Not Recommended for New Design
Alternative is BCP53 & BCP5316
DCP53/-16
PNP SURFACE MOUNT TRANSISTOR
Features
•
•
•
•
•
•
Epitaxial Planar Die Construction
Complementary NPN Type Available (DCP56)
Ideally Suited for Automated Assembly Processes
Ideal for Medium Power Switching or Amplification Applications
Lead Free By Design/RoHS Compliant (Note 1)
"Green" Device (Note 2)
3
2
1
4
SOT-223
Mechanical Data
•
•
•
•
•
•
•
COLLECTOR
Maximum Ratings
2,4
3 E
Case: SOT-223
Case Material: Molded Plastic, "Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Finish - Matte Tin annealed over Copper leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Marking & Type Code Information: See Page 3
Ordering Information: See Page 3
Weight: 0.115 grams (approximate)
2 C
C 4
1
BASE
1 B
3
EMITTER
TOP VIEW
Schematic and Pin Configuration
@TA = 25°C unless otherwise specified
Characteristic
Symbol
VCBO
VCEO
VEBO
ICM
IC
Value
-100
-80
-5
-1.5
-1
Units
V
V
V
A
A
Characteristic
Power Dissipation at TA = 25ºC (Note 3)
Symbol
Pd
Value
1
Unit
W
Operating and Storage Temperature Range
Tj, TSTG
-55 to +150
°C
RθJA
125
°C/W
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Peak Pulse Current
Continuous Collector Current
Thermal Characteristics
Thermal Resistance, Junction to Ambient Air @ TA = 25ºC (Note 3)
Electrical Characteristics
@TA = 25°C unless otherwise specified
Characteristic
OFF CHARACTERISTICS (Note 4)
Symbol
Min
Typ
Max
Unit
Test Condition
Collector-Base Breakdown Voltage
V(BR)CBO
-100
—
—
V
IC = -100μA, IE = 0
Collector-Emitter Breakdown Voltage
V(BR)CEO
-80
—
—
V
IC = -10mA, IB = 0
Emitter-Base Breakdown Voltage
V(BR)EBO
-5
—
—
V
IE = -10μA, IC = 0
Collector Cutoff Current
ICBO
—
—
-100
-20
nA
μA
VCB = -30V, IE = 0
VCB = -30V, IE = 0,
TA = 150ºC
Emitter Cutoff Current
IEBO
—
—
-10
μA
VEB = -5V, IC = 0
Collector-Emitter Saturation Voltage
VCE(SAT)
—
—
-0.5
V
IC = -500mA, IB = -50mA
Base-Emitter Turn-On Voltage
VBE (ON)
—
—
-1.0
V
IC = -500mA, VCE = -2V
hFE
40
25
—
250
—
—
IC = -150mA, VCE = -2V
IC = -500mA, VCE = -2V
100
—
250
—
200
—
ON CHARACTERISTICS (Note 4)
DC Current Gain
DCP53-16
IC = -150mA, VCE = -2V
SMALL SIGNAL CHARACTERISTICS
Current Gain-Bandwidth Product
Notes:
1.
2.
3.
4.
fT
MHz
IC = -50mA, VCE = -5V,
f = 100MHz
No purposefully added lead.
Diodes Inc.'s "Green" Policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
Device mounted on FR-4 PCB; pad layout as shown on page 4 or in Diodes Inc. suggested pad layout document AP02001, which can
be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
Measured under pulsed conditions. Pulse width = 300μs. Duty cycle ≤ 2%.
DCP53/-16
Document number: DS30797 Rev. 5 - 3
1 of 4
www.diodes.com
June 2011
© Diodes Incorporated
Not Recommended for New Design
Alternative is BCP53 & BCP5316
1.2
PD, POWER DISSIPATION (W)
1.0
0.8
0.6
0.4
0.2
0
25
50
75
100
125
150
175
TA, AMBIENT TEMPERATURE (°C)
Fig. 1 Power Dissipation vs. Ambient Temperature (Note 3)
0
DCP53/-16
Document number: DS30797 Rev. 5 - 3
2 of 4
www.diodes.com
June 2011
© Diodes Incorporated
Not Recommended for New Design
Alternative is BCP53 & BCP5316
160
140
CAPACITANCE(pF)
120
100
80
60
40
20
0
0
10
20
30
40
VR, REVERSE VOLTAGE (V)
Fig. 7 Typical Capacitance Characteristics
Ordering Information
(Note 5)
Packaging
SOT-223
SOT-223
Device
DCP53-13
DCP53-16-13
Notes:
5.
Shipping
2500/Tape & Reel
2500/Tape & Reel
For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
(Top View)
YWW
XXX
= Manufacturer’s code marking
XXX = Product type marking code Ex: P18 = DCP53
P18-16 = DCP53-16
YWW = Date code marking
Y = Last digit of year ex: 7 = 2007
WW = Week code 01 - 52
Package Outline Dimensions
SOT-223
Dim
Min
Max Typ
A
1.55
1.65 1.60
A1
0.010 0.15 0.05
b1
2.90
3.10 3.00
b2
0.60
0.80 0.70
C
0.20
0.30 0.25
D
6.45
6.55 6.50
E
3.45
3.55 3.50
E1
6.90
7.10 7.00
e
–—
–—
4.60
e1
–—
–—
2.30
L
0.85
1.05 0.95
Q
0.84
0.94 0.89
All Dimensions in mm
DCP53/-16
Document number: DS30797 Rev. 5 - 3
3 of 4
www.diodes.com
June 2011
© Diodes Incorporated
Not Recommended for New Design
Alternative is BCP53 & BCP5316
Suggested Pad Layout: (Based on IPC-SM-782)
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS
DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A
PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other
changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability
arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any
license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described
herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies
whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized
sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall
indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names
and markings noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without
the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided
in the labeling can be reasonably expected to result in significant injury to the user.
B.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected
to cause the failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or
systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements
concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems,
notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further,
Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes
Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2011, Diodes Incorporated
www.diodes.com
DCP53/-16
Document number: DS30797 Rev. 5 - 3
4 of 4
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June 2011
© Diodes Incorporated
