A product Line of
Diodes Incorporated
PI3L720
2:1 Mux/DeMux Gigabit Ethernet LAN Switch with Power-down Mode
Features
Description
•
•
•
•
•
•
•
•
•
The PI3L720 is a 8-Channel 2:1 multiplexer/demultiplexer LAN
Switch with Hi-Z outputs. Industry leading advantages include a
propagation delay of less than 250ps, resulting from its low channel
resistance and I/O capacitance. The device multiplexes differential
outputs from a Gigabit Ethernet transceiver (PHY) device to one
of two corresponding B or C outputs. The switch is bidirectional
and offers little or no attenuation of the high-speed signals at the
outputs. It is designed for low bit-to-bit skew, high channel-tochannel noise isolation and is compatible with various standards,
such as 10/100/1000 Base-T (Ethernet).
1:2 Gigabit LAN Switch
Power-down support
Low bit-to-bit skew: 200ps
Very Low Crosstalk: –75dB @ 250MHz
Status Indicator LEDs Switched with Ethernet pairs
VDD Operating Range: +3.0V to +3.6V
Enhanced ESD Protection (on A, B, C, LED pins):
– 8kV (contact)(1)
– 1.0kV (machine model),
11kV (human body model)
>650 MHz bandwidth
Packaging:
– 42-contact TQFN (3.5 x 9mm, 0.5 pitch)
The PI3L720 provides a Power Down input (PD), which can put
the device into standby mode (PD=1) while mobile, eliminating
an external power switch.
Generally, this part can be used to replace mechanical relays in
low-voltage LAN applications that interface a physical layer over
CAT 5 or CAT 6 unshielded twisted pair cable through an isolation
transformer.
Applications
Block Diagram
A0+
B0+
A0-
B0-
• Dual Physical Layer Device sharing to one interface
connector, or one controller to dual connectors for docking
• Routes signals for 10/100/1000 Mbit Ethernet
C0+
C0-
A3+
B3+
A3-
B3-
Truth Table
C3+
C3-
LEDA0
LEDB0
PD
SEL
Function
L
L
AX to BX; LEDAX to LEDBX
L
H
AX to CX; LEAX to LEDCX
H
x
Hi-Z
Note:
1. IEC 6100-4-2
LEDC0
LEDB1
LEDA1
LEDC1
LEDB2
LEDA2
LEDC2
SEL
PD
POWER
DOWN
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PI3L720
LEDA2
LEDB2
LEDC2
VDD
41
40
39
38
B0+
2
37
3
36
4
35
B0C0+
C0-
5
34
6
33
7
32
8
31
GND
B1+
B1C1+
C1-
30
VDD
10
29
B2+
B2C2+
C2B3+
B3C3+
C3-
9
23
17
22
21
24
16
VDD
25
15
20
26
14
LEDC1
27
13
19
28
18
11
12
LEDB1
VDD
LEDA0
LEDA1
LEDB0
1
LEDC0
VDD
A0+
A0VDD
PD
A1+
A1VDD
A2+
A2A3+
A3SEL
42
Pin Configuration (42-TQFN ZH, Top-Side View)
Pin Description
Pin Name
Description
AX+, AX-
Port A DeMux I/O
BX+, BX-
Port B Mux I/O
CX+, CX-
Port C LED Mux I/O
GND
Ground
LEDZX
LED I/O
PD
Power Down. Active high, with internal pull-down resistor
SEL
Select
VDD
Power
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PI3L720
Maximum Ratings
(Above which useful life may be impaired. For user guidelines, not tested.)
Storage Temperature......................................................... –65°C to +150°C
Supply Voltage to Ground Potential ............................ –0.5V to +4.0V
DC Input Voltage................................................................. –0.5V to +5.5V
DC Output Current........................................................................... 120mA
Power Dissipation............................................................................... 0.5W
Note:
Stresses greater than those listed under MAXIMUM RATINGS may cause permanent damage to the device. This is
a stress rating only and functional operation of the device
at these or any other conditions above those indicated in
the operational sections of this specification is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect reliability.
DC Electrical Characteristics for 1000 Base-T Ethernet Switching over Operating Range
(TA = –40°C to +85°C, VDD = 3.3V ±10%)
Paramenter
Description
Test Conditions(1)
Min.
Typ.(2)
Max.
VIH
Input HIGH Voltage
Guaranteed HIGH level (Control Pins)
2.0
–
–
VIL
Input LOW Voltage
Guaranteed LOW level (Control Pins)
–0.5
–
0.8
VIK
Clamp Diode Voltage
VDD = Max., IIN = –18mA
–
–0.7
–1.2
IIH
Input HIGH Current
VDD = Max., VIN = VDD
–
–
±2
IIL
Input LOW Current
VDD = Max., VIN = GND
–
–
±2
RON
Switch On-Resistance(3)
VDD = Min., 1.5V ≤ VIN ≤ VDD
IIN = –40mA
–
4.0
6.5
RFLAT(ON)
On-Resistance Flatness(3)
VDD = Min., VIN @ 1.5V and VDD
IIN = –40mA
–
0.5
–
ΔRON
On-Resistance match from center VDD = Min., 1.5V ≤ VIN ≤ VDD
ports to any other port(3)
IIN = –40mA
–
0.4
1.0
Units
V
µA
Ohm
DC Electrical Characteristics for 10/100 Base-T Ethernet Switching over Operating Range
(TA = –40°C to +85°C, VDD = 3.3V ±10%)
Paramenter
Description
Test Conditions(1)
Min.
Typ.(2)
Max.
VIH
Input HIGH Voltage
Guaranteed HIGH level (Control Pins)
2.0
–
–
VIL
Input LOW Voltage
Guaranteed LOW level (Control Pins)
–0.5
–
0.8
VIK
Clamp Diode Voltage
VDD = Max., IIN = –18mA
–
–0.7
–1.2
IIH
Input HIGH Current
VDD = Max., VIN = VDD
–
–
±2
IIL
Input LOW Current
VDD = Max., VIN = GND
–
–
±2
RON
Switch On-Resistance(3)
VDD = Min., 1.25V ≤ VIN ≤ VDD IIN =
–10mA to –30mA
–
4.0
6.5
RFLAT(ON)
On-Resistance Flatness(3)
VDD = Min., VIN @ 1.25V and VDD IIN
= –10mA to –30mA
–
0.5
–
∆RON
On-Resistance match from cen- VDD = Min., 1.25V ≤ VIN ≤ VDD IIN =
ter ports to any other port(3) –10mA to –30mA
–
0.4
1.0
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Units
V
µA
Ohm
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PI3L720
Capacitance(TA = –40°C to +85°C, VDD = 3.3V ±10%)
Parameters(4)
Description
CIN
Input Capacitance
COFF(B1, B2)
Port B Capacitance, Switch OFF
CON(A/B)
A/B Capacitance, Switch ON
Test Conditions(1)
Min.
VIN = 0V, f = 1MHz
Typ.
Max.
2.0
3.0
3.0
6.0
8.0
11.0
Units
pF
Notes:
1. For max. or min. conditions, use appropriate value specified under Electrical Characteristics for the applicable device type.
2. Typical values are at VDD = 3.3V, Ta = 25°C ambient and maximum loading.
3. Measured by the voltage drop between A and B pins at indicated current through the switch. ON resistance is determined by the lower of the voltages on the two
(A & B) pins.
4. This parameter is determined by device characterization but is not production tested.
Power Supply Characteristics
Parameters
IDD-Standby(3)
IDD-Active(3)
IDD-PD(3)
Test Conditions(1)
Description
Min.
Typ.(2)
Max.
Units
—
0.3
0.5
mA
Quiescent Power Supply Current
VDD = Max., VIN = GND or VDD
Active Power Supply Current
VDD = Max., VIN = VDD or GND
1.0
1.5
mA
Power Down Current
PD = 1, VDD = MAX, VIN = VDD or GND
0.15
0.25
mA
Notes:
1. For max. or min. conditions, use appropriate value specified under Electrical Characteristics for the applicable device type.
2. Typical values are at VDD = 3.3V, Ta = 25°C ambient and maximum loading..
3. Active power represents normal data communication. Standby power is when the device is enabled for operation but there is no LAN traffic (cable not connected). Power down current is the minimum power state used when not connected and mobile.
4. The bus switch contributes no propagational delay other than the RC delay of the ON resistance of the switch and the load capacitance. The time constant for the
switch alone is of the order of 0.25ns for 10pF load. Since this time constant is much smaller than the rise/fall times of typical driving signals, it adds very little
propagational delay to the system. Propagational delay of the bus switch when used in a system is determined by the driving circuit on the driving side of the
switch and its interactions with the load on the driven side.
Dynamic Electrical Characteristics Over the Operating Range (TA = –40°C to +85°C, VDD = 3.3V ±10%)
Parameter
XTALK
Crosstalk(3)
OIRR
OFF
BW
Test Conditions(1)
Description
RL = 100-Ohm, f = 250MHz
Isolation(3)
Bandwidth –3dB(3)
RL = 100-Ohm
Min.
Typ.(2)
Max.
—
–75
—
—
–35
—
—
650
—
Units
dB
MHz
Notes:
1. For max. or min. conditions, use appropriate value specified under Electrical Characteristics for the applicable device type.
2. Typical values are at VDD = 3.3V, Ta = 25°C ambient and maximum loading..
3. Guaranteed by design.
4. The bus switch contributes no propagational delay other than the RC delay of the ON resistance of the switch and the load capacitance. The time constant for the
switch alone is of the order of 0.25ns for 10pF load. Since this time constant is much smaller than the rise/fall times of typical driving signals, it adds very little
propagational delay to the system. Propagational delay of the bus switch when used in a system is determined by the driving circuit on the driving side of the
switch and its interactions with the load on the driven side.
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PI3L720
Switching Characteristics (TA = -40°C to +85°C, VDD = 3.3V ± 10%)
Min.
Typ.(2)
tPD
Propagation
Delay(3,4)
–
0.25
tPZH, tPZL
Line Enable Time - SEL to AN, BN
0.5
–
15.0
tPHZ, tPLZ
Line Disable Time - SEL to AN, BN
0.5
–
5.0
tSK(o)
Output Skew between center port to any other
–
0.1
0.2
–
0.1
0.2
100
200
Paramenter
Description
port(3)
tSK(p)
Skew between opposite transitions of the same output (tPHL - tPLH) (3)
tON/OFF
Device enable / disable time from PD
Max.
Units
ns
Notes:
1. For max. or min. conditions, use appropriate value specified under Electrical Characteristics for the applicable device type.
2. Typical values are at VDD = 3.3V, Ta = 25°C ambient and maximum loading..
3. Guaranteed by design.
4. The bus switch contributes no propagational delay other than the RC delay of the ON resistance of the switch and the load capacitance. The time constant for the
switch alone is of the order of 0.25ns for 10pF load. Since this time constant is much smaller than the rise/fall times of typical driving signals, it adds very little
propagational delay to the system. Propagational delay of the bus switch when used in a system is determined by the driving circuit on the driving side of the
switch and its interactions with the load on the driven side.
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PI3L720
Test Circuit for Electrical Characteristics
Switch Positions
Test
2.4 V
VDD
Switch
tPLZ, tPZL (output on B-side)
6.0V
tPHZ, tPZH (output on B-side)
GND
Prop Delay
Open
200-ohm
Pulse
Generator
VIN
SEL
D.U.T
VOUT
4pF
CL
RT
200-ohm
Notes:
CL = Load capacitance: includes jig and probe capacitance.
RT = Termination resistance: should be equal to ZOUT of the Pulse Generator
Test Circuit for Dynamic Electrical Characteristics
HP8753ES
S1
VDD
T1
D.U.T
HP11667A
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R1
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10pF
6
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PI3L720
Switching Waveforms
SEL
VDD/2
3.5V
2.5V
Input
tPHL
1.5V
Output 1
VOH
Output
2.5V
VDD
0V
2.5V
tPLH
VDD/2
tPZL
tPLZ
VOL
VOL + 0.15V
tPHZ
tPZH
2.5V
VOH=VP
VSwing/2
VOH - 0.15V
VSwing/2
Output 2
VOL
VOH=VP
VOL
Voltage Waveforms Enable and Disable Times
Voltage Waveforms Propagation Delay Times
3.5V
2.5V
Data In
tPLHX
1.5V
tPHLX
3.5V
VOH
Data Out
at Channel X
I
tSK(o)
tPLH
VOL
1.5V
2.5V
Output
2.5V
VOL
VOL
tPLHy
tPHL
VOH
VOH
Data Out
at Channel Y
2.5V
Input
2.5V
tSK(p) = I tPHL – tPLH I
tPHLy
tSK(o) = I tPLHy – tPLHx I or I tPHLy – tPHLx I
Pulse Skew - tSK(p)
Output Skew - tSK(o)
Notes:
Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
All input impulses are supplied by generators having the following characteristics: PRR ≤ MHz, ZO = 50-Ohm, tR ≤ 2.5ns, tF ≤ 2.5ns.
Applications Information
Logic Inputs
The logic control inputs can be driven up to +3.6V regardless of the supply voltage. For example, given a +3.3V supply, the output
enables or select pins may be driven low to 0V and high to 3.6V. Driving IN Rail-to-Rail® minimizes power consumption.
Power-Supply Sequencing
Proper power-supply sequencing is advised for all CMOS devices. It is recommended to always apply VDD before applying signals to
the input/output or control pins.
Rail-to-Rail is a registered trademark of Nippon Motorola, Ltd
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PI3L720
Packaging Mechanical: 42-Contact TQFN (ZH)
16-0161
Note: For latest package info, please check: http://www.pericom.com/support/packaging/packaging-mechanicals-and-thermal-characteristics/
Ordering Information
Ordering Number
Package Code
Package Description
PI3L720ZHE
ZH
42-contact, Very Thin Quad Flat No-Lead (TQFN)
PI3L720ZHEX
ZH
42-contact, Very Thin Quad Flat No-Lead (TQFN), Tape & Reel
Notes:
• Thermal characteristics can be found on the company web site at www.pericom.com/packaging/
• E = Pb-free & Green
• Adding an X suffix = Tape/Reel
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LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated.
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