CD54HC147, CD74HC147,
CD74HCT147
Data sheet acquired from Harris Semiconductor
SCHS149F
High-Speed CMOS Logic
10- to 4-Line Priority Encoder
September 1997 - Revised November 2003
[ /Title
(CD74
HC147
,
CD74
HCT14
7)
/Subject
(High
Speed
CMOS
Logic
10-to-4
Line
Priority
Encode
r)
/Autho
r ()
/Keywords
(High
Speed
CMOS
Logic
10-to-4
Line
Priority
Encode
r, High
Speed
CMOS
Logic
10-to-4
Line
Priority
Features
• Typical Propagation Delay: 13ns at VCC = 5V,
CL = 15pF, TA = 25oC
provide binary representation on the four active LOW inputs
(Y0 to Y3). A priority is assigned to each input so that when
two or more inputs are simultaneously active, the input with
the highest priority is represented on the output, with input
line l9 having the highest priority.
• Fanout (Over Temperature Range)
- Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
These devices provide the 10-line to 4-line priority encoding
function by use of the implied decimal “zero”. The “zero” is
encoded when all nine data inputs are HIGH, forcing all four
outputs HIGH.
• Buffered Inputs and Outputs
• Wide Operating Temperature Range . . . -55oC to 125oC
Ordering Information
• Balanced Propagation Delay and Transition Times
• Significant Power Reduction Compared to LSTTL
Logic ICs
PART NUMBER
TEMP. RANGE
(oC)
PACKAGE
• HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30% of VCC
at VCC = 5V
CD54HC147F3A
-55 to 125
16 Ld CERDIP
CD74HC147E
-55 to 125
16 Ld PDIP
CD74HC147M
-55 to 125
16 Ld SOIC
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
VIL= 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH
CD74HC147MT
-55 to 125
16 Ld SOIC
CD74HC147M96
-55 to 125
16 Ld SOIC
CD74HC147NSR
-55 to 125
16 Ld SOP
CD74HC147PW
-55 to 125
16 Ld TSSOP
Description
CD74HC147PWR
-55 to 125
16 Ld TSSOP
CD74HC147PWT
-55 to 125
16 Ld TSSOP
CD74HCT147E
-55 to 125
16 Ld PDIP
The ’HC147 and CD74HCT147 are high speed silicon-gate
CMOS devices and are pin-compatible with low power
Schottky TTL (LSTTL).
NOTE: When ordering, use the entire part number. The suffixes
96 and R denote tape and reel. The suffix T denotes a
small-quantity reel of 250.
The ’HC147 and CD74HCT147 9-input priority encoders
accept data from nine active LOW inputs (l1 to l9) and
Pinout
CD54HC147 (CERDIP)
CD74HC147 (PDIP, SOIC, SOP, TSSOP)
CD74HCT147 (PDIP, TSSOP)
TOP VIEW
I4 1
16 VCC
I5 2
15 NC
I6 3
14 Y3
I7 4
13 I3
I8 5
12 I2
Y2 6
11 I1
Y1 7
10 I9
9 Y0
GND 8
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
© 2003, Texas Instruments Incorporated
1
CD54HC147, CD74HC147, CD74HCT147
Functional Diagram
I1
11
9
12
Y0
I2
13
I3
7
1
Y1
I4
2
I5
6
3
I6
Y2
4
I7
14
5
I8
Y3
10
I9
GND = 8
VCC = 16
TRUTH TABLE
INPUTS
OUTPUTS
I1
I2
I3
I4
I5
I6
I7
I8
I9
Y3
Y2
Y1
Y0
H
H
H
H
H
H
H
H
H
H
H
H
H
X
X
X
X
X
X
X
X
L
L
H
H
L
X
X
X
X
X
X
X
L
H
L
H
H
H
X
X
X
X
X
X
L
H
H
H
L
L
L
X
X
X
X
X
L
H
H
H
H
L
L
H
X
X
X
X
L
H
H
H
H
H
L
H
L
X
X
X
L
H
H
H
H
H
H
L
H
H
X
X
L
H
H
H
H
H
H
H
H
L
L
X
L
H
H
H
H
H
H
H
H
H
L
H
L
H
H
H
H
H
H
H
H
H
H
H
L
H = High Logic Level, L = Low Logic Level, X = Don’t Care
2
CD54HC147, CD74HC147, CD74HCT147
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Source or Sink Current per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC or IGND . . . . . . . . . . . . . . . . . .±50mA
Package Thermal Impedance, θJA (see Note 1):
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67oC/W
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73oC/W
NS (SOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64oC/W
PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . 108oC/W
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
Operating Conditions
Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
TEST
CONDITIONS
PARAMETER
25oC
-40oC TO 85oC -55oC TO 125oC
SYMBOL
VI (V)
IO (mA)
VCC
(V)
VIH
-
-
2
1.5
-
-
1.5
4.5
3.15
-
-
3.15
-
3.15
-
V
6
4.2
-
-
4.2
-
4.2
-
V
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
-
1.5
-
V
HC TYPES
High Level Input
Voltage
Low Level Input
Voltage
High Level Output
Voltage
CMOS Loads
VIL
VOH
-
VIH or VIL
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
VOL
VIH or VIL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
Quiescent Device
Current
-
2
-
-
0.5
-
0.5
-
0.5
V
4.5
-
-
1.35
-
1.35
-
1.35
V
6
-
-
1.8
-
1.8
-
1.8
V
-0.02
2
1.9
-
-
1.9
-
1.9
-
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-0.02
6
5.9
-
-
5.9
-
5.9
-
V
-
-
-
-
-
-
-
-
-
V
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
-5.2
6
5.48
-
-
5.34
-
5.2
-
V
0.02
2
-
-
0.1
-
0.1
-
0.1
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
0.02
6
-
-
0.1
-
0.1
-
0.1
V
-
-
-
-
-
-
-
-
-
V
4
4.5
-
-
0.26
-
0.33
-
0.4
V
5.2
6
-
-
0.26
-
0.33
-
0.4
V
II
VCC or
GND
-
6
-
-
±0.1
-
±1
-
±1
µA
ICC
VCC or
GND
0
6
-
-
8
-
80
-
160
µA
3
CD54HC147, CD74HC147, CD74HCT147
DC Electrical Specifications
(Continued)
TEST
CONDITIONS
SYMBOL
VI (V)
IO (mA)
High Level Input
Voltage
VIH
-
-
Low Level Input
Voltage
VIL
-
High Level Output
Voltage
CMOS Loads
VOH
VIH or VIL
PARAMETER
VCC
(V)
25oC
-40oC TO 85oC -55oC TO 125oC
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
4.5 to
5.5
2
-
-
2
-
2
-
V
-
4.5 to
5.5
-
-
0.8
-
0.8
-
0.8
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
4
4.5
-
-
0.26
-
0.33
-
0.4
V
±0.1
-
±1
-
±1
µA
HCT TYPES
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
VOL
VIH or VIL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
II
VCC and
GND
0
5.5
-
ICC
VCC or
GND
0
5.5
-
-
8
-
80
-
160
µA
∆ICC
(Note 2)
VCC
-2.1
-
4.5 to
5.5
-
100
360
-
450
-
490
µA
Quiescent Device
Current
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
NOTE:
2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.
HCT Input Loading Table
INPUT
UNIT LOADS
I1, I2, I3, I6, I7
1.1
I4, I5, I8, I9
1.5
NOTE: Unit Load is ∆ICC limit specified in DC Electrical Table, e.g.,
360µA max at 25oC.
Switching Specifications Input tr, tf = 6ns
PARAMETER
25oC
-40oC TO 85oC -55oC TO 125oC
SYMBOL
TEST
CONDITIONS
VCC (V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
tPLH, tPHL
CL = 50pF
2
-
-
160
-
200
-
240
ns
4.5
-
-
32
-
40
-
48
ns
5
-
13
-
-
-
-
-
ns
6
-
-
27
-
34
-
41
ns
2
-
-
75
-
95
-
110
ns
4.5
-
-
15
-
19
-
22
ns
6
-
-
13
-
16
-
19
ns
-
-
-
10
-
10
-
10
pF
HC TYPES
Propagation Delay,
Input to Output (Figure 1)
Transition Times
(Figure 1)
Input Capacitance
tTLH, tTHL
CIN
CL = 50pF
-
4
CD54HC147, CD74HC147, CD74HCT147
Switching Specifications Input tr, tf = 6ns
(Continued)
25oC
-40oC TO 85oC -55oC TO 125oC
SYMBOL
TEST
CONDITIONS
VCC (V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
CPD
-
5
-
32
-
-
-
-
-
pF
Propagation Delay,
Input to Output (Figure 2)
tPLH, tPHL
CL = 50pF
4.5
-
-
35
-
44
-
53
ns
5
-
14
-
-
-
-
-
ns
Transition Times (Figure 2)
tTLH, tTHL
CL = 50pF
4.5
-
-
15
-
19
-
22
ns
Input Capacitance
CIN
-
-
-
-
10
-
10
-
10
pF
Power Dissipation Capacitance
(Notes 3, 4)
CPD
-
5
-
42
-
-
-
-
-
pF
PARAMETER
Power Dissipation Capacitance
(Notes 3, 4)
HCT TYPES
NOTES:
3. CPD is used to determine the dynamic power consumption, per gate.
4. PD = VCC2 fi (CPD + CL) where fi = Input Frequency, CL = Output Load Capacitance, VCC = Supply Voltage.
Test Circuits and Waveforms
tr = 6ns
tf = 6ns
INPUT
GND
tTLH
GND
tTHL
90%
50%
10%
INVERTING
OUTPUT
3V
2.7V
1.3V
0.3V
INPUT
tTHL
tPHL
tf = 6ns
tr = 6ns
VCC
90%
50%
10%
tTLH
90%
1.3V
10%
INVERTING
OUTPUT
tPLH
tPHL
FIGURE 6. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC
tPLH
FIGURE 7. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
5
PACKAGE OPTION ADDENDUM
www.ti.com
13-Aug-2021
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
8406401EA
ACTIVE
CDIP
J
16
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
8406401EA
CD54HC147F3A
CD54HC147F3A
ACTIVE
CDIP
J
16
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
8406401EA
CD54HC147F3A
CD74HC147E
ACTIVE
PDIP
N
16
25
RoHS & Green
NIPDAU
N / A for Pkg Type
-55 to 125
CD74HC147E
CD74HC147M
ACTIVE
SOIC
D
16
40
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-55 to 125
HC147M
CD74HC147M96
ACTIVE
SOIC
D
16
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-55 to 125
HC147M
CD74HC147M96E4
ACTIVE
SOIC
D
16
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-55 to 125
HC147M
CD74HC147MT
ACTIVE
SOIC
D
16
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-55 to 125
HC147M
CD74HC147PW
ACTIVE
TSSOP
PW
16
90
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-55 to 125
HJ147
CD74HC147PWR
ACTIVE
TSSOP
PW
16
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-55 to 125
HJ147
CD74HC147PWT
ACTIVE
TSSOP
PW
16
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-55 to 125
HJ147
CD74HCT147E
ACTIVE
PDIP
N
16
25
RoHS & Green
NIPDAU
N / A for Pkg Type
-55 to 125
CD74HCT147E
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of