A product Line of
Diodes Incorporated
PI3WVR31313A
DP/HDMI 1:3 De-multiplexer switches
Features
Description
ÎÎDP/HDMI 1:3 De-multiplexer switch with 4 high speed
PI3WVR31313A has two passive output port1 and port2, one active (DP to HDMI) output port3. Passive output ports support
DP1.2 at 5.4Gbps. Active port3 support HDMI1.4b at 3.4Gbps.
All three output ports support auto port priority selection. Input port accepts DP1.2 and DP++ signals associated with output
ports as described above.
differential channel and AUX/DDC, HPD and CAB_DET
signal channels
ÎÎTwo passive output ports for DP1.2 at5.4Gbps signals
ÎÎOne active output port with integrated DP to HDMI re-
driver (level shifter) supports HDMI 1.4 at 3.4Gbps
ÎÎPin control mode supports auto port priority selection
Application
ÎÎPin control mode supports port3 with DDC bi-direction
buffer switch only
ÎÎNotebook
ÎÎI2C control mode supports auto port priority selection
ÎÎI2C control mode supports port3 with 8 levels equalization
and 5 levels pre-emphasis
Pin Configuration: TQFN-60
ÎÎI2C control mode supports port3 with either DDC bi-
AUXN
AUXP
SCL3
SDA3
AUX2P/SCL2
AUX2N/SDA2
CAB_2
AUX1P/SCL1
AUX1N/SDA1
CAB_1
direction buffer switch or DDC passive switch
ÎÎVery low operating power when passive port1 and port2 are
selected
ÎÎ3.3V power supply
ÎÎ2KV HBM ESD protection for all I/O pins
60 59 58 57 56 55 54 53 52 51
OEB
SCL
SDA
VDD
HPD_SRC
CAB_SRC
D0P
D0N
D1P
D1N
D2P
D2N
D3P
D3N
SDA_CTL/PRI_SEL
SCL_CTL/EQ
I2C_A1/PRE_EMP
I2C_A2/ROUT_SEL
HPD3
HPD2
ÎÎSupport Type2 cable ID register
ÎÎPackaging:
60 pin TQFN package (5x9mm, 0.4mm pitch)
Center Pad
TQFN-60
5x9 mm
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
VDD
D0P1
D0N1
D1P1
D1N1
D2P1
D2N1
D3P1
D3N1
D0P2
D0N2
D1P2
D1N2
D2P2
D2N2
D3P2
D3N2
CEXT
HPD1
MS
21 22 23 24 25 26 27 28 29 30
CLKN3
CLKP3
VDD
D0N3
D0P3
D1N3
D1P3
VDD
D2N3
D2P3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
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PI3WVR31313A
Block Diagram
CEXT
CAB_SRC HPD_SRC
HPD1
120KΩ
HPD2
120KΩ
VDD
LDO
HPD3
120KΩ
CAB_1
CAB_2
100KΩ pull High
AUX1P/SCL1
AUX1N/SDA1
AUX2P/SCL2
AUX2N/SDA2
AUXP
AUXN
SDA
SCL
SDA3
SCL3
cable ID
D[0:3]P1
D[0:3]N1
VDD
0//VDD
D[0:3]P
D[0:3]N
D[0:3]P2
D[0:3]N2
10K pull
Low
RT
Port select
RT
GND
ROUT
ROUT
D[0:3]P3
D[0:3]N3
Rpd
Rpd
GND
OEB
MS
PRI_SEL
EQ
PRE_EMP
ROUT_SEL
Control & Status
Register
I2C
Controller
SDA_CTL
SCL_CTL
(share pins)
I2C_A1, A2
(share pins)
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Pin Description
pin#
pin Name
7
D0P
9
D1P
11
D2P
13
D3P
8
D0N
10
D1N
12
D2N
14
D3N
49
D0P1
47
D1P1
45
D2P1
43
D3P1
48
D0N1
46
D1N1
44
D2N1
42
D3N1
41
D0P2
39
D1P2
37
D2P2
35
D3P2
40
D0N2
38
D1N2
36
D2N2
34
D3N2
30
D2P3
27
D1P3
25
D0P3
29
D2N3
26
D1N3
24
D0N3
22
CLKP3
21
CLKN3
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Signal Type
17-0053
Description
I
4 differential pair input (DP or DP++)
O
4 differential pair output (DP) for port 1 and port 2
O
4 differential pair output (HDMI) for port 3
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PI3WVR31313A
pin#
pin Name
Signal Type
Description
52
AUX1N/SDA1
55
AUX2N/SDA2
53
AUX1P/SCL1
56
AUX2P/SCL2
57
SDA3
58
SCL3
60
AUXN
59
AUXP
3
SDA
2
SCL
32
HPD1
I
20
HPD2
I
HPD1-3 for port1-3;
19
HPD3
I
HPD_SRC to DP-source
5
HPD_SRC
O
51
CAB_1
54
CAB_2
6
CAB_SRC
1
OEB
I
15
SDA_CTL/PRI_SE
I
16
SCL_CTL/EQ
17
I2C_A1/PRE_EMP
I
18
I2C_A2/ROUT_SEL
I
IO
AUX (DP) or DDC (HDMI) to three ports
IO
AUX to DP-source
IO
DDC to DP-source
CAB_1: CAB_DET to port1
IO
CAD_2: CAB_DET to port2
CAB_SRC: CAB_DET to DP-source
No CAB_DET for HDMI port3
IO
OEB=0, device active; OEB=1, device shut down
MS=0, PRI_SEL selects priority in pin control mode;
MS=1, SDA_CTL as SDA in I2C control mode
MS=0, EQ selects equalization in pin control mode;
MS=1, SCL_CTL as SCL in I2C control mode
MS=0, PRE_EMP selects Pre-emphasis in pin control mode;
MS=1, I2C_A1 as I2C address A1 in I2C control mode
MS=0, ROUT_SEL selects source termination in pin control
mode;
MS=1, I2C_A2 as I2C address A2 in I2C control mode
Mode Select: MS pin with weak pull low resistor > 500Kohm
31
MS
I
MS=0 or half VDD input level for pin control mode,
MS=1 for I2C control mode
33
CEXT
O
4, 23, 28, 50
VDD
Power
Center Pad
GND
Ground
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17-0053
Internal LDO bypass capacitance, 4.7uf to GND
3.3V VDD
Bottom GND EPAD
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PI3WVR31313A
Pin mapping for dual mode DP source DEMUX to DP output
DP mode
HDMI/DVI mode
WVR31313A
input pins
WVR31313A
port1 output
WVR31313A
port2 output
WVR31313A
port3 output
ML_lane0(P)
TX2+
D0P
D0P1
D0P2
D2P3
ML_lane0(N)
TX2-
D0N
D0N1
D0N2
D2N3
ML_lane1(P)
TX1+
D1P
D1P1
D1P2
D1P3
ML_lane1(N)
TX1-
D1N
D1N1
D1N2
D1N3
ML_lane2(P)
TX0+
D2P
D2P1
D2P2
D0P3
ML_lane2(N)
TX0-
D2N
D2N1
D2N2
D0N3
ML_lane3(P)
TXC+
D3P
D3P1
D3P2
CLKP3
ML_lane3(N)
TXC-
D3N
D3N1
D3N2
CLKN3
Function Description
The MS pin selects I2C or pin control mode.
Pin control mode has only automatic port selection. I2C control mode has automatic port selection.
In auto port selection, when only one HPD high detected, the port with HPD high will be selected. When multiple HPD high detected,
the PRI_SEL pin(priority select) will determine the priority of the 3 ports.
When PRI_SEL=low, the port-priority will be port1-port2-port3 from high to low; when PRI_SEL=high, the port priority will be
port1-port3-port2 from high to low; when PRI_SEL=M (open as not connected), the port priority will be port3-port1-port2 from
high to low.
When port 1 (or port2) is selected and CAB_1 (or CAB_2) is low as in DP mode, the AUX/DDC channels will work as AUX channels.
AUXP shall have 100Kohm external resistor to GND and AUXN shall have 100Kohm external resistor to VDD. The data rate of AUX
channels will be >720Mbps.The internal DDC switch will be off.
When port 1 (or port2) is selected and CAB_1 (or CAB_2) is high when DP to HDMI adapter plugged, the AUX/DDC channels will
work as DDC channels. The internal DDC channels are on and the AUX channels are off. The input of DDC channels can tolerate 5V
input and voltage of DDC to source will be limited about 3.3V or below.
When port 1 or port 2 is selected (passive ports), port3 with HDMI re-driver will shut down.
When port 3 is selected, the internal DP to HDMI level shifter will be enabled. There will be 3 EQ and 3 Pre-emphasis settings in pin
control mode, 8 EQ and 5 Pre-emphasis settings in I2C control mode.
When port 3 is selected, HDMI output can be standard TMDS-open-drain source, as well to be selected with internal source
termination as 50 ohm pull up to 3.3V VDD, using ROUT_SEL pin control or I2C control.
When port 3 is active as DP to HDMP level shifter, the DDC channel can be selected between bi-direction DDC buffer and passive
DDC switch.
HPD1, HPD2 and HPD3 are with internal CMOS buffers and can support 3.3V and 5V HPD inputs.
Squelch Mode
Squelch function will disable HDMI data output (as high impedance)when the voltage and frequency of input clock (TMDS) are
below squelch threshold, which will prevent random noise presenting in HDMI data output, thereby prevent noise on sink display.
Squelch function will enable-resume HDMI data output when input clock signals are above squelch threshold.
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PI3WVR31313A
Truth Table for TMDS port3
EQ – three level pin control
PRE-EMP – three level pin control
EQ
Equalization value
PRE_EMP
TX pre-emphasis
0
1.5dB
0
0dB
open
4.0dB
open
1.5dB
1
6.5dB
1
2.5dB
MS – three level pin control
ROUT_SEL
ROUT_SEL Pull-Up Resistors on port3 D[0:3]P3, D[0:3]N3
MS
Pin mode/type cable ID
0
No Pull-up resistors
0
Pin mode for Type 2 ID
1
50Ω Pull-up resistors to VDD
M(0.5*vdd)
Pin mode for Type 1 ID
1
I2C mode
Priority Selection Table
PRI_SEL
(Priority order)
HPD1
HPD2
HPD3
HPD_SRC
CAB_SRC
AUXP/AUXN
SDA/SCL
0
0
0
0
0
Hi-Z
Hi-Z
Hi-Z
0
1
x
x
HPD1
CAB1=0
AUX1P/AUX1N
Hi-Z
CAB1=1
Hi-Z
SDA1/SCL1
0
0
1
x
HPD2
CAB2=0
AUX2P/AUX2N
Hi-Z
CAB2=1
Hi-Z
SDA2/SCL2
0
0
0
1
HPD3
High
Hi-Z
SDA3/SCL3
M
0
0
0
0
Hi-Z
Hi-Z
Hi-Z
M
1
x
0
HPD1
CAB1=0
AUX1P/AUX1N
Hi-Z
CAB1=1
Hi-Z
SDA1/SCL1
M
0
1
0
HPD2
CAB2=0
AUX2P/AUX2N
Hi-Z
CAB2=1
Hi-Z
SDA2/SCL2
M
x
x
1
HPD3
High
Hi-Z
SDA3/SCL3
1
0
0
0
0
Hi-Z
Hi-Z
Hi-Z
1
1
x
x
HPD1
CAB1=0
AUX1P/AUX1N
Hi-Z
CAB1=1
Hi-Z
SDA1/SCL1
1
0
1
0
HPD2
CAB2=0
AUX2P/AUX2N
Hi-Z
CAB2=1
Hi-Z
SDA2/SCL2
1
0
x
1
HPD3
High
Hi-Z
SDA3/SCL3
Note: M=internal half VDD when input=HiZ
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PRI_SEL
(Priority order)
HPD1
HPD2
HPD3
D0P
D1P
D2P
D3P
D0N
D1N
D2N
D3N
0
0
0
0
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
0
1
x
x
D0P1
D1P1
D2P1
D3P1
D0N1
D1N1
D2N1
D3N1
0
0
1
x
D0P2
D1P2
D2P2
D3P2
D0N2
D1N2
D2N2
D3N2
0
0
0
1
D2P3
D1P3
D0P3
CLKP3
D2N3
D1N3
D0N3
CLKN3
M
0
0
0
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
M
1
x
0
D0P1
D1P1
D2P1
D3P1
D0N1
D1N1
D2N1
D3N1
M
0
1
0
D0P2
D1P2
D2P2
D3P2
D0N2
D1N2
D2N2
D3N2
M
x
x
1
D2P3
D1P3
D0P3
CLKP3
D2N3
D1N3
D0N3
CLKN3
1
0
0
0
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
1
1
x
x
D0P1
D1P1
D2P1
D3P1
D0N1
D1N1
D2N1
D3N1
1
0
1
0
D0P2
D1P2
D2P2
D3P2
D0N2
D1N2
D2N2
D3N2
1
0
x
1
D2P3
D1P3
D0P3
CLKP3
D2N3
D1N3
D0N3
CLKN3
Note: M=internal half VDD when input=HiZ
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PI3WVR31313A
Maximum Ratings
(Above which useful life may be impaired. For user guidelines, not tested.)
Storage Temperature ........................................................... –65°C to +150°C
Junction Temperature............................................................................. 125°C
Supply Voltage to Ground Potential ....................................–0.5V to +4.6V
High Speed Channel Input Voltage (DP Mode)........................–0.5V to 2V
DDC and HPD channels Input Voltage ....................................–0.5V to 6V
DC Output Current ..............................................................................180mA
Power Dissipation .................................................................................... 0.6W
Note: Stresses greater than those listed under MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions above those
indicated in the operational sections of this specification is
not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
Electrical Characteristics
Recommended Operation Conditions
VDD = 3.3V ±10%, Min and Max apply for TA between -40oC to 85oC Typical values are referenced to TA = 25oC
Parameter
Description
VDD
Operating Voltage
Test Conditions
VDD supply current
(Port1 or 2 active)
IDD
VDD Supply Current
(Port3 active)
IDDQ
VDD Quiescent Supply Current
(port3 active w/o TMDS input)
Min.
Typ.
Max.
Unit
3.0
3.3
3.6
V
VDD=3.3V
1
1.8
mA
Output Enable ( open drain 500mv
signal-end 0dB pre-emphasis, not
including 40mA current to source)
80
100
mA
Output Enable ( double termination,
500mv signal-end 0dB pre-emphasis, not including 40mA current to
source)
160
200
mA
TMDS Output Disable
3.5
5
mA
Isd1
Supply shut down current when
OEB disable (MS=0)
VDD=3.6V, OEB=high
0.1
0.2
mA
Isd2
Supply shut down current when
OEB disable (MS=1)
VDD=3.6V, OEB=high
0.6
1.2
mA
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DC Electrical Characteristics for Switching over Operating Range
Parameter
Description
Test Conditions
Min.
Typ.
Max.
Unit
OEB, MS, ROUT_SEL
IIH
High level digital input current
VIH =VDD
-10
40
μA
IIL
Low level digital input current
VIL = GND
-10
10
μA
VIH
High level digital input voltage
2.0
VIL
Low level digital input voltage
0
V
0.8
V
0.4
V
HPD_SRC
VOL_HPD_SRC
Buffer Output Low Voltage
IOL = 4 mA
VOH_HPD_SRC
Buffer Output Low Voltage
IOH = 4 mA
2.4
IIH
High level digital input current
VIH =VDD
-10
40
μA
IIL
Low level digital input current
VIL = GND
-10
10
μA
VIH
High level digital input voltage
VDD=3.3V
2.0
VIL
Low level digital input voltage
V
HPD_sink
V
0
0.8
V
-50
50
uA
CAB
ILK
Input leakage current
Switch is off, Vin=5.5V
CIO
Input/Output capacitance whenpassive switch on
RON
Passive Switch resistance
IO = 3mA, VO = 0.4V
Vpass
Switch Output voltage
VI=3.3V, II=100uA
CI(source)
Source side CAB capacitance
CI(sink)
Sink side CAB capacitance when
10
1.5
VI peak-peak = 1V, 100 KHz
pF
25
50
Ω
3.0
3.3
V
3.5
pF
6.5
pF
SDA/SCL, SDA1/SCL1, SDA2/SCL2
ILK
Input leakage current
DDC switch is off, Vin=5.5V
CIO
Input/Output capacitance when
passive switch on
VI peak-peak = 1V, 100 KHz
8
RON
Passive Switch resistance
IO = 3mA, VO = 0.4V
25
50
Ω
Vpass
Switch Output voltage
2.0
2.5
V
CI(source)
Source side DDC capacitance (
passive switch off. )
CI(sink)
Sink side DDC capacitance ( pasVI peak-peak = 1V, 100 KHz
sive switch off. )
VI=5.0V, II=100uA
VDD=3.3V
-50
1.5
VI peak-peak = 1V, 100 KHz
50
uA
pF
2.5
pF
5
pF
SDA3/SCL3 ( DDC buffer of port3 active)
VIH
High level input voltage
VIL
Low level input voltage
ILK
Input leakage current
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VDD=3.3V
DDC switch is off, Vin = 5.5V
17-0053
9
2.0
V
0
0.8
V
-10
10
uA
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Parameter
Description
Test Conditions
IIL
Low level input current
VIL = 0.2V
VOL
Low level output voltage
ILOH
CIO
Min.
Typ.
Max.
Unit
10
μA
IOL = 4mA
0.2
V
HIGH-level output leakage current
VO=3.6V
10
μA
Input/output capacitance
VI = 3 V or 0 V; VCC = 3.3 V or 0V
-10
4
pF
SDA/SCL (DDC buffer of port3 active)
VIH
High level input voltage
VIL
Low level input voltage
ILK
Input leakage current
IIL
VDD=3.3V
2.0
V
0
0.4
V
DDC switch is off, Vin = 5.5V
-10
10
uA
Low level input current
VIL = 0.2V
-10
10
μA
VOL
Low level output voltage
IOL = 4mA
0.47
0.6
V
ILOH
HIGH-level output leakage current
VO=3.6V
10
μA
CIO
Input/output capacitance
VI = 3 V or 0 V; VCC = 3.3 V or 0V
0.52
5
8
pF
AUXP, AUXN, AUXnP/SCLn, AUXnN/SDAn
ILK
Input leakage current
DDC switch is off, Vin=5.5V
CIO
Input/Output capacitance when
passive switch on
VI peak-peak = 1V, 100 KHz
6
pF
RON
Passive Switch resistance
IO = 3mA, VO = 0.3V
5
Ω
IO = 3mA, VO = 3.0V
10
Ω
Vpass
Switch Output voltage
CI(source)
Source side capacitance ( passive
switch off. )
VI peak-peak = 1V, 100 KHz
2.5
pF
CI(sink)
Sink side capacitance ( passive
switch off. )
VI peak-peak = 1V, 100 KHz
3.5
pF
VI=5.5V, II=100uA
VDD=3.3V
-50
50
4
4.5
uA
V
High Speed Channel (D[0:3]P/N – D[0:3]P1N1, D[0:3]P/N – D[0:3]P2N2)
VIK
Clamp Diode Voltage (HS Channel)
VDD = Max., IIN = –18mA
IIH
Input HIGH Current
VDD = Max., VIN = VDD
±10
IIL
Input LOW Current
VDD = Max., VIN = GND
±10
RON_HS
On resistance between input to
out- put for high speed signals
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17-0053
VINPUT,cm = 0V to 1.2V,
VINPUT,diff < 1.0Vp-p, diff,
–1.6
8
–1.8
V
µA
Ohm
VDD = 3.0V, IINPUT = 20mA
10
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Parameter
Description
Test Conditions
Min.
Typ.
Max.
Unit
VDD+10
mV
50
66
ohm
30
100
uA
100
uA
Max.
Unit
High Speed Channel Port3 (D[0:2]P3/N3, CLKP3/N3)
VI(open)
Single-ended input voltage under
high impedance input or open
input
IL=10uA
VDD-10
RT
Input termination resistance
VIN=2.9V
45
IOZ
Leakage current resistance
VDD=3.6V, OEB=High
Ioff
Power off leakage current
VDD=0, VIN=3.6V
-100
Dynamic Electrical Characteristics over Operating Range
(TA = -40º to +85ºC, VDD = 3.3V ±10%)
Parameter
Description
Test Conditions
Min.
Typ.
TMDS Differential Pins
tpd
tr
tf
Propagation delay
2000
Differential output signal rise time
120
(20% - 80%)
Differential output signal fall time
(20% - 80%)
VDD = 3.3V, Rout = 50Ω off, open
drain, 0dB pre-emphasis
120
tsk(p)
Pulse skew
15
50
tsk(D)
Intra-pair differential skew
25
50
tsk(o)
Inter-pair differential skew(2)
Tjit_clk(pp)
Peak-to-peak output jitter CLK
residual jitter
Tjit_dat(pp)
Peak-to-peak output jitter DATA
Residual Jitter
ten
Enable time
tdis
Disable time
ps
100
Data Input = 3.4 Gbps HDMI data
pattern from signal generation,
short trace.
CLK Input = 340 MHz clock
15
40
25
50
when channel is active
10
50
us
SCL, SDA channel, AUX channel , CAB channel : passive switches
tpd(DDC)
Propagation delay from SCLn/
SDAn to SCL/SDA or SCL/SDA to
SCLn/SDAn In passive SW on.
CL = 10pF, in passive switch
5
ns
SCL3, SDA3- SCL,SDA channel : buffers
tPLH
LOW-to-HIGH propagation delay
SCL/SDA to SCL3/SDA3
50
100
150
ns
tPHL
HIGH-to-LOW propagation delay
SCL/SDA to SCL3/SDA3
10
20
40
ns
tPLH
LOW-to-HIGH propagation delay
SCL3/SDA3 to SCL/SDA
50
100
150
ns
tPHL
HIGH-to-LOW propagation delay
SCL3/SDA3 to SCL/SDA
10
20
40
ns
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A product Line of
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PI3WVR31313A
Parameter
Description
Test Conditions
Min.
Typ.
Max.
Unit
2
4
us
2
4
us
Typ.
Max.
Unit
Control and Status Pins (HPDn, HPD_SRC)
tpd(HPD)
Propagation delay (from HPDx to
the active port of HPD_SRC, high
to low)
tsx(HPD)
Switch time (from port select to
the latest HPD , manual selection
mode)
CL = 10pF
Dynamic Electrical Characteristics
Parameter
Description
Test Conditions
Min.
High Speed Channel (D[0:3]P/N – D[0:3]P1N1, D[0:3]P/N - D[0:3]P2N2)
XTALK
See Fig. 1 for
Crosstalk on High Speed Channels Measurement
Setup
f= 2.7 GHz
-32
-30
OIRR
OFF Isolation on High Speed
Channels
See Fig. 2 for
Measurement
Setup
f= 2.7 GHz
-19
-17
ILOSS
Differential Insertion Loss on
High Speed Channels
@2.7GHZ (see figure 3)
-1.7
-1.5
dB
dB
R loss
Differential Return Loss on High
Speed Channels
@ 2.7GHz (5.4Gbps)
BW_Dx±
Bandwidth -3dB for Main high
speed path (Dx±)
See figure 3
5.1
5.6
GHz
BW_AUX
Bandwidth -3dB for AUX
See figure 3
1.2
1.5
GHz
Tstartup
VDD valid to channel enable
250
us
Twakeup
Enabling output by changing OEB
from High to Low
250
us
Tpd
Propagation delay (input pin to
output pin) on all channels
80
ps
tb-b
Bit-to-bit skew within the same
differential pair of Dx± channels
5
tch-ch
Channel-to-channel skew of Dx±
channels
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-18
-16
dB
7
ps
35
ps
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A product Line of
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PI3WVR31313A
BALANCED
PORT1
BALANCED
PORT2
BALANCED
PORT1
+
+
50
–
–
50
+
+
50
–
–
50
+
+
50
+
–
–
50
–
BALANCED
PORT1
BALANCED
PORT2
DUT
DUT
Fig 1. Crosstalk Setup
Fig 2. Off-isolation setup
+
+
–
–
BALANCED
PORT2
DUT
Fig 3. Differential Insertion Loss
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A product Line of
Diodes Incorporated
PI3WVR31313A
Differential Insertion Loss , Vdd=3.3V, 25C
D0 to D01 Channel
D0 to D02 Channel
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A product Line of
Diodes Incorporated
PI3WVR31313A
Differential Return Loss , Vdd=3.3V, 25C
D0 to D01 Channel
D0 to D02 Channel
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A product Line of
Diodes Incorporated
PI3WVR31313A
Differential Off Isolation , Vdd=3.3V, 25C
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A product Line of
Diodes Incorporated
PI3WVR31313A
HPD auto selection timing waveform
t1 is the IRQ-HPD (sink) from selected-active port
HPD from selected-active port
Selected port is active
HPD_SRC
t1 (