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APT17

APT17

  • 厂商:

    BCDSEMI(美台)

  • 封装:

  • 描述:

    APT17 - HIGH VOLTAGE NPN TRANSISTOR - BCD Semiconductor Manufacturing Limited

  • 数据手册
  • 价格&库存
APT17 数据手册
Data Sheet HIGH VOLTAGE NPN TRANSISTOR General Description The APT17 is high voltage, small signal NPN transistor. The APT17 is available in SOT-23 and TO-92 packages. APT17 Features · High Collector-Emitter Voltage: 480V Applications · High Voltage and Low Standby Power Circuit for BCD Solution SOT-23 TO-92 TO-92 Ammo packing Figure 1. Package Types of APT17 Pin Configuration N Package (SOT-23) Collector 3 Z Package (TO-92) (TO-92 Ammo Package) Base Collector Emitter 3 2 Base Collector Emitter 3 2 1 1 2 1 Base Emitter Figure 2. Pin Configurations of APT17 (Top View) May. 2009 1. 1 1 BCD Semiconductor Manufacturing Limited Data Sheet HIGH VOLTAGE NPN TRANSISTOR Ordering Information APT17 Circuit Type Package N: SOT-23 Z: TO-92 G1: Green TR: Tape & Reel or Ammo Blank: Bulk APT17 Package SOT-23 TO-92 Part Number APT17NTR-G1 APT17Z-G1 APT17ZTR-G1 GD8 Marking ID APT17Z-G1 APT17Z-G1 Packing Type Tape & Reel Bulk Ammo BCD Semi con ductor's prod ucts, as d esi gnated wi th "G1" su ffix in t he part numb er, are RoHS compliant and Green. Absolute Maximum Ratings (Note 1) Parameter Collector-Emitter Voltage (VBE=0) Collector-Emitter Voltage (IB=0) Emitter-Base Voltage (IC=0) Collector Current Collector Peak Current (Pulse) Base Current Base Peak Current (Pulse) Power Dissipation, TA=25oC Operating Junction Temperature Storage Temperature Range SOT-23 TO-92 Symbol VCES VCEO VEBO IC ICM IB IBM PTOT Value 700 480 10 50 100 25 50 0.2 0.5 150 -55 to 150 Unit V V V mA mA mA mA W o C oC Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Maximum Ratings" for extended periods may affect device reliability. May. 2009 1. 1 2 BCD Semiconductor Manufacturing Limited Data Sheet HIGH VOLTAGE NPN TRANSISTOR Thermal Characteristics Parameter Thermal Resistance (Junction-to-Ambient) SOT-23 TO-92 θJA Symbol Value 625 250 Unit oC/W APT17 Electrical Characteristics ( TC=25oC, unless otherwise specified.) Parameter Collector Cut-off Current (VBE=-1.5V) Collector-Emitter Sustaining Voltage (IB=0) DC Current Gain Symbol ICEV VCEO (sus) hFE Conditions VCE=700V IC=300µA IC=300µA, VCE=20V IC=10mA, VCE=20V 480 20 20 25 40 50 Min Typ Max 10 Unit µA V May. 2009 1. 1 3 BCD Semiconductor Manufacturing Limited Data Sheet HIGH VOLTAGE NPN TRANSISTOR APT17 Typical Performance Characteristics 35 VCE=20V 30 100 VCE=20V TJ=125 C 0 DC Current Gain hFE 25 TJ=25 C 0 Instantanous Reverse Current(µA) TJ=150 C 10 0 TJ=125 C 1 0 20 15 0.1 TJ=75 C 0 10 0.01 5 TJ=25 C 1E-3 20 40 60 80 100 120 0 0 1E-4 1E-3 0.01 0.1 Collector Current IC(A) Percent of Collector-Emitter Reverse voltage(%) Figure 3. DC Current Gain Figure 4. Typical Reverse Characteristics May. 2009 1. 1 4 BCD Semiconductor Manufacturing Limited Data Sheet HIGH VOLTAGE NPN TRANSISTOR APT17 Mechanical Dimensions SOT-23 Unit: mm(inch) May. 2009 1. 1 5 BCD Semiconductor Manufacturing Limited Data Sheet HIGH VOLTAGE NPN TRANSISTOR APT17 Mechanical Dimensions (Continuted) TO-92 Unit: mm(inch) 1.100(0.043) 1.400(0.055) 3.430(0.135) MIN 0.360(0.014) 0.510(0.020) 3.300(0.130) 3.700(0.146) 0.000(0.000) 0.380(0.015) Φ1.600(0.063) MAX 4.400(0.173) 4.700(0.185) 4.300(0.169) 4.700(0.185) 0.380(0.015) 0.550(0.022) 1.270(0.050) TYP 2.440(0.096) 2.640(0.104) May. 2009 1. 1 6 14.100(0.555) 14.500(0.571) BCD Semiconductor Manufacturing Limited Data Sheet HIGH VOLTAGE NPN TRANSISTOR APT17 Mechanical Dimensions (Continuted) TO-92 Ammo Packing Unit: mm(inch) 12.400(0.488) 13.000(0.512) ±1.000(0.039) ΔP ±1.000(0.039) 4.400(0.173) 4.600(0.181) Δh 3.400(0.134) 3.600(0.142) 4.400(0.173) 4.600(0.181) 19.000(0.748) 21.000(0.827) 0.380(0.015) 0.550(0.022) 1.000 (0.039) MAX 5.500(0.217) 6.500(0.256) 6.050(0.238) 6.650(0.262) 2.200(0.087) 2.800(0.110) 2.200(0.087) 2.800(0.110) 15.500(0.610) 16.500(0.650) 2.500(0.098) MIN 8.500(0.335) 9.500(0.374) 3.550(0.140) 4.150(0.163) 3.800(0.150) 4.200(0.165) 17.500(0.689) 19.000(0.748) 12.500(0.492) 12.900(0.508) 0.150(0.006) 0.250(0.010) 0.350(0.014) 0.450(0.018) May. 2009 1. 1 7 BCD Semiconductor Manufacturing Limited Data Sheet HIGH VOLTAGE NPN TRANSISTOR APT17 Soldering Information 2.90 2.50 Solder Lands 1.70 2.70 1.30 Solder Resist Solder Paste Occupied Area 0.60 (3X) Dimensions in mm 0.50(3X) 0.60 (3X) 1.0 3.30 Figure 5. Reflow Soldering Footprint SOT-23 May. 2009 1. 1 8 BCD Semiconductor Manufacturing Limited Data Sheet HIGH VOLTAGE NPN TRANSISTOR APT17 Soldering Information(Continuted) Solder Lands Solder Resist Occupied Area 1.20 4.00 Dimensions in mm Preferred transport direction during soldering 2.80 4.50 Figure 6. Waving Soldering Footprint SOT-23 May. 2009 1. 1 9 BCD Semiconductor Manufacturing Limited BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com I MPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifications herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. IMPORTANT NOTICE MAIN SITE - Head quarters - Wafer Fab cations herein. BCD Semiconductor Manufacturing Limited doesanghai assume any responsibility for use Ltd .any its products for any BCD Semicond uctor Manufacturing Limited Sh not SIM-BCD Semicon ductor Manufacturing Co., of No. 1600, Zi Xingpurpose, nor doescience-based Industrial Park, 200241, China 800 Yi Shan Road, S hanghai 200233, China particular Road, Shanghai ZiZhu S BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use Tel: +86-21-24162266, F ax: +86-21-24162277 Tel: + 86-21-6485 1491, Fax: + 86-21-5450 0008 BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- REGIONAL SALES OFFICE other rights nor the rights Sh en zh en Office Sh anghai SIM-BCD Semicon ductor Manu factu ring Co., Ltd., S henzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen, MAIN SITE 518026, China BCD Semiconductor Manufacturing Limited Tel: +86-755-8826 7951 - +86-755-8826 7865 Fax:Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Limited 800, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or of others. US A Office Taiw an Office BCD Semicon ductor C orp . BCD Semicond uctor (Taiwan) Compan y Limited 30920 H untw ood Ave. Hayward, 4F 298-1, Rui Guang Road, Nei-H u District, Taipei, , CA 94544, USA Taiwan BCD Semiconductor Manufacturing Limited : +1-510-324-2988 Tel Tel: +886-2-2656 2808 - IC Design Group Fax: +1-510-324-2788 Fax: +886-2-2656 2806 Advanced Analog Circuits (Shanghai) Corporation 8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corporation 30920 Huntwood Ave. Hayward, CA 94544, U.S.A Tel : +1-510-324-2988 Fax: +1-510-324-2788
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