± 0.10
0.40 ± 0.05
(0.063 ± 0.008) (0.032 ± 0.006 (0.010 ± 0.004) (0.008± 0.004) (0.015 ± 0.002)
2.03 ± 0.20
1.27 ± 0.20
0.30 ± 0.10
0.25 ± 0.15
0.50 ± 0.05
(0.080 ± 0.008) (0.050 ± 0.008) (0.012 ± 0.004) (0.010± 0.006) (0.020 ± 0.002)
3.20 ± 0.20
1.60 ± 0.20
0.50 ± 0.10
0.25 ± 0.15
0.80 ± 0.10
(0.126 ± 0.008) (0.063 ± 0.008) (0.020 ± 0.004) (0.010 ± 0.006) (0.031 ± 0.004)
PAD LAYOUT DIMENSIONS
SIZE
A
B
– surface mount ceramic capacitor products –
D
E
0508
0.64 1.27
1.91
0.28
0.50
(0.025) (0.050) (0.075) (0.011) (0.020)
0612
0.89 1.65
2.54
0.45
0.80
(0.035) (0.065) (0.010) (0.018) (0.031)
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
072522
C
0.38 0.89
1.27
0.20
0.40
0306
(0.015) (0.035) (0.050) (0.008) (0.015)
85
很抱歉,暂时无法提供与“W2L14Z225MAT1S”相匹配的价格&库存,您可以联系我们找货
免费人工找货- 国内价格 香港价格
- 4000+5.026574000+0.60079
- 8000+4.800558000+0.57377
- 12000+4.6867712000+0.56017
- 国内价格 香港价格
- 1+16.452291+1.96640
- 10+10.4996610+1.25494
- 50+8.0996550+0.96808
- 100+7.34997100+0.87848
- 500+6.07234500+0.72578
- 1000+5.672861000+0.67803