AZ100ELT20D

ARIZONA MICROTEK, INC. AZ10ELT20 AZ100ELT20 CMOS/TTL to Differential PECL Translator FEATURES • • • • • • • PACKAGE 0.5ns Typical Propagation Delay Differential PECL Outputs Flow Through Pinouts Operating Range of +3.0V to +5.5V Direct Replacement for ON Semi MC100ELT20 & Micrel SY89329V Available in 2x2 and 3x3 mm MLP Packages IBIS Model Files Available on Arizona Microtek Website MLP 8 (2x2x0.75) MLP 8 (2x2x0.75) Green / RoHS Compliant / Lead (Pb) Free MLP 16 (3x3) MLP 16 (3x3) Green / RoHS Compliant / Lead (Pb) Free SOIC 8 SOIC 8 SOIC 8 RoHS Compliant / Lead (Pb) Free SOIC 8 Green / RoHS Compliant / Lead (Pb) Free PACKAGE AVAILABILITY PART NUMBER AZ100ELT20N MARKING TC TCG AZM T20 AZMG T20 AZM10 ELT20 AZM100 ELT20 AZM100+ ELT20 AZM100G ELT20 NOTES 1,2 AZ100ELT20NG 1,2 AZ10/100ELT20L 1,2 AZ10/100ELT20LG 1,2 AZ10ELT20D AZ100ELT20D AZ100ELT20D+ 1,2,3 1,2,3 1,2,3 DESCRIPTION AZ100ELT20DG 1,2,3 AZH The AZ10/100ELT20 is a TSSOP 8 AZ100ELT20T 1,2,3 LT20 CMOS/TTL to differential PECL TSSOP 8 Green / translator. It operates with a single power AZHG AZ100ELT20TG 1,2,3 RoHS Compliant / supply of +3.0 to +5.5 volts, making it LT20 Lead (Pb) Free ideal for both LVCMOS/LVTTL and DIE AZ10/100ELT20XP N/A 4 CMOS/TTL applications. The extremely 1 Add R1 at end of part number for 7 inch (1K parts), R2 for 13 inch (2.5K small MLP 8 2x2 mm package makes it parts) Tape & Reel. ideal for those applications where space, 2 Date code format: “Y” or “YY” for year followed by “WW” for week. 3 Date code “YWW” or “YYWW” on underside of part. performance and low power are at a Waffle Pack. 4 premium. When the D input is left floating, the Q output is forced HIGH, and the Q output is forced LOW. ¯ The ELT20 is available in both PECL standards: the AZ10ELT20 is compatible with PECL 10K logic levels while the AZ100ELT20 is compatible with PECL 100K logic levels. NOTE: Specifications in the PECL tables are valid when thermal equilibrium is established. BLOCK DIAGRAM Q D Q 1630 S. STAPLEY DR., SUITE 127 • MESA, ARIZONA 85204 • USA • (480) 962-5881 • FAX (480) 890-2541 www.azmicrotek.com AZ10ELT20 AZ100ELT20 Absolute Maximum Ratings are those values beyond which device life may be impaired. Symbol VCC VIN IOUT TA TSTG Characteristic DC Supply Voltage (Referenced to GND) Input Voltage Current Applied to Output in Low Output State Operating Temperature Range (In Free-Air) Storage Temperature Range Value 0 to +8.0 0 to +6.0 50 100 -40 to +85 -65 to +150 Unit V V mA °C °C — Continuous — Surge TTL/CMOS INPUT DC CHARACTERISTICS (GND = 0.0V, VCC = +3.0V to +5.5V) Symbol IIH IIHH IIL VIK VIH VIL Characteristic Input HIGH Current Input HIGH Current Input LOW Current Input Clamp Diode Voltage Input HIGH Voltage Input LOW Voltage Min Typ Max 15 20 -0.1 -1.2 0.8 Unit μA μA mA V V V Condition VIN = 2.7V VIN = VCC VIN = 0.5V IIN = -18mA 2.0 10K LVPECL DC Characteristics (GND = 0.0V, VCC = +3.3V) Symbol Characteristic 1,2 VOH Output HIGH Voltage VOL Output LOW Voltage1,2 ICC Power Supply Current3 1. Output parameters vary 1:1 with VCC. 2. Each output is terminated through a 50Ω resistor to VCC – 2V. 3. ICC measurements must be done with outputs open. Min 2220 1350 -40°C Typ Max 2410 1650 16 Min 2280 1350 0° C Typ Max 2460 1670 16 Min 2320 1350 25°C Typ Max 2490 1670 16 Min 2390 1350 85°C Typ Max 2580 1705 16 Unit mV mV mA 10K PECL DC Characteristics (GND = 0.0V, VCC = +5.0V) Symbol Characteristic 1,2 VOH Output HIGH Voltage VOL Output LOW Voltage1,2 ICC Power Supply Current3 1. Output parameters vary 1:1 with VCC. 2. Each output is terminated through a 50Ω resistor to VCC – 2V. 3. ICC measurements must be done with outputs open. Min 3920 3050 -40°C Typ Max 4110 3350 16 Min 3980 3050 0° C Typ Max 4160 3370 16 Min 4020 3050 25°C Typ Max 4190 3370 16 Min 4090 3050 85°C Typ Max 4280 3405 16 Unit mV mV mA 100K LVPECL DC Characteristics (GND = 0.0V, VCC = +3.3V) Symbol Characteristic 1,2 VOH Output HIGH Voltage VOL Output LOW Voltage1,2 ICC Power Supply Current3 1. Output parameters vary 1:1 with VCC. 2. Each output is terminated through a 50Ω resistor to VCC – 2V. 3. ICC measurements must be done with outputs open. Min 2220 1400 -40°C Typ Max 2420 1750 16 Min 2275 1400 0° C Typ Max 2420 1680 16 Min 2275 1400 25°C Typ Max 2420 1680 16 Min 2275 1400 85°C Typ Max 2420 1680 16 Unit mV mV mA 100K PECL DC Characteristics (GND = 0.0V, VCC = +5.0V) Symbol Characteristic 1,2 VOH Output HIGH Voltage VOL Output LOW Voltage1,2 ICC Power Supply Current3 1. Output parameters vary 1:1 with VCC. 2. Each output is terminated through a 50Ω resistor to VCC – 2V. 3. ICC measurements must be done with outputs open. Min 3920 3100 -40°C Typ Max 4120 3450 16 Min 3975 3100 0° C Typ Max 4120 3380 16 Min 3975 3100 25°C Typ Max 4120 3380 16 Min 3975 3100 85°C Typ Max 4120 3380 16 Unit mV mV mA April 2007 * REV - 18 www.azmicrotek.com 2 AZ10ELT20 AZ100ELT20 AC CHARACTERISTICS (GND = 0.0V, VCC = +3.0V to +5.5V) -400C 0° C 25°C 85°C Unit Min Max Min Max Min Typ Max Min Max 1 tPLH/tPHL Propagation Delay 100 600 100 600 100 600 100 600 ps tr/tf Output Rise/Fall Time 200 500 200 500 200 500 200 500 ps fMAX Maximum Frequency2 800 800 800 800 MHz 1. Propagation delay is measured from +1.5V on the input to 50% of the PECL output swing. Input rise/fall times are < 1ns/V. 2. Output at –3 dB. Symbol Characteristic Condition 20-80% 850 750 Single ended Output (mV p-p) 650 550 Input: 150mV p-p Sine Wave Single Ended 450 350 250 150 1 10 100 1000 10000 Frequency (MHz) Large Signal Bandwidth April 2007 * REV - 18 www.azmicrotek.com 3 AZ10ELT20 AZ100ELT20 PIN DESCRIPTION PIN Q, Q ¯ D GND VCC NC 10K FUNCTION Differential PECL Outputs TTL/CMOS Input Ground Positive Supply No Connect, Leave Open Except as Noted 10K/100K Mode Select AZ100ELT20N MLP 8, 2x2mm NC 1 Q Q 2 3 8 7 6 VCC D NC MLP 16 (L) Package and DIE: 10K/100K Selection Connect pin/pad 10K to GND to select 10K operation. Float (NC) pin/pad 10K to select 100K operation. GND connection must be less than 1Ω. Pin 8 of the MLP 16 package may be connected to pin 7 (GND) with no effect on the circuit. NC 4 TOP VIEW 5 GND Leave Center Bottom Pad open or connect to GND. AZ10ELT20D AZ100ELT20D AZ100ELT20T AZ10/100ELT20L NC 16 NC 15 VCC 14 NC 13 12 NC 1 8 V CC Q 1 NC D NC NC Q 2 Q 3 SOIC 8 TSSOP 8 7 D NC NC 2 3 MLP 16 3x3mm Top View 11 10 9 6 NC Q 4 5 NC 4 5 GND 6 7 8 NC 10K GND NC Leave Center Bottom Pad open or connect to GND. April 2007 * REV - 18 www.azmicrotek.com 4 AZ10ELT20 AZ100ELT20 DIE PAD COORDINATES AZ10/100ELT20 DIE: ELT20 22 A B C D M L K J DIE SIZE: 950u X 940u DIE THICKNESS: 14 mils BOND PAD: 85u X 85u I H G E F Note: Other die thicknesses available. Contact factory for further information. The die backside may be left open or connected to GND. PAD CENTER COORDINATES NAME A B C D E F G H I J K L M NC = No connect, leave open. PAD DESIGNATION NC NC D NC VCC VCC Q Q ¯ NC NC NC 10K GND X(Microns) -342.5 -342.5 -342.5 -342.5 -33.5 126.5 312.5 312.5 312.5 312.5 302.5 142.5 -140.5 Y(Microns) 312.5 144.5 -87.0 -255.0 -312.5 -312.5 -248.5 -98.5 51.5 201.5 342.5 342.5 342.5 April 2007 * REV - 18 www.azmicrotek.com 5 AZ10ELT20 AZ100ELT20 PACKAGE DIAGRAM MLP 8 2x2mm Pin 1 Dot By Marking 2.000±0.050 2.000±0.050 MLP 8 (2x2mm) TOP VIEW 0.350±0.050 0.250±0.050 8 7 0.500 bsc 6 5 1 Pin 1 Identification R0.100 TYP 2 1.200±0.050 exp. pad 3 4 0.600±0.050 exp. pad BOTTOM VIEW 1.750 Ref. 0.750±0.050 0.000-0.050 1 2 34 0.203±0.025 SIDE VIEW Note: All dimensions are in mm April 2007 * REV - 18 www.azmicrotek.com 6 AZ10ELT20 AZ100ELT20 PACKAGE DIAGRAM SOIC 8 NOTES: 1. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 2. MAXIMUM MOLD PROTRUSION FOR D IS 0.15mm. 3. MAXIMUM MOLD PROTRUSION FOR E IS 0.25mm. DIM A A1 A2 A3 bp c D E e HE L Lp Q v w y Z θ MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 1.28 1.57 0.25 0.36 0.49 0.19 0.25 4.80 5.00 3.80 4.00 1.27 5.80 6.20 1.05 0.40 1.27 0.60 0.70 0.25 0.25 0.10 0.30 0.70 8O 0O INCHES MIN MAX .053 0.069 0.004 0.010 0.050 0.062 0.01 0.014 0.019 0.0075 0.0100 0.19 0.20 0.15 0.16 0.050 0.228 0.244 0.041 0.016 0.050 0.024 0.028 0.01 0.01 0.004 0.012 0.028 0O 8O April 2007 * REV - 18 www.azmicrotek.com 7 AZ10ELT20 AZ100ELT20 PACKAGE DIAGRAM TSSOP 8 NOTES: 1. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 2. MAXIMUM MOLD PROTRUSION FOR D IS 0.15mm. 3. MAXIMUM MOLD PROTRUSION FOR E IS 0.25mm. DIM A A1 A2 A3 bp c D E e HE L Lp v w y Z θ MILLIMETERS MIN MAX 1.10 0.05 0.15 0.75 0.95 0.25 0.22 0.40 0.13 0.23 2.90 3.10 2.90 3.10 0.65 4.75 5.05 0.95 0.40 0.70 0.10 0.08 0.10 0.38 0.64 6O 0O April 2007 * REV - 18 www.azmicrotek.com 8 AZ10ELT20 AZ100ELT20 PACKAGE DIAGRAM MLP 16 3x3mm D 2. INDEX AREA (D/2 x E/2) A D 2 E 2 E 3x e e B D2 D2/2 E2/2 E2 2 1 5. 2x 2x aaa C aaa C TOP VIEW bbb M C A B 16 x b 3. 3x e BOTTOM VIEW L ccc C A 4. 0.08 C SIDE VIEW A3 C SEATING PLANE A1 MILLIMETERS NOTES: 1. DIMENSIONING AND TOLERANCING CONFORM TO ASME T14-1994. 2. THE TERMINAL #1 AND PAD NUMBERING CONVENTION SHALL CONFORM TO JESD 95-1 SPP-012. 3. DIMENSION b APPLIES TO METALLIZED PAD AND IS MEASURED BETWEEN 0.25 AND 0.30 mm FROM PAD TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PADS AS WELL AS THE TERMINALS. 5. INSIDE CORNERS OF METALLIZED PAD MAY BE SQUARE OR ROUNDED DIM A A1 A3 b D D2 E E2 e L aaa bbb ccc MIN MAX 0.80 1.00 0.05 0.00 0.25 REF 0.18 0.30 3.10 2.90 1.95 0.25 3.10 2.90 1.95 0.25 0.50 BSC 0.50 0.30 0.25 0.10 0.10 April 2007 * REV - 18 www.azmicrotek.com 9 AZ10ELT20 AZ100ELT20 Arizona Microtek, Inc. reserves the right to change circuitry and specifications at any time without prior notice. Arizona Microtek, Inc. makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Arizona Microtek, Inc. assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Arizona Microtek, Inc. does not convey any license rights nor the rights of others. Arizona Microtek, Inc. products are not designed, intended or authorized for use as components in systems intended to support or sustain life, or for any other application in which the failure of the Arizona Microtek, Inc. product could create a situation where personal injury or death may occur. Should Buyer purchase or use Arizona Microtek, Inc. products for any such unintended or unauthorized application, Buyer shall indemnify and hold Arizona Microtek, Inc. and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Arizona Microtek, Inc. was negligent regarding the design or manufacture of the part. April 2007 * REV - 18 www.azmicrotek.com 10