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PI3B3253QE

PI3B3253QE

  • 厂商:

    BCDSEMI(美台)

  • 封装:

    SSOP16

  • 描述:

    IC MUX/DEMUX 2 X 4:1 16QSOP

  • 数据手册
  • 价格&库存
PI3B3253QE 数据手册
A product Line of Diodes Incorporated PI3B3253 3.3V, Dual 4:1 Mux/DeMux NanoSwitch™ Features Description • Near-Zero propagation delay The PI3B3253 is a 3.3V, Dual4:1 Multi-plexer/ Demultiplexer with Hi-Z outputs that is pinout compatible with the PI74FCT253T, 74F253, and 74ALS/AS/LS 253. Inputs can be connected to outputs with low On-Resistance (5Ω) with no additional ground bounce noise or propagation delay. • 5Ω switches connect inputs to outputs • Fast Switching Speed: 5.2ns max. • Ultra Low Quiescent Power (0.2µA typical) – Ideally suited for notebook applications • Pin compatible with 74 series 253 logic devices Pin Configuration (QSOP, TSSOP) • Packaging (Pb-free & Green available): – 16-pin, QSOP (Q) – 16-pin, TSSOP (L) – 16-pin, UQFN (ZHD) EA 1 16 VCC S1 2 15 EB IA3 3 14 S0 IA2 4 13 IB3 IA1 5 12 IB2 IA0 6 11 IB1 YA 7 10 IB0 GND 8 9 YB Block Diagram IB1 IB2 IB3 SW SW EB Pin Configuration (UQFN) SW SW SW S0 Y I SW SW S1 SW SW YA YB Function X Hi-Z X Disable A X X X Hi-Z Disable B L L L IA 0 IB0 S1-0 = 0 L L L H IA 1 IB1 S1-0 = 1 L L H L IA 2 IB2 S1-0 = 2 L L H H IA 3 IB3 S1-0 = 3 EB S1 S0 H X X X H L EA 1 12 IB2 S1 2 11 I B1 IA3 3 10 IB0 IA2 4 9 YB 5 6 7 8 Pin Description Pin Name IAN, IBN S0-1 EA, EB YA, YB GND VCC Note: 1. H = High Voltage Level, L = Low Voltage Level Document Number DS40212 Rev 1-2 13 GND Select EA PI3B3253 14 YB Truth Table(1) Enable 15 YA YA 16 E IA0 EA IB3 IB0 S0 IA3 EB IA2 VCC IA1 I A1 IA0 1 Description Data Inputs Select Inputs Enable Data Outputs Ground Power www.diodes.com September 2017 Diodes Incorporated A product Line of Diodes Incorporated PI3B3253 Maximum Ratings (Above which the useful life may be impaired. For user guidelines, not tested.) Storage Temperature...................................................................... –65°C to +150°C Ambient Temperature with Power Applied..................................... –40°C to +85°C Supply Voltage to Ground Potential .................................................–0.5V to +4.6V DC Input Voltage..............................................................................–0.5V to +4.6V DC Output Current......................................................................................... 120mA Power Dissipation............................................................................................. 0.5W Note: Stresses greater than those listed under MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. DC Electrical Characteristics (Over the Operating Range, TA = –40°C to +85°C, VCC =3.3V ±10%) Description Test Conditions(1) VIH Input HIGH Voltage Guaranteed Logic HIGH Level 2.0 VIL Input LOW Voltage Guaranteed Logic LOW Level –0.5 IIH Input HIGH Current VCC = Max., VIN = VCC ±1 IIL Input LOW Current VCC = Max., VIN = GND ±1 IOZH High Impedance Output Current 0 ≤ IN, YN ≤ VCC ±1 VIK Clamp Diode Voltage VCC = Min., IIN = –18mA Parameters RON Switch On-Resistance(3) Min. Typ.(2) Max. Units V 0.8 µA –1.2 VCC = Min., VIN = 0.0V, ION = 48mA or 64mA 5 V 8 Ω 10 17 VCC = Min., VIN = 2.4V, ION = 15mA Notes: 1. For Max. or Min. conditions, use appropriate value specified under Electrical Characteristics for the applicable device type. 2. Typical values are at VCC = 3.3V, TA = 25°C ambient and maximum loading. 3. Measured by the voltage drop between I and Y pin at indicated current through the switch. On-Resistance is determined by the lower of the voltages on the two (I,Y) pins. Capacitance (TA = 25°C, f = 1 MHz) Parameters(1) Description CIN Input Capacitance COFF IA/IB Capacitance, Switch Off Test Conditions Document Number DS40212 Rev 1-2 Units 3.0 VIN = 0V 8.0 IA/IB Capacitance, Switch On CON Notes: 1. This parameter is determined by device characterization but is not production tested. PI3B3253 Typ. 2 pF 36.0 www.diodes.com September 2017 Diodes Incorporated A product Line of Diodes Incorporated PI3B3253 Power Supply Characteristics Parameters Description Test Conditions(1) ICC Quiescent Power Supply Current VCC = Max. ΔICC Supply Current per Input @ TTL HIGH VCC = Max. Min. VIN = GND or VCC VIN = Typ.(2) Max. 0.1 3.0 Units µA 3.0V(3) 750 Notes: 1. For Max. or Min. conditions, use appropriate value specified under Electrical Characteristics for the applicable device. 2. Typical values are at VCC = 3.3V, +25°C ambient. 3. Per TTL driven input (control inputs only); I and Y pins do not contribute to ICC. Switching Characteristics over Operating Range Parameters Description tIY Propagation Delay(1,2) In to Yn tSY Bus Select Time, Sn to Yn tPZH Bus Enable Time, E to Yn tPHZ tPLZ Bus Disable Time, En to Y Test Conditions Com. Min. Max. Units 0.25 CL = 50pF RL = 500Ω 1 4.0 1 3.8 1 5.2 ns Notes: 1. This parameter is guaranteed but not tested on Propagation Delays. 2. The bus switch contributes no propagational delay other than the RC delay of the On-Resistance of the switch and the load capacitance. The time constant for the switch alone is of the order of 0.25ns for 50pF load. Since this time constant is much smaller than the rise/fall times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch when used in a system is determined by the driving circuit on the driving side of the switch and its interaction with the load on the driven side. Applications Information Logic Inputs The logic control inputs can be driven up to +3.6V regardless of the supply voltage. For example, given a +3.3V supply, IN may be driven low to 0V and high to 3.6V. Driving IN Rail-to-Rail® minimizes power consumption. Power-Supply Sequencing and Hot Plug Information Proper power-supply sequencing is recommended for all CMOS devices. Always apply VCC and GND before applying signals to input/output or control pins. Rail-to-Rail is a registered trademark of Nippon Motorola, Ltd. PI3B3253 Document Number DS40212 Rev 1-2 3 www.diodes.com September 2017 Diodes Incorporated A product Line of Diodes Incorporated PI3B3253 Packaging Mechanical: 16-Pin QSOP (Q) 16-0056 PI3B3253 Document Number DS40212 Rev 1-2 4 www.diodes.com September 2017 Diodes Incorporated A product Line of Diodes Incorporated PI3B3253 Packaging Mechanical: 16-Pin TSSOP (L) 16-0061 PI3B3253 Document Number DS40212 Rev 1-2 5 www.diodes.com September 2017 Diodes Incorporated A product Line of Diodes Incorporated PI3B3253 Packaging Mechanical: 16-Pin UQFN (ZHD) D e N16 0.70x16 L N13 N1 1.60 1.60 E1 E b D1 N9 2.90 N12 16X0.27 PIN1 Index Area N8 Top View 0.50BSC N4 N5 2.90 Bottom View RECOMMENDED LAND PATTERN(unit:mm) PKG. DIMENSIONS(MM) SYMBOL A3 A1 A Max 0.50 0.65 A1 0.00 0.05 A3 Side View Min A 0.15 REF D 2.90 3.10 E 2.90 3.10 D1 1.60 1.90 E1 1.60 1.90 b 0.18 0.30 e L 0.50 BSC 0.25 0.55 Note: 1. Comply with MO-248E ,except 'L' MIN and 'L' 'D1' 'E1' MAX DATE: 07/27/16 DESCRIPTION: 16-Pin, UQFN, 3X3 PACKAGE CODE: ZHD(ZHD16) DOCUMENT CONTROL#: PD-2209 REVISION: -- 16-0092 For latest package info. please check: http://www.diodes.com/design/support/packaging/pericom-packaging/packaging-mechanicals-and-thermal-characteristics/ Ordering Information Ordering Code Package Code Package Desciption PI3B3253QEX Q 16-pin, 150mil Wide (QSOP) PI3B3253LEX L 16-pin, 173mil Wide (TSSOP) PI3B3253ZHDEX ZHD 16-pin, 3x3 (UQFN) Notes: • Thermal characteristics can be found on the company web site at www.diodes.com/design/support/packaging/ • E = Pb-free and Green • X suffix = Tape/Reel PI3B3253 Document Number DS40212 Rev 1-2 6 www.diodes.com September 2017 Diodes Incorporated A product Line of Diodes Incorporated PI3B3253 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2016, Diodes Incorporated www.diodes.com PI3B3253 Document Number DS40212 Rev 1-2 7 www.diodes.com September 2017 Diodes Incorporated
PI3B3253QE 价格&库存

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