B140B-13

________________________________________________________________________ DATE: 9th July, 2014 PCN #:   2136 PCN Title: Qualification of "Yangzhou YangJie Electronic Technology Company Limited" as an Additional Assembly & Test Site and “J & V Semiconductor” as an Additional Wafer Source for Selected Discrete Devices, and Qualification of New Lead Frame and Clip for Selected GBJ Devices Dear Customer: This is an announcement of change(s) to products that are currently being offered by Diodes Incorporated. We request that you acknowledge receipt of this notification within 30 days of the date of this PCN. If you require samples for evaluation purposes, please make a request within 30 days as well. Otherwise, samples may not be built prior to this change. Please refer to the implementation date of this change as it is stated in the attached PCN form. Please contact your local Diodes sales representative to acknowledge receipt of this PCN and for any sample requests. The changes announced in this PCN will not be implemented earlier than 90 days from the notification date stated in the attached PCN form. Previously agreed upon customer specific change process requirements or device specific requirements will be addressed separately. For questions or clarification regarding this PCN, please contact your local Diodes sales representative. Sincerely, Diodes Incorporated PCN Team DIC-034 R2 Page 1 of 3 Diodes Incorporated www.diodes.com Rel Date: 5/29/2013 ________________________________________________________________________ PRODUCT CHANGE NOTICE PCN-2136 REV 00 Notification Date: Implementation Date: Product Family: Change Type: PCN #: 9th July, 2014 8th October, 2014 Discrete Products Additional Assembly & Test Site / New Wafer Source / Lead Frame and Clip structure 2136 TITLE Qualification of "Yangzhou YangJie Electronic Technology Company Limited" as an Additional Assembly & Test Site and “J & V Semiconductor” as an Additional Wafer Source for Selected Discrete Devices, and Qualification of New Lead Frame and Clip for Selected GBJ Devices DESCRIPTION OF CHANGE This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes has qualified Yangzhou YangJie Electronic Technology Company Limited" as an Additional Assembly & Test Site and “J & V Semiconductor” as an Additional Wafer Source for selected discrete devices. Additionally, in order to improve GBJ package body strength and gain better device power dissipation capability, Diodes Incorporated has qualified a new lead frame structure and clip layout for selected GBJ products. Full electrical characterization and high reliability testing have been completed to ensure that no changes in product reliability, device functionality or data sheet electrical specifications exist. There will be no change to the Form, Fit, or Function of affected products. IMPACT No change in datasheet parameters and product performance PRODUCTS AFFECTED Please refer to Table 1 for Additional A/T Site and Wafer Source Please refer to Table 2 for Additional A/T Site and Wafer Source, and Change of Lead Frame / Clip Layout at the current A/T site Please refer to Table 3 for Change of Lead Frame / Clip Layout at the current A/T Site WEB LINKS Manufacturer’s Notice: http://www.diodes.com/quality/pcns For More Information Contact: http://www.diodes.com/contacts Data Sheet: http://www.diodes.com/products DISCLAIMER Unless a Diodes Incorporated Sales representative is contacted in writing within 30 days of the posting of this notice, all changes described in this announcement are considered approved. DIC-034 R2 Page 2 of 3 Diodes Incorporated www.diodes.com Rel Date: 5/29/2013 ________________________________________________________________________ Table 1 - Additional A/T Site and Wafer Source RS2M-13-F RS2MA-13-F RS2KA-13-F RS2K-13-F RS2JA-13-F RS2J-13-F RS2GA-13-F RS2G-13-F RS2DA-13-F RS2D-13-F RS2BA-13-F RS2B-13-F RS2AA-13-F RS2A-13-F S2M-13-F S2MA-13-F S2KA-13-F S2K-13-F S2JA-13-F S2J-13-F S2GA-13-F S2G-13-F S2DA-13-F S2D-13-F S2BA-13-F S2B-13-F S2AA-13-F S2A-13-F S1M-13-F S1K-13-F S1J-13-F S1G-13-F S1D-13-F S1B-13-F S1A-13-F RS1M-13-F RS1K-13-F RS1J-13-F RS1G-13-F RS1D-13-F RS1B-13-F RS1A-13-F ES2D-13-F ES2DA-13-F ES2CA-13-F ES2C-13-F ES2BA-13-F ES2B-13-F ES2AA-13-F ES2A-13-F HD06-T HD04-T HD02-T HD01-T GBU810 GBU808 GBU806 GBU804 GBU802 GBU801 GBU8005 GBU610 GBU608 GBU606 GBU604 GBU602 GBU601 GBU6005 GBU410 GBU408 GBU406 GBU404 GBU402 GBU401 GBU1010 GBU1008 GBU1006 GBU1004 GBU1002 GBU1001 GBU10005 1N4007G-T 1N4006G-T 1N4005G-T 1N4004G-T 1N4003G-T 1N4002G-T 1N4001G-T Table 2 - Additional A/T Site and Wafer Source, and Change of Lead Frame / Clip Layout at the current A/T Site GBJ2510-F GBJ2508-F GBJ2506-F GBJ2504-F GBJ2502-F GBJ2501-F GBJ25005-F GBJ1510-F GBJ1508-F GBJ1506-F GBJ1504-F GBJ1502-F GBJ1501-F GBJ15005-F GBJ1010-F GBJ1008-F GBJ1006-F GBJ1004-F GBJ1002-F GBJ1001-F GBJ10005-F Table 3 – Change of Lead Frame / Clip Layout at the current A/T Site GBJ810-F GBJ808-F GBJ806-F GBJ804-F GBJ802-F DIC-034 R2 GBJ801-F GBJ8005-F GBJ610-F GBJ608-F GBJ606-F GBJ604-F GBJ602-F GBJ601-F GBJ6005-F GBJ2010-F GBJ2008-F GBJ2006-F GBJ2004-F GBJ2002-F GBJ2001-F Page 3 of 3 Diodes Incorporated www.diodes.com GBJ20005-F Rel Date: 5/29/2013