AP2805AMMTR-G1

NOT RECOMMENDED FOR NEW DESIGN - USE AP2141D/AP2151D Data Sheet 500mA High-side Power Distribution Switch with Enable and Flag General Description Features The AP2805 is an integrated high-side power switch that consists of N-Channel MOSFET, charge pump, over current & temperature and other related protection circuits. The switch’s low RDS (ON), 60mΩ, design easily to meet USB voltage drop requirements. It includes soft-start to limit inrush current, over-current protection, load short protection with fold-back, and thermal shutdown to avoid switch failure during hot plug-in. Under voltage lockout (UVLO) function is used to ensure the device remain off unless there is a valid input voltage present. A Flag output is available to indicate fault conditions to the local USB controller. • Low MOSFET on Resistance: 60mΩ@VIN=5.0V Compliant to USB Specifications Operating Voltage Range: 2.7V to 5.5V Low Supply Current: 60µA (Typ.) Low Shutdown Current: 1.0µA (Max) Guarantee 0.5A Continuous Load Current Limit: 0.7A (Min), 1.4A (Max) Under-voltage Lockout Logic Level Enable Pin: Available in Active-high or Active-low Version Over-current Protection Over Temperature Protection Load Short Protection with Fold-back No Reverse Current When Power Off Deglitched Flag Output with Open Drain With Output Shutdown Pull-low Resistor for A/C Versions UL Approved (File No. E339337) Nemko CB Scheme IEC60950-1, Ref. Certif No. NO67288 N O T FO R R EC N O EW M M D EN ES D IG ED N • • • • • • • • AP2805 • • • • • • The AP2805 is available in standard packages of SOIC-8 and MSOP-8. • • Applications • • • • • SOIC-8 USB Power Management USB Bus/Self Powered Hubs Hot-plug Power Supplies Battery-charger Circuits Notebooks, Motherboard PCs MSOP-8 Figure 1. Package Types of AP2805 Aug. 2012 Rev 1. 3 BCD Semiconductor Manufacturing Limited 1 Data Sheet 500mA High-side Power Distribution Switch with Enable and Flag AP2805 Pin Configuration N O T FO R R EC N O EW M M D EN ES D IG ED N M/MM Package （SOIC-8/MSOP-8） Figure 2. Pin Configuration of AP2805 (Top View) Pin Descriptions Pin Number Pin Name 1 GND Ground 2, 3 VIN Supply input pin 4 Chip enable control input, active low or high 5 Fault flag pin, output with open drain, need a pull-up resistor in application, active low to indicate OCP or OTP 6, 7, 8 Aug. 2012 Function VOUT Switch output voltage Rev 1. 3 BCD Semiconductor Manufacturing Limited 2 Data Sheet 500mA High-side Power Distribution Switch with Enable and Flag AP2805 N O T FO R R EC N O EW M M D EN ES D IG ED N Functional Block Diagram Figure 3. Functional Block Diagram of AP2805 Aug. 2012 Rev 1. 3 BCD Semiconductor Manufacturing Limited 3 Data Sheet 500mA High-side Power Distribution Switch with Enable and Flag AP2805 Ordering Information AP2805 G1: Green Circuit Type N O T FO R R EC N O EW M M D EN ES D IG ED N TR: Tape & Reel Blank: Tube Condition A: Active High with Auto Discharge B: Active High without Auto Discharge C: Active Low with Auto Discharge D: Active Low without Auto Discharge Product Package SOIC-8 AP2805A MSOP-8 Condition Active High with Auto Discharge Package M: SOIC-8 MM: MSOP-8 Temperature Part Number Range Green -40 to 85°C SOIC-8 Active High AP2805B without Auto Discharge -40 to 85°C MSOP-8 SOIC-8 AP2805C MSOP-8 SOIC-8 AP2805D MSOP-8 Active Low with Auto Discharge Active Low without Auto Discharge -40 to 85°C -40 to 85°C Marking ID Green Packing Type AP2805AM-G1 2805AM-G1 Tube AP2805AMTR-G1 2805AM-G1 Tape & Reel AP2805AMM-G1 2805AMM-G1 Tube Tape & Reel AP2805AMMTR-G1 2805AMM-G1 AP2805BM-G1 2805BM-G1 Tube AP2805BMTR-G1 2805BM-G1 Tape & Reel AP2805BMM-G1 2805BMM-G1 Tube Tape & Reel AP2805BMMTR-G1 2805BMM-G1 AP2805CM-G1 2805CM-G1 Tube Tape & Reel AP2805CMTR-G1 2805CM-G1 AP2805CMM-G1 2805CMM-G1 Tube AP2805CMMTR-G1 2805CMM-G1 Tape & Reel AP2805DM-G1 2805DM-G1 Tube AP2805DMTR-G1 2805DM-G1 Tape & Reel AP2805DMM-G1 2805DMM-G1 Tube AP2805DMMTR-G1 2805DMM-G1 Tape & Reel BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant and Green. Aug. 2012 Rev 1. 3 BCD Semiconductor Manufacturing Limited 4 Data Sheet 500mA High-side Power Distribution Switch with Enable and Flag AP2805 Absolute Maximum Ratings (Note 1) Parameter Symbol Value Unit VIN 6.0 V TJ 150 ºC TSTG -65 to 150 ºC Lead Temperature (Soldering,10 sec) TLEAD 260 ºC N O T FO R R EC N O EW M M D EN ES D IG ED N Power Supply Voltage Operating Junction Temperature Range Storage Temperature Range Thermal Resistance (Junction to Ambient) θJA SOIC-8 135 MSOP-8 150 o C/W ESD (Machine Model) 200 V ESD (Human Body Model) 2000 V Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Conditions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability. Recommended Operating Conditions Parameter Supply Voltage Operating Ambient Range Aug. 2012 Temperature Symbol Min Max Unit VIN 2.7 5.5 V TA -40 85 °C Rev 1. 3 BCD Semiconductor Manufacturing Limited 5 Data Sheet 500mA High-side Power Distribution Switch with Enable and Flag AP2805 Electrical Characteristics (VIN=5.0V, CIN=2.2µF, COUT=1.0µF, Typical TA=25°C, unless otherwise specified) Parameter Symbol VIN Min Typ Max Unit 2.7 5.5 N O T FO R R EC N O EW M M D EN ES D IG ED N Input Voltage Range Conditions Switch On Resistance RDS(ON) VIN=5.0V, IOUT=0.5A 60 80 mΩ 1.0 1.4 A 80 µA Current Limit ILIMIT VOUT=4.0V Supply Current ISUPPLY VIN=5.0V, No Load 60 Fold-back Short Current ISHORT VOUT=0V 0.7 Chip Disable, Shutdown Mode 0.1 Shutdown Supply Current ISHUTDOWN 0.7 V A 1 µA Enable High Input Threshold VENH 1.6 5.5 V Enable Low Input Threshold VENL 0 1.0 V Force 0V to 5.0V at EN Pin -1.0 1.0 µA VIN Increasing from 0V 2.2 2.7 V Enable Pin Input Current Under Voltage Threshold Voltage Lockout IEN VUVLO Under Voltage Hysteresis VUVLOHY Reverse Current IREVERSE Output Pull Low Resistance after Shutdown Output Turn-on Time RDISCHARGE tON Flag Delay Time tDFLG Flag Low Voltage VFLG Flag Leakage Current Thermal Temperature ILEAKAGE Shutdown Thermal Shutdown Hysteresis Aug. 2012 2.5 0.2 V Chip Disable, VOUT>VIN 0.1 1.0 µA AP2805A, AP2805C only 100 200 Ω From Enable Active to 90% of Output From Fault Condition to Flag Active ISINK=5.0mA 500 5 µs 10 15 ms 35 70 mV 1.0 µA FLAG Disable, Force 5.0V TOTSD 150 o THYOTSD 30 o Rev 1. 3 C C BCD Semiconductor Manufacturing Limited 6 Data Sheet 500mA High-side Power Distribution Switch with Enable and Flag AP2805 Typical Performance Characteristics 100 100 80 Supply Current (μA) 80 N O T FO R R EC N O EW M M D EN ES D IG ED N Supply Current (μA) 90 VIN=5V Enable Active No Load 90 70 60 50 40 30 70 60 50 40 0 0 -40 -20 0 20 40 60 -10 1.0 80 1.5 2.0 2.5 o Figure 4. Supply Current vs. Ambient Temperature 4.0 4.5 5.0 5.5 1.5 o 1.4 Current Limit (A) 1.3 1.2 1.1 1.0 0.9 1.2 1.1 1.0 0.9 0.8 0.8 0.7 0.7 0.6 0.6 3.0 3.5 4.0 4.5 5.0 VIN=3.3V VIN=5V Enable Active 1.4 TA=25 C Enable Active 1.3 Current Limit (A) 3.5 Figure 5. Supply Current vs. Supply Voltage 1.5 0.5 -40 5.5 Supply Voltage (V) -20 0 20 40 60 80 o Ambient Temperature ( C) Figure 6. Current Limit vs. Supply Voltage Aug. 2012 3.0 Supply Voltage (V) Ambient Temperature ( C) 0.5 o TA= 85 C Enable Active 10 10 o TA= 25 C 20 20 o TA=-40 C 30 Figure 7. Current Limit vs. Ambient Temperature Rev 1. 3 BCD Semiconductor Manufacturing Limited 7 Data Sheet 500mA High-side Power Distribution Switch with Enable and Flag AP2805 Typical Performance Characteristics (Continued) 0.80 1.0 o TA=25 C Enable Active VIN=5V Enable Active 0.9 0.8 Output Short Current (A) Output Short Current (A) N O T FO R R EC N O EW M M D EN ES D IG ED N 0.75 0.70 0.65 0.60 0.55 0.50 0.45 0.40 0.7 0.6 0.5 0.4 0.3 0.2 0.1 3.0 3.5 4.0 4.5 5.0 0.0 -40 5.5 -20 Input Voltage (V) vs. 60 80 vs. 1.0 0.8 0.4 0.2 0.0 -0.2 -0.4 0.6 0.4 0.2 0.0 -0.2 -0.4 -0.6 -0.6 -0.8 -0.8 -20 0 20 40 60 VIN=3.5V VOUT=4.5V Disable Active 0.8 VIN=5V Disable Active 0.6 Reverse Current (μA) Shutdown Current (μA) 40 Figure 9. Output Short Current Ambient Temperature 1.0 -1.0 -40 80 o -20 0 20 40 60 80 o Ambient Temperature ( C) Ambient Temperature ( C) Figure 10. Shutdown Current vs. Ambient Temperature Aug. 2012 20 o Figure 8. Output Short Current Input Voltage -1.0 -40 0 Ambient Temperature ( C) Figure 11. Reverse Current vs. Ambient Temperature Rev 1. 3 BCD Semiconductor Manufacturing Limited 8 Data Sheet 500mA High-side Power Distribution Switch with Enable and Flag AP2805 Typical Performance Characteristics (Continued) 100 100 O IOUT=0.5A VIN=5V Enable Active TA=25 C IOUT=0.5A Enable Active 90 80 Switch On Resistance (mΩ) Switch On Resistance (mΩ) N O T FO R R EC N O EW M M D EN ES D IG ED N 90 70 60 50 40 30 20 80 70 60 50 40 10 30 0 -40.0 -20.0 0.0 20.0 40.0 60.0 O 3.0 80.0 3.5 4.0 Ambient Temperature ( C) 2.70 Enable Active 2.60 2.55 VIN Rising 2.50 2.45 2.40 VIN Falling 2.35 2.30 2.25 -20.0 0.0 20.0 40.0 60.0 80.0 VIN=5V Enable Active 14 13 12 11 10 9 8 7 6 -20.0 0.0 20.0 40.0 60.0 80.0 O Ambient Temperature ( C) O Ambient Temperature ( C) Figure 14. Under Voltage Lockout Threshold Voltage vs. Ambient Temperature Aug. 2012 5.5 15 5 -40.0 2.20 -40.0 5.0 Figure 13. Switch On Resistance vs. Supply Voltage Flag Delay Time During Over Current (mS) Under Voltage Lockout Threshold Voltage (V) Figure 12. Switch On Resistance vs. Ambient Temperature 2.65 4.5 Supply Voltage (V) Figure 15. Flag Delay Time During Over Current vs. Ambient Temperature Rev 1. 3 BCD Semiconductor Manufacturing Limited 9 Data Sheet 500mA High-side Power Distribution Switch with Enable and Flag AP2805 Typical Performance Characteristics (Continued) 14 VIN=5V 1.5 Enable Threshold Voltage (V) N O T FO R R EC N O EW M M D EN ES D IG ED N Flag Delay Time During Over Current (mS) 1.6 O TA=25 C VIN=5V Enable Active 12 10 8 1.4 VENH 1.3 1.2 VENL 1.1 6 1.0 3.0 3.5 4.0 4.5 5.0 5.5 -40.0 -20.0 0.0 20.0 40.0 60.0 80.0 O Supply Voltage (V) Ambient Temperature ( C) Figure 16. Flag Delay Time During Over Current vs. Supply Voltage Figure 17. Enable Threshold Voltage vs. Ambient Temperature 1.7 O TA=25 C Enable Threshold Voltage (V) 1.6 VEN (5V/div) 1.5 1.4 VENH 1.3 1.2 IINRUSH (20mA/div) 1.1 1.0 VOUT (1V/div) VENL 0.9 0.8 0.7 3.0 3.5 4.0 4.5 5.0 5.5 Time(500µs/div) Supply Voltage (V) Figure 18. Enable Threshold Voltage vs. Supply Voltage Aug. 2012 Figure 19. Output Turn ON and Rise Time (CIN=1.0μF,COUT=1.0μF,No Load) Rev 1. 3 BCD Semiconductor Manufacturing Limited 10 Data Sheet 500mA High-side Power Distribution Switch with Enable and Flag AP2805 Typical Performance Characteristics (Continued) VEN (5V/div) N O T FO R R EC N O EW M M D EN ES D IG ED N VEN (5V/div) IINRUSH (1A/div) IINRUSH (500mA/ div) VOUT (1V/div) VOUT (1V/div) Time(500µs/div) Time(500µs/div) Figure 20. Output Turn ON and Rise Time (CIN=1.0μF,COUT=1.0μF,RL=6.6Ω) Figure 21. Output Turn ON and Rise Time (CIN=1.0μF,COUT=47μF,No Load) VEN (5V/div) VOUT (1V/div) VEN (5V/div) COUT=470μF COUT=1μF VOUT (1V/div) COUT=22μF COUT=220μF IOUT (1A/div) COUT=100μF Time(5ms/div) Time(5ms/div) Figure 22. Output Turn OFF and Falling Time (VIN=5V,CIN=1.0μF,No Load) Aug. 2012 Figure 23. Output Turn OFF and Falling Time (VIN=5V,CIN=1.0μF,COUT=470μF,RL=6.6Ω) Rev 1. 3 BCD Semiconductor Manufacturing Limited 11 Data Sheet 500mA High-side Power Distribution Switch with Enable and Flag AP2805 Typical Performance Characteristics (Continued) VFLAG (1V/div) VEN (5V/div) VOUT (1V/div) IOUT (1A/div) N O T FO R R EC N O EW M M D EN ES D IG ED N VOUT (1V/div) IOUT (1A/div) Time(100ms/div) Time(5ms/div) Figure 24. Output Short to GND Current (VIN=5V,CIN=1.0μF) Figure 25. FLAG Response During Over Current (VIN=5V,CIN=1.0μF,COUT=470μF) VFLAG (1V/div) VOUT (1V/div) IOUT (1A/div) Time(5ms/div) Figure 26. FLAG Response During Over Temperature (VIN=5V,CIN=1.0μF,COUT=220μF,RL=6.6Ω) Aug. 2012 Rev 1. 3 BCD Semiconductor Manufacturing Limited 12 Data Sheet 500mA High-side Power Distribution Switch with Enable and Flag AP2805 N O T FO R R EC N O EW M M D EN ES D IG ED N Typical Application Note 2: 2.2µF input capacitor is enough in most application cases. If the VOUT is short to ground frequently during usage, large size input capacitor is necessary, recommend 22µF. Figure 27. Typical Application of AP2805 Aug. 2012 Rev 1. 3 BCD Semiconductor Manufacturing Limited 13 Data Sheet 500mA High-side Power Distribution Switch with Enable and Flag AP2805 Mechanical Dimensions Unit: mm(inch) SOIC-8 0.320(0.013) N O T FO R R EC N O EW M M D EN ES D IG ED N 4.700(0.185) 5.100(0.201) 7° 1.350(0.053) 1.750(0.069) 8° 8° 7° 0.675(0.027) 0.725(0.029) D 5.800(0.228) 1.270(0.050) 6.200(0.244) TYP D 20:1 0.300(0.012) R0.150(0.006) 0.100(0.004) 0.800(0.031) 0.200(0.008) 0° 8° 1.000(0.039) 3.800(0.150) 4.000(0.157) 0.330(0.013) 0.510(0.020) 0.190(0.007) 0.250(0.010) 0.900(0.035) 1° 5° R0.150(0.006) 0.450(0.017) 0.800(0.031) Note: Eject hole, oriented hole and mold mark is optional. Aug. 2012 Rev 1. 3 BCD Semiconductor Manufacturing Limited 14 Data Sheet 500mA High-side Power Distribution Switch with Enable and Flag AP2805 Mechanical Dimensions (Continued) Unit: mm(inch) Aug. 2012 2.900(0.114) 3.100(0.122) 0.200(0.008) 0.000(0.000) 4.700(0.185) 5.100(0.201) 0.410(0.016) 0.650(0.026) N O T FO R R EC N O EW M M D EN ES D IG ED N MSOP-8 Rev 1. 3 BCD Semiconductor Manufacturing Limited 15 N O T FO R R EC N O EW M M D EN ES D IG ED N IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifications herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. MAIN SITE - Headquarters BCD Semiconductor Manufacturing Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China Tel: +86-21-24162266, Fax: +86-21-24162277 - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. 800 Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corp. 30920 Huntwood Ave. Hayward, CA 94544, USA Tel : +1-510-324-2988 Fax: +1-510-324-2788