PI3B3257LEX

A product Line of Diodes Incorporated PI3B3257 3.3V, Quad 2:1 Mux/DeMux NanoSwitch™ Features Description ¼¼Near-Zero propagation delay The PI3B3257 is a 3.3 Volt, Quad 2:1 multiplexer/demultiplexer with three-state outputs that is pinout and function compatible with the PI74FCT257T, 74F257, and 74ALS/AS/LS257. Inputs can be connected to outputs with low On-Resistance (5Ω) with no additional ground bounce noise or propagation delay. ¼¼5Ω switches connect inputs to outputs ¼¼Fast Switching Speed: 4.8ns max. ¼¼Ultra-Low Quiescent Power: 0.1µA typical – Ideally suited for notebook applications IA1 IB0 IB1 IC0 IC1 ID0 ID1 E ID0 ID1 14 13 S 1 12 YD IA0 2 11 IC0 I A1 3 10 IC1 YA 4 9 YC 5 IB0 SW SW SW SW SW SW SW YA YB 8 Truth Table(1) SW S 7 Transparent top view SW E 6 GND IA0 15 YB Block Diagram 16 I B1 ¼¼Packaging (Pb-free & Green avaliable): – 16-pin, QSOP (Q) – 16-pin, SOIC (W) – 16-pin, TSSOP (L) – 16-pin, UQFN (ZHD) VCC Pin Configuration (UQFN) ¼¼Pin compatible with 74 series 257 logic devices YC S YA YB YC YD Function H X Hi-Z Hi-Z Hi-Z Hi-Z Disable L L IA 0 IB0 IC0 I D0 S=0 L H IA 1 IB1 IC1 I D1 S=1 Note: 1. H = High Voltage Level L = Low Voltage Level YD I E Y Pin Description E Pin Configuration (QSOP, SOIC, TSSOP) PI3B3257 Pin Name Description I A N - ID N Data Inputs S Select Inputs E Enable S 1 16 VCC IA0 2 15 E IA1 3 14 ID0 GND Ground (1) YA 4 13 ID1 VCC Power IB0 5 12 YD NC No Connect IB1 6 11 IC0 YB 7 10 IC1 GND 8 9 YC Document Number DS40430 Rev 2-2 YA-YD Data Outputs Note 1: UQFN16 package die supply ground is connected to both GND pin and exposed center pad. GND pin must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad on the board and for proper heat conduction through the board, thermal vias need to be incorporated in the PCB in the thermal pad region. 1 www.diodes.com April 2018 Diodes Incorporated A product Line of Diodes Incorporated PI3B3257 Maximum Ratings (Above which the useful life may be impaired. For user guidelines, not tested.) Storage Temperature...................................................................... –65°C to +150°C Ambient Temperature with Power Applied..................................... –40°C to +85°C Supply Voltage to Ground Potential..................................................–0.5V to +4.6V DC Input Voltage..............................................................................–0.5V to +4.6V DC Output Current......................................................................................... 120mA Note: Stresses greater than those listed under MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not mplied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Power Dissipation............................................................................................. 0.5W DC Electrical Characteristics (Over the Operating Range, TA = –40°C to +85°C, VCC = 3.3V ±10%) Test Conditions(1) Parameters Description Min. Typ.(2) Max. VIH Input HIGH Voltage Guaranteed Logic HIGH Level 2 VIL Input LOW Voltage Guaranteed Logic LOW Level –0.5 IIH Input HIGH Current VCC = Max., VIN = VCC ±1 IIL Input LOW Current VCC = Max., VIN = GND ±1 IOZH High Impedance Output Current 0 ≤ In, Yn ≤ VCC ±1 VIK Clamp Diode Voltage VCC = Min., IIN = –18mA RON Switch On-Resistance(3) VCC = Min., VIN = 0.0V, Ion = 48mA or 64mA 5 8 VCC = Min., VIN = 2.4V, ION = 15mA 8 17 Units V 0.8 µA –1.2 V Ω Notes: 1. For Max. or Min. conditions, use appropriate value specified under Electrical Characteristics for the applicable device type. 2. Typical values are at VCC = 3.3V, TA = 25°C ambient and maximum loading. 3. Measured by the voltage drop between I and Y pin at indicated current through the switch. On-Resistance is determined by the lower of the voltages on the two (I,Y) pins. Capacitance (TA = 25°C, f = 1 MHz) Parameters(1) Description CIN Input Capacitance COFFYN COFFIN CON YN Capacitance, Switch OFF IN Capacitance, Switch OFF IN/YN Capacitance, Switch ON Test Conditions Typ. 3.0 17.0 8.5 25 VIN = 0V Units pF Notes: 1. This parameter is determined by device characterization but is not production tested. Power Supply Characteristics Test Conditions(1) Parameters Description ICC Quiescent Power Supply Current VCC = Max. VIN = GND or VCC ∆ICC Supply Current per Input @ TTL HIGH(3, 4) VCC = Max. VIN = 3.0 Min. Typ.(2) Max. 0.1 3.0 750 Units µA Notes: 1. For Max. or Min. conditions, use appropriate value specified under Electrical Characteristics for the applicable device. 2. Typical values are at VCC = 3.3V, +25°C ambient. 3. Per TTL driven input (control inputs only); I and Y pins do not contribute to ICC. 4. This current applies to the control inputs only and represent the current required to switch internal capacitance at the specified frequency. The I and Y inputs generate no significant AC or DC currents as they transition. This parameter is not tested, but is guaranteed by design. PI3B3257 Document Number DS40430 Rev 2-2 2 www.diodes.com April 2018 Diodes Incorporated A product Line of Diodes Incorporated PI3B3257 Switching Characteristics Over Operating Range PI3B3257 Parameters Description Conditions Com. Min. to Yn(1,2) tIY Propagation Delay In tSY Bus Select Time, Sn to Yn tPZH tPZL Bus Enable Time, E to Yn tPHZ tPLZ Bus Disable Time, E to Yn Units Max. 0.25 CL = 50pF RL = 500Ω 1 4.5 1 4.5 1 4.8 ns Notes: 1. This parameter is guaranteed but not tested on Propagation Delays. 2. The bus switch contributes no propagational delay other than the RC delay of the On-Resistance of the switch and the load capacitance. The switch’s time constant alone is of the order of 0.25ns for 50pF load. Since this time constant is much smaller than the rise/fall times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch when used in a system is determined by the driving circuit on the driving side of the switch and its interaction with the load on the driven side. Applications Information Logic Inputs The logic control inputs can be driven up to +3.6V regardless of the supply voltage. For example, given a + 3.3V supply, IN may be driven low to 0V and high to 3.6V. Driving IN Rail-to-Rail® minimizes power consumption. Power-Supply Sequencing and Hot-Plug Information Proper power-supply sequencing is recommended for all CMOS devices. Always apply VCC and GND before applying signals to input/ output or control pins. Rail-to-Rail is a registeredtrademark of Nippon Motorola, Ltd. Part Marking Q Package W Package L Package PI3B 3257QE YWXX Y: Year W: Workweek 1st X: Assembly Site Code 2nd X: Fab Site Code PI3B 3257WE YYWWXX YY: Date Code (Year) WW: Date Code (Workweek) 1st X: Assembly Site Code 2nd X: Fab Site Code PI3B 3257LE YYWWXX YY: Year WW: Workweek 1st X: Assembly Site Code 2nd X: Fab Site Code ZHD Package wDZHDE YWXX Y: Year W: Workweek 1st X: Assembly Site Code 2nd X: Fab Site Code PI3B3257 Document Number DS40430 Rev 2-2 3 www.diodes.com April 2018 Diodes Incorporated A product Line of Diodes Incorporated PI3B3257 Packaging Mechanical: 16-QSOP (Q) 16-0056 PI3B3257 Document Number DS40430 Rev 2-2 4 www.diodes.com April 2018 Diodes Incorporated A product Line of Diodes Incorporated PI3B3257 Packaging Mechanical: 16-SOIC (W) 16-0145 PI3B3257 Document Number DS40430 Rev 2-2 5 www.diodes.com April 2018 Diodes Incorporated A product Line of Diodes Incorporated PI3B3257 Packaging Mechanical: 16-TSSOP (L) 16-0061 PI3B3257 Document Number DS40430 Rev 2-2 6 www.diodes.com April 2018 Diodes Incorporated A product Line of Diodes Incorporated PI3B3257 Packaging Mechanical: 16-UQFN (ZHD) D e N16 0.70x16 L N13 N1 1.60 1.60 E1 E b D1 N9 0.50BSC N4 N8 Top View 2.90 N12 16X0.27 PIN1 Index Area N5 2.90 Bottom View RECOMMENDED LAND PATTERN(unit:mm) PKG. DIMENSIONS(MM) SYMBOL A3 A1 A Max 0.50 0.65 A1 0.00 0.05 A3 Side View Min A 0.15 REF D 2.90 3.10 E 2.90 3.10 D1 1.60 1.90 E1 1.60 1.90 b 0.18 0.30 e L 0.50 BSC 0.25 0.55 Note: 1. Comply with MO-248E ,except 'L' MIN and 'L' 'D1' 'E1' MAX DATE: 07/27/16 DESCRIPTION: 16-Pin, UQFN, 3X3 PACKAGE CODE: ZHD(ZHD16) DOCUMENT CONTROL#: PD-2209 REVISION: -- 16-0092 For latest package info. please check: http://www.diodes.com/design/support/packaging/pericom-packaging/packaging-mechanicals-and-thermal-characteristics/ Ordering Information Ordering Code Packaging Code Package Description PI3B3257QEX Q 16-pin, 150 mil wide (QSOP) PI3B3257WEX W 16-pin, 150-mil wide (SOIC) PI3B3257LEX L 16-pin, 173 mil wide (TSSOP) PI3B3257ZHDEX ZHD 16-pin, 3x3 (UQFN) Notes: 1. EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. All applicable RoHS exemptions applied. 2. See http://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, “Green” and Lead-free. Thermal characteristics can be found on the company web site at www.diodes.com/design/support/packaging/ 3. E = Pb-free and Green 4. X suffix = Tape/Reel PI3B3257 Document Number DS40430 Rev 2-2 7 www.diodes.com April 2018 Diodes Incorporated A product Line of Diodes Incorporated PI3B3257 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. 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