PAM8610TR

A Product Line of Diodes Incorporated PAM8610 10W STEREO CLASS-D AUDIO POWER AMPLIFIER WITH DC VOLUME CONTROL Description Pin Assignments The PAM8610 is a 10W (per channel) stereo Class-D audio amplifier with DC Volume Control which offers low THD+N (0.1%), low EMI, and good PSRR thus high-quality sound reproduction. The 32 steps DC volume control has a +32dB to -75dB range. The PAM8610 runs off of a 7V to 15V supply at much higher efficiency than competitors’ ICs. The PAM8610 only requires very few external components, significantly saving cost and board space. The PAM8610 is available in a 40pin QFN 6mm*6mm package. Features  10W @ 10%THD/Channel Output into a 8Ω Load at 13V  Low Noise: -90dB  Over 90% Efficiency  32 Step DC Volume Control from -75dB to +32dB  With Shutdown/Mute/Fade Function Applications  Over Current , Thermal and Short-Circuit Protection  Low THD+N  Flat Monitor /LCD TVS  Low Quiescent Current  Multi-Media Speaker System  Pop Noise Suppression  Small Package Outlines: Thin 40-pin QFN 6mm*6mm Package  Pb-Free Package (RoHS Complaint)  DVD Players, Game Machines  Boom Box  Music Instruments Typical Applications Circuit PAM8610 Document number: DSxxxxx Rev. 1 - 2 1 of 15 www.diodes.com June 2013 © Diodes Incorporated A Product Line of Diodes Incorporated PAM8610 Pin Descriptions Pin Number 1 2 3 4 5 Pin Name RINN RINP AVDD VREF VOLUME 6 REF GND 7 AGND1 8 FADE 9 10 11, 20 12, 19 13, 14 15 16 17, 18 21 LINP LINN PGNDL PVCCL LOUTN BSLN BSLP LO UTP VCLAMPL 22 CO SC 23 24, 28 25 26 RO SC AGND MUTE AVCC 27 V2P5 29 SD 30 31, 40 32, 39 33, 34 35 36 37, 38 VCLAMPR PGNDR PVCCR ROUTP BSRP BSRN ROUTN PAM8610 Document number: DSxxxxx Rev. 1 - 2 Function Negative differential audio input for right channel. Positive differential audio input for right channel. 5V Analog VDD Analog reference for gain control section. DC voltage that sets the gain of the amplifier. Ground for gain control circuitry. Connect to AGND. If using a DAC to control the volume, connect the DAC ground to this terminal. Analog GND Input for controlling volume ramp rate when cycling SD or during power-up. A logic low on this pin places the amplifier in fade mode. A logic high on this pin allows a quick transition to the desired volume setting. Positive differential audio input for left channel. Negative differential audio input for left channel. Power ground for left channel H-bridge. Power supply for left channel H-bridge, not connected to PVCCR or AVCC. Class-D 1/2-H-bridge negative output for left channel. Bootstrap I/O for left channel, negative high-side FET. Bootstrap I/O for left channel, positive high-side FET. Class-D 1/2-H-bridge positive output for left channel. Internally generated voltage supply for left channel bootstrap capacitors. I/O for charge/discharging currents onto capacitor for ramp generator triangle wave biased at V2P5. Current setting resistor for ramp generator. Nominally equal to 1/8*VCC. Analog GND A logic high on this pin disables the outputs and a logic low enables the outputs. High-voltage analog power supply (7V to 15V) 2.5V Reference for analog cells, as well as reference for unused audio input when using single-ended inputs. Shutdown signal for IC (low = shutdown, high = operational). TTL logic levels with compliance to VCC. Internally generated voltage supply for right channel bootstrap capacitors. Power ground for right channel H-bridge. Power supply for right channel H-bridge, not connected to PVCCL or AVCC. Class-D 1/2-H-bridge positive output for right channel. Bootstrap I/O for right channel, positive high-side FET. Bootstrap I/O for right channel, negative high-side FET. Class-D 1/2-H-bridge negative output for right channel. 2 of 15 www.diodes.com June 2013 © Diodes Incorporated A Product Line of Diodes Incorporated PAM8610 Functional Block Diagram Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) These are stress ratings only and functional operation is not implied. Exposure to absolute maximum ratings for prolonged time periods may affect device reliability. All voltages are with respect to ground. Parameter Supply Voltage VDD Rating Unit -0.3 to +16.5 V Input Voltage RangeVI: MUTE, VREF, VOLUME, FADE 0 to +6.0 SD RINN, RINP, LINN, LINP -0.3 to VDD -0.3 to +6.0 Junction Temperature Range, TJ Storage Temperature Lead Temperature 1, 6mm (1/16 inch) -40 to +125 PAM8610 Document number: DSxxxxx Rev. 1 - 2 -65 to +150 260, 5 sec V °C 3 of 15 www.diodes.com June 2013 © Diodes Incorporated A Product Line of Diodes Incorporated PAM8610 Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.) Parameter Supply Voltage (VDD) Maximum Volume Control Pins, Input Pins Voltage High Level Input Voltage: SD MUTE, FADE Low Level Input Voltage: SD MUTE, FADE Ambient Operating Temperature Rating Unit 7 to 15 V 0 to +5.0 2.0 to VDD 2.0 to 5.0 V 0 to +0.3 0 to +0.3 -20 to +85 V °C Thermal Information Parameter Package Symbol Max Thermal Resistance (Junction to Ambient) QFN6mm*6mm θJA 18.1 Thermal Resistance (Junction to Case) QFN6mm*6mm θJC 7.6 Unit °C/W The Exposed PAD must be soldered to a thermal land on the PCB. Electrical Characteristics (@TA = +25°C, VDD = 12V, RL = 8Ω, unless otherwise specified.) Parameter Supply Voltage Continuous Output Power Total Harmonic Distortion plus Noise Symbol Test Conditions VDD PO THD+N Min Typ Max Units 7.0 12 15 V THD+N = 0.1%, f = 1kHz, RL = 8Ω 5 THD+N = 1.0%, f = 1kHz, RL = 8Ω 8 THD+N = 10%, f = 1kHz, RL = 8Ω, VDD = 13V 10 THD+N = 0.1%, f = 1kHz, RL = 4Ω (Note 3) 15 PO = 5W, f = 1kHz, RL = 8Ω 0.1 W % Quiescent Current IDD No Load 20 30 mA Supply Quiescent Current in Shutdown Mode ISD Shutdown = 0V 4 10 µA Drain-Source On-State Resistance RDS(ON) VCC = 12V IO = 1A TJ = +25°C High Side Low Side Total 200 200 400 mΩ -60 dB PSRR 1VPP Ripple, f = 1kHz, Inputs AC-Coupled to Ground fOSC VN ROSC = 120kΩ, COSC = 220pF 20Hz to 22kHz, A-Weighting 250 kHz Output Integrated Noise Floor -90 dB Crosstalk CS PO = 3W, RL = 8Ω, f = 1kHz Maximum output at THD+N < 0.5%, f = 1kHz -80 dB 80 dB INN and INP connected together 30 mV V2P5 No Load 2.5 AVDD OTS OTH VDD = 7V to 15V 5.0 Power Supply Ripple Rejection Oscillator Frequency Signal to Noise Ratio Output Offset Voltage (measured differentially) 2.5V Bias Voltage Internal Analog Supply Voltage Over Temperature Shutdown Thermal Hysteresis Note: SNR |VOS| 150 40 V 5.5 V °C °C 3. Heat sink is required for high power output. PAM8610 Document number: DSxxxxx Rev. 1 - 2 4 of 15 www.diodes.com June 2013 © Diodes Incorporated A Product Line of Diodes Incorporated PAM8610 Typical Performance Characteristics (@TA = +25°C, VDD = 12V, RL = 8Ω, GV = 24dB, unless otherwise specified.) PAM8610 Document number: DSxxxxx Rev. 1 - 2 5 of 15 www.diodes.com June 2013 © Diodes Incorporated A Product Line of Diodes Incorporated PAM8610 Typical Performance Characteristics (cont.) (@TA = +25°C, VDD = 12V, RL = 4Ω, GV = 24dB, unless otherwise specified.) PAM8610 Document number: DSxxxxx Rev. 1 - 2 6 of 15 www.diodes.com June 2013 © Diodes Incorporated A Product Line of Diodes Incorporated PAM8610 Typical Performance Characteristics (cont.) (@TA = +25°C, VDD = 12V, RL = 8Ω, GV = 24dB, unless otherwise specified.) PAM8610 Document number: DSxxxxx Rev. 1 - 2 7 of 15 www.diodes.com June 2013 © Diodes Incorporated A Product Line of Diodes Incorporated PAM8610 Typical Performance Characteristics (cont.) (@TA = +25°C, VDD = 12V, RL = 8Ω, GV = 24dB, unless otherwise specified.) Notes: PCB information for power dissipation measurement. 1. The PCB size is 74mm 68mm with 1.2mm thickness, two layers and Fr4. 2. 16 vias at the thermal land on the PCB with 0.5mm diameter. 3. The size of exposed copper is 10mm*10mm with 3oz thickness. PAM8610 Document number: DSxxxxx Rev. 1 - 2 8 of 15 www.diodes.com June 2013 © Diodes Incorporated A Product Line of Diodes Incorporated PAM8610 Application Information Test Setup for Performance Testing Notes: 4. The AP AUX-0025 low pass filter is necessary for class-D amplifier measurement with AP analyzer. 5. Two 22μH inductors are used in series with load resistor to emulate the small speaker for efficiency measurement. Power and Heat Dissipation Choose speakers that are able to stand large output power from the PAM8610. Otherwise, speaker may suffer damage. Heat dissipation is very important when the device works in full power operation. Two factors affect the heat dissipation, the efficiency of the device that determines the dissipation power, and the thermal resistance of the package that determines the heat dissipation capability. In operation, some of power is dissipated to the resistors. Power Dissipation: PLOSS = (PO*(1-η/η)*2 The PAM8610’s efficiency is 90% with 10W ouput and 8Ω load. The dissipation power is 2.22W. Thermal resistance of junction to ambient of the QFN package is 18.1°C/W and the junction temperature TJ = PLOSS * θJA+TA, where TA is ambient temperature. If the ambient temperature is +85°C, the QFN’s junction temperature TJ = 2.22*18.1 + 85 = +125°C which is lower than +150°C rated junction temperature. If the rated workable junction temperature is 150°C, the relat ionship between ambient temperature and permitted PLOSS is shown in below diagram. From the diagram, it can be found that when the device works at 10W/8Ω load the dissipation power is 1.1W per channel, 2.2W total, the permitted ambient temperature is over 100°C. This is proven by actual test. The PAM8610 can work in full output power under +85°C ambient temperature. PAM8610 Document number: DSxxxxx Rev. 1 - 2 9 of 15 www.diodes.com June 2013 © Diodes Incorporated A Product Line of Diodes Incorporated PAM8610 Application Information (cont.) Heat Dissipation in PCB Design Generally, class-D amplifiers are high efficiency and need no heat sink. For high power ones that has high dissipation power, the heat sink may also not necessary if the PCB is carefully designed to achieve good heat by the PCB itself. Dual-Side PCB To achieve good heat, the PCB’s copper plate should be thicker than 0.035mm and both sides of the PCB should be utilized for heat sink. The thermal pad on the bottom of the device should be soldered to the plate of the PCB, and via holes, usually 9 to 16, should be drilled in the PCB area under the device and deposited copper on the vias should be thick enough so that the heat can be dissipated to the other side of the plate. There should be no insulation mask on the other side of the copper plate. It is better to drill more vias around the device if possible. 4-Layer PCB If it is 4-layer PCB, the two middle layers of grounding and power can be employed for heat dissipation, isolating them into serval islands to avoid short between ground and power. Consideration for EMI Filters are not required if the traces from the amplifier to the speakers are short (