ES2G-13-F

ES2G-13-F

  • 厂商:

    BCDSEMI(美台)

  • 封装:

    SMB(DO-214AA)

  • 描述:

    直流反向耐压(Vr):400V 平均整流电流(Io):2A 正向压降(Vf):1.25V@2A 反向电流(Ir):5uA@400V 反向恢复时间(trr):35ns 工作温度:-55℃~+150℃@(...

  • 详情介绍
  • 数据手册
  • 价格&库存
ES2G-13-F 数据手册
ES2G Green   2.0A SURFACE MOUNT SUPER-FAST RECTIFIER Features Mechanical Data • • • • • • • • Glass Passivated Die Construction Super-Fast Recovery Time For High Efficiency Surge Overload Rating to 50A Peak Ideally Suited for Automated Assembly Lead Free Finish/RoHS Compliant (Note 1) Green Molding Compound (No Halogen and Antimony) (Note 2) • • • • • • Top View Maximum Ratings Case: SMB Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Lead Free Plating (Matte Tin Finish). Solderable per MIL-STD-202, Method 208 Polarity: Cathode Band or Cathode Notch Marking Information: See Page 3 Ordering Information: See Page 3 Weight: 0.093 grams (approximate) Bottom View @TA = 25°C unless otherwise specified Single phase, half wave, 60Hz, resistive or inductive load. For capacitance load, derate current by 20%. Characteristic Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage (Note 6) RMS Reverse Voltage Average Rectified Output Current @ TT = 110°C Non-Repetitive Peak Forward Surge Current8.3ms Single Half Sine-Wave Superimposed on Rated Load Symbol VRRM VRWM VR VR(RMS) IO Value Unit 400 V 280 2.0 V A IFSM 50 A Symbol RθJT TJ, TSTG Value 20 -55 to +150 Unit °C/W °C Value 1.25 5.0 350 35 25 Unit V Thermal Characteristics Characteristic Typical Thermal Resistance, Junction to Terminal (Note 3) Operating and Storage Temperature Range Electrical Characteristics Characteristic Forward Voltage Peak Reverse Current at Rated DC Blocking Voltage (Note 6) Reverse Recovery Time (Note 5) Typical Capacitance (Note 4) Notes: @TA = 25°C unless otherwise specified @ IF = 2.0A @ TA = 25°C @ TA = 125°C Symbol VFM IRM trr CT μA ns pF 1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes. 2. Product manufactured with Data Code 0924 (week 24, 2009) and newer are built with Green Molding Compound. 3. Unit mounted on PC board with 5.0 mm2 (0.013 mm thick) copper pads as heat sink. 4. Measured at 1.0MHz and applied reverse voltage of 4.0V DC. 5. Measured with IF = 0.5A, IR = 1.0A, Irr = 0.25A. See Figure 5. 6. Short duration pulse test used to minimize self-heating effect ES2G Document number: DS30212 Rev. 8 - 2 1 of 4 www.diodes.com September 2010 © Diodes Incorporated ES2G 10 IF, INSTANTANEOUS FORWARD CURRENT (A) IO, AVERAGE FORWARD CURRENT (A) 0.75 2.0 1.6 1.2 0.8 0.4 0 25 50 75 100 125 150 1.0 0.1 0.01 175 0 IFSM, PEAK FORWARD SURGE CURRENT (A) TT, TERMINAL TEMPERATURE (°C) Fig. 1 Forward Current Derating Curve 0.4 0.8 1.2 1.6 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 2 Typical Forward Characteristics 60 1,000 Single Half-Sine-Wave 50 100 40 10 30 20 1.0 10 0.1 0 1 10 100 NUMBER OF CYCLES AT 60Hz Fig. 3 Surge Current Derating Curve 0 400 320 160 240 80 VR, INSTANTANEOUS REVERSE VOLTAGE (V) Fig. 4 Typical Reverse Characteristics Set time base for 50/100 ns/cm ES2G Document number: DS30212 Rev. 8 - 2 2 of 4 www.diodes.com September 2010 © Diodes Incorporated ES2G Ordering Information (Note 7) Part Number ES2G-13-F Notes: Case SMB Packaging 3000/Tape & Reel 7. For packaging details, go to our website at http://www.diodes.com. Marking Information YWW ES2G ES2G = Product type marking code = Manufacturers’ code marking YWW = Date code marking Y = Last digit of year (ex: 2 for 2002) WW = Week code (01 to 53) Package Outline Dimensions B A C D J H G E SMB Dim Min Max A 3.30 3.94 B 4.06 4.57 C 1.96 2.21 D 0.15 0.31 E 5.00 5.59 G 0.05 0.20 H 0.76 1.52 J 2.00 2.50 All Dimensions in mm Suggested Pad Layout SMB Value (in mm) Dimensions Z 6.7 G 1.8 X 2.3 2.5 Y 4.3 C ES2G Document number: DS30212 Rev. 8 - 2 3 of 4 www.diodes.com September 2010 © Diodes Incorporated ES2G IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2010, Diodes Incorporated www.diodes.com ES2G Document number: DS30212 Rev. 8 - 2 4 of 4 www.diodes.com September 2010 © Diodes Incorporated
ES2G-13-F
物料型号:ES2G

器件简介: - ES2G是一款2.0A的表面贴装超快整流器,采用玻璃钝化芯片结构,具有超快恢复时间,适合高效率的浪涌过载,最高可达50A的峰值,非常适合自动化组装。

引脚分配: - 极性:带有阴极带或阴极缺口的标记。

参数特性: - 最大额定值:包括峰值重复反向电压、工作峰值反向电压、直流阻断电压、有效值反向电压等。 - 热特性:包括结到端子的热阻。 - 电气特性:在25°C环境温度下,包括正向电压、峰值反向电流、反向恢复时间、典型电容等。

功能详解: - 提供了正向特性和反向特性的图表,展示了在不同条件下的电压和电流表现。

应用信息: - 适用于单相、半波、60Hz、电阻性或感性负载。对于电容性负载,电流需要降低20%。

封装信息: - 封装类型:SMB,材料为模塑塑料,符合UL阻燃分类94V-0。