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AP3581BMP-G1

AP3581BMP-G1

  • 厂商:

    BCDSEMI(美台)

  • 封装:

    SOIC8

  • 描述:

    IC REG CTRLR BUCK 8PSOP

  • 数据手册
  • 价格&库存
AP3581BMP-G1 数据手册
OBSOLETE Data Sheet Single Phase Synchronous Buck PWM Controller General Description Features The1AP3581A/B/C1is1a1compact1synchronous-rect ified buck controller specifically designed to operate from 5V/12V supply and deliver high-quality output voltage as low as 0.6V (AP3581A) or 0.8V (AP3581B/C). The AP3581A/B/C operates at fixed frequency of 300kHz (AP3581A/B) or 200kHz (AP3581C) and provides an optimal level of integration to reduce size and cost of the power supply. • • • • • • • • • This controller integrates internal MOSFET drivers that support 12V+12V bootstrapped voltage for highefficiency power conversion. The bootstrap diode is built-in to simplify the circuit design and minimize external part count. • • • • • • • • This controller provides single feedback loop, voltage-mode control with fast transient response. The error amplifier features a 10MHz gain-bandwidth product and 6V/µs slew rate which enables high converter bandwidth for fast transient performance. AP3581A/B/C Supply Voltage: 5V/12V VIN Input Range: 3.0V to 13.2V 0.6V/0.8V to 80% of VIN Output Range Internal Reference: 0.6V/0.8V Simple Single-loop Control Voltage-mode PWM Control Duty Cycle: 0% to 80% Fast Transient Response 10MHz High-bandwidth Error Amplifier with 6V/µs Slew Rate Fixed Oscillator Frequency: 300kHz/200kHz Lossless, Programmable Over Current Protection (Uses Lower MOSFET RDS(ON) ) Start-up into Pre-biased Output Built-in Thermal Shutdown Built-in Soft-start Over Current/Voltage Protection Under Voltage Protection Integrated Boot Diode Applications Other features include internal soft-start, under voltage protection, over current protection and shutdown function. With afore-mentioned functions, this part provides customers a compact, high efficiency, well-protected and cost-effective solutions. • • • • • • The AP3581A/B/C is available in PSOP-8 package. • • • • Power Supplies for Microprocessors/Peripherals PCs, Embedded Controllers, Memory Supplies DSP and Core Communications Processor Supplies Subsystem Power Supplies PCI, AGP, Graphics Cards, Digital TV SSTL-2 and DDR/2/3 SDRAM Bus Termination Supply Cable Modems, Set Top Boxes, and DSL Modems Industrial Power Supplies and General Purpose Supplies 5V/12V Input DC-DC Regulators Low-voltage Distributed Power Supplies PSOP-8 Figure 1. Package Type of AP3581A/B/C Oct. 2011 Rev. 1. 0 BCD Semiconductor Manufacturing Limited 1 Data Sheet Single Phase Synchronous Buck PWM Controller AP3581A/B/C Pin Configuration MP Package (PSOP-8) 1 8 2 7 3 6 4 5 Figure 2. Pin Configuration of AP3581A/B/C (Top View) Pin Description Pin Number Oct. 2011 Pin Name 1 BOOT 2 UGATE 3 OPS 4 LGATE 5 VCC 6 FB 7 COMP/EN 8 PHASE 9 GND Function Bootstrap pin. Connect a bootstrap capacitor (Typically from 0.1µF to 0.47µF) from this pin to PHASE pin to create a BOOT voltage suitable to drive a standard N-Channel MOSFET Upper-gate drive pin. Connect this pin to the upper MOSFET gate providing the gate drive. This pin is monitored by the adaptive shoot-through protection circuitry to determine when the upper MOSFET has been turned off Over-current setting pin. Connecting a resistor (ROCSET) between OPS and GND to set the over-current trigger point Lower-gate drive pin. Connect LGATE to the lower MOSFET gate providing the gate drive for the lower MOSFET. This pin is monitored by the adaptive shoot-through protection circuitry to determine when the lower MOSFET has turned off Bias supply pin. Provides a 5V or 12V bias supply for the chip from this pin. The pin should be bypassed with a capacitor to GND Feedback pin. This pin is the inverting input of the internal error amplifier. Use FB pin, in combination with the COMP pin, to compensate the voltage control feedback loop of the converter. A resistor divider from output to GND is used to set the output voltage Compensation and disable pin, this pin is the output of the error amplifier. Pull COMP pin low will shut down the IC PHASE pin. This pin connects to the source of the upper MOSFET and the drain of the lower MOSFET. This pin is also monitored by the adaptive shoot-through protection circuitry to determine when the upper MOSFET has turned off Exposed pad as ground pin. Represents the signal and power ground for the IC. Tie this pin to the ground island/plane through the lowest impedance connection available Rev. 1. 0 BCD Semiconductor Manufacturing Limited 2 Data Sheet Single Phase Synchronous Buck PWM Controller AP3581A/B/C Functional Block Diagram Figure 3. Functional Block Diagram of AP3581A/B/C Ordering Information AP3581 A Package PSOP-8 Circuit Type A:AP3581A B:AP3581B C:AP3581C Package MP: PSOP-8 Temperature Range -40 to 85°C A G1: Green Blank: Tube TR: Tape & Reel Part Number Marking ID Packing Type AP3581AMP-G1 3581AMP-G1 Tube AP3581AMPTR-G1 3581AMP-G1 Tape & Reel AP3581BMP-G1 3581BMP-G1 Tube AP3581BMPTR-G1 3581BMP-G1 Tape & Reel AP3581CMP-G1 3581CMP-G1 Tube AP3581CMPTR-G1 3581CMP-G1 Tape & Reel BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant and green. Oct. 2011 Rev. 1. 0 BCD Semiconductor Manufacturing Limited 3 Data Sheet Single Phase Synchronous Buck PWM Controller AP3581A/B/C Absolute Maximum Ratings (Note 1) Parameter Symbol Value Unit Supply Voltage VCC -0.3 to 15 V BOOT Voltage VBOOT -0.3 to VPHASE +15 V Voltage from UGATE to PHASE VUGATE -0.3 to 15 V Voltage from PHASE, LGATE Pin to GND VPHASE, VLGATE -1 to 15 V -0.3 to 6 V Voltage on Other Separate Pin Thermal Resistance θJA 50 ºC/W Operating Junction Temperature TJ -40 to 125 ºC Storage Temperature TSTG -65 to 150 ºC Lead Temperature (Soldering, 10 sec) TLEAD 260 ºC ESD (Human Body Model) (Note 2) 2000 V ESD (Machine Model) (Note 2) 200 V Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Conditions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability. Note 2: Devices are ESD sensitive. Handling precaution recommended. Recommended Operating Conditions Parameter Symbol Min Max Unit VCC 4.5 13.2 V Operating Junction Temperature Range TJ -40 125 °C Operating Ambient Temperature TA -40 85 °C Supply Input Voltage Oct. 2011 Rev. 1. 0 BCD Semiconductor Manufacturing Limited 4 Data Sheet Single Phase Synchronous Buck PWM Controller AP3581A/B/C Electrical Characteristics VCC=12V, TA=25°C, unless otherwise specified. Parameter Symbol Conditions Min Typ Max Unit 13.2 V SUPPLY INPUT Supply Voltage VCC Supply Current ICC Quiescent Supply Current Power Input Voltage ICC_Q 4.5 UGATE and LGATE Pin Open; VCC=12V, Switching VFB=VREF+0.1V, No Switching VIN 5 mA 4 mA 3.0 13.2 V 4.4 V POWER ON RESET VCC Rising Threshold VCC Threshold Hysteresis VPOR VCC Rising 4.0 VPOR_HYS 4.2 500 mV OSCILLATOR Oscillator Frequency Ramp Amplitude fOSC ∆VOSC AP3581A/B 270 300 330 AP3581C 180 200 220 VCC=12V kHz 1.8 V 70 dB 10 MHz 6 V/µs ERROR AMPLIFIER Open Loop DC Gain (Note 3) GDC_OL Gain Bandwidth (Note 3) GBW Slew Rate (Note 3) SR 55 3 Transconductance 800 1100 µA/V Output Source Current VFBVREF 80 120 µA -1 A 1.5 A PWM CONTROLLER GATE DRIVERS Upper Gate Source Current IUG_SRC Upper Gate Sink Current IUG_SNK Upper Gate Sink Resistance RUGATE Lower Gate Source Current ILG_SRC Lower Gate Sink Current ILG_SNK Lower Gate Sink Resistance PHASE Falling to LGATE Rising Delay Oct. 2011 RLGATE VBOOT-VPHASE=12V, VBOOT-VUGATE=6V VBOOT-VPHASE=12V, VBOOT-VUGATE=6V 50mA Sink Current, VBOOT-VPHASE=12V 1.6 3.2 Ω VCC-VLGATE=6V -1 A VLGATE=6V 1.5 A 50mA Sink Current, VCC=12V VPHASE1.2V Rev. 1. 0 1 50 2 Ω ns BCD Semiconductor Manufacturing Limited 5 Data Sheet Single Phase Synchronous Buck PWM Controller AP3581A/B/C Electrical Characteristics (Continued) VCC=12V, TA=25ºC, unless otherwise specified. Parameter Symbol Conditions LGATE Falling to UGATE Rising Delay Min Typ VLGATE1.2V Minimum Duty Cycle Maximum Duty Cycle Max Unit 50 ns 0 % 75 80 85 % AP3581A 0.591 0.6 0.609 V AP3581B/C 0.788 0.8 0.812 V 0.3 0.4 0.5 V 40 50 µA REFERENCE VOLTAGE Feedback Voltage VFB PROTECTION Under Voltage Protection VFB_UVP Over Current Source IOPS Soft-start Interval 30 tSS Enable Threshold AP3581A 2.0 AP3581B 2.7 AP3581C 3.6 VCOMP/EN 0.25 ms 0.30 0.35 V Thermal Shutdown TOTSD 160 ºC Thermal Shutdown Hysteresis THYS 20 ºC Note 3: Not tested, guaranteed by design. Typical Performance Characteristics 0.5 0.2 0.4 0.1 VOUT=1.2V, IOUT=5A Output Voltage Variation (%) Output Voltage Variation (%) 0.3 0.2 0.1 0.0 -0.1 -0.2 -0.3 VIN=12V,VOUT=1.2V 0.0 -0.1 -0.2 -0.3 -0.4 -0.5 -0.6 -0.4 -0.5 -0.7 4 5 6 7 8 9 10 11 12 13 14 0 Input Voltage (V) 4 6 8 10 12 14 16 18 20 Output Current (A) Figure 4. Line Regulation Oct. 2011 2 Figure 5. Load Regulation Rev. 1. 0 BCD Semiconductor Manufacturing Limited 6 Data Sheet Single Phase Synchronous Buck PWM Controller AP3581A/B/C Typical Performance Characteristics (Continued) 360 360 350 350 340 330 Switching Frequency (kHz) Switching Frequency (kHz) 340 320 310 300 290 280 270 For AP3581A 260 330 320 310 300 290 280 270 For AP3581A 260 250 250 240 -50 -25 0 25 50 75 100 125 240 150 4 5 6 7 8 9 10 11 12 13 14 o Temperature ( C) Input Voltage (V) Figure 7. Switching Frequency vs. Input Voltage 0.70 0.70 0.68 0.68 0.66 0.66 0.64 0.64 Feedback Voltage (V) Feedback Voltage (V) Figure 6. Switching Frequency vs. Temperature 0.62 0.60 0.58 0.56 0.54 For AP3581A 0.62 0.60 0.58 0.56 For AP3581A 0.54 0.52 0.52 0.50 -50 -25 0 25 50 75 100 125 150 0.50 Temperature (°C) 4 5 6 7 8 9 10 11 12 13 14 Input Voltage (V) Figure 8. Feedback Voltage vs. Temperature Oct. 2011 Figure 9. Feedback Voltage vs. Input Voltage Rev. 1. 0 BCD Semiconductor Manufacturing Limited 7 Data Sheet Single Phase Synchronous Buck PWM Controller AP3581A/B/C Typical Performance Characteristics (Continued) VIN 10V/div VOUT 0.5V/div VPHASE 10V/div IL 10A/div VIN 10V/div VOUT 0.5V/div VCOMP 0.5V/div VLGATE 10V/div Time 200µs/div Time 1ms/div Figure 10. Power-on Waveform (VIN=12V, VOUT=1.2V, IOUT=0A) Figure 11. Power-off Waveform (VIN=12V, VOUT=1.2V, IOUT=20A) VIN 10V/div VPHASE 10V/div VOUT 0.5V/div VCOMP 0.5V/div IL 10A/div VOUT 0.5V/div VCOMP 0.5V/div IL 10A/div Time 20µs/div Time 1ms/div Figure 13. Disable Waveform (VIN=12V, VOUT=1.2V, IOUT=20A) Figure 12. Enable Waveform (VIN=12V, VOUT=1.2V, IOUT=0A) Oct. 2011 Rev. 1. 0 BCD Semiconductor Manufacturing Limited 8 Data Sheet Single Phase Synchronous Buck PWM Controller AP3581A/B/C Typical Performance Characteristics (Continued) VPHASE 5V/div VPHASE 5V/div VOUT_AC 200mV/div VOUT_AC 200mV/div IOUT 10A/div IOUT 5A/div Time 10µs/div Time 10µs/div Figure 14. Load Transient Response (VIN=12V, VOUT=1.2V, IOUT=0A to 10A) Figure 15. Load Transient Response (VIN=12V, VOUT=1.2V, IOUT=0A to 20A) VUGATE-PHASE 2V/div VUGATE-PHASE 2V/div VLGATE 2V/div VPHASE 2V/div VLGATE 2V/div VPHASE 2V/div Time 40ns/div Time 40ns/div Figure 16. UGATE Turn Off Waveforms (VCC=VIN=12V, VOUT=1.2V, IOUT=20A) Oct. 2011 Figure 17. UGATE Turn On Waveforms (VCC=VIN=12V, VOUT=1.2V, IOUT=20A) Rev. 1. 0 BCD Semiconductor Manufacturing Limited 9 Data Sheet Single Phase Synchronous Buck PWM Controller AP3581A/B/C Typical Performance Characteristics (Continued) VOUT 1V/div VCOMP 0.5V/div VFB 1V/div VLGATE 10V/div VUGATE 20V/div IL 10A/div VPHASE 10V/div IL 10A/div Time 80µs/div Time 10ms/div Figure 18. Over Current Protection (VIN=12V, VOUT=1.2V to 0V, IOUT=0A) Oct. 2011 Figure 19. Over Voltage Protection (VIN=12V, VOUT=1.2V, IOUT=20A) Rev. 1. 0 BCD Semiconductor Manufacturing Limited 10 Data Sheet Single Phase Synchronous Buck PWM Controller AP3581A/B/C Typical Application Figure 20. Typical Application Circuit of AP3581A/B/C Oct. 2011 Rev. 1. 0 BCD Semiconductor Manufacturing Limited 11 Data Sheet Single Phase Synchronous Buck PWM Controller AP3581A/B/C Mechanical Dimensions Unit: mm(inch) 3.202(0.126) 3.402(0.134) PSOP-8 Oct. 2011 Rev. 1. 0 BCD Semiconductor Manufacturing Limited 12 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com IMPORTANT NOTICE IMPORTANT NOTICE BCD Semiconductor BCD Semiconductor Manufacturing Manufacturing Limited Limited reserves reserves the the right right to to make make changes changes without without further further notice notice to to any any products products or or specifispecifications herein. cations herein. BCD BCD Semiconductor Semiconductor Manufacturing Manufacturing Limited Limited does does not not assume assume any any responsibility responsibility for for use use of of any any its its products products for for any any particular purpose, particular purpose, nor nor does does BCD BCD Semiconductor Semiconductor Manufacturing Manufacturing Limited Limited assume assume any any liability liability arising arising out out of of the the application application or or use use of any of any its its products products or or circuits. circuits. BCD BCD Semiconductor Semiconductor Manufacturing Manufacturing Limited Limited does does not not convey convey any any license license under under its its patent patent rights rights or or other rights other rights nor nor the the rights rights of of others. others. MAIN SITE SITE MAIN - Headquarters BCD Semiconductor Manufacturing Limited BCD Semiconductor Manufacturing Limited - Wafer Fab No. 1600, Zi Xing Road, Shanghai ZiZhu Science-basedLimited Industrial Park, 200241, China Shanghai SIM-BCD Semiconductor Manufacturing Tel: Fax: +86-21-24162277 800,+86-21-24162266, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 REGIONAL SALES OFFICE Shenzhen OfficeSALES OFFICE REGIONAL - Wafer FabSemiconductor Manufacturing Limited BCD Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. - IC Design Group 800 Yi Shan Road, Shanghai 200233, China Corporation Advanced Analog Circuits (Shanghai) Tel: +86-21-6485 1491,YiFax: 0008200233, China 8F, Zone B, 900, Shan+86-21-5450 Road, Shanghai Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 Taiwan Office Shanghai Semiconductor Manufacturing Co., Ltd., Shenzhen Office BCD Taiwan Semiconductor Shenzhen SIM-BCD Office Office (Taiwan) Company Limited Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan Shenzhen, 4F, 298-1, Guang Road,(Taiwan) Nei-Hu District, Taipei, Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.District, Shenzhen Office BCDRui Semiconductor Company Limited China Taiwan Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Tel: +86-755-8826 Tel: +886-2-2656 2808 Room E, 5F, Noble 7951 Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Taiwan Fax: +86-755-88267951 7865 Fax: +886-2-2656 28062808 Tel: +86-755-8826 Tel: +886-2-2656 Fax: +86-755-8826 7865 Fax: +886-2-2656 2806 USA Office BCD Office Semiconductor Corp. USA 30920Semiconductor Huntwood Ave.Corporation Hayward, BCD CA 94544, USA Ave. Hayward, 30920 Huntwood Tel :94544, +1-510-324-2988 CA U.S.A Fax:: +1-510-324-2988 +1-510-324-2788 Tel Fax: +1-510-324-2788
AP3581BMP-G1 价格&库存

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