PI5PD2068/2069
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70mΩ Current-Limited, Power-Distribution Switches
Features
70mΩ High-Side MOSFET
2.1A Continuous Current
Thermal and Short-Circuit Protection
Accurate Current Limit (2.85A typ.)
Operating Range: 2.7V to 5.5V
0.6ms Typical Rise Time
Under-Voltage Lockout
Deglitched Fault Report (/OC)
No /OC Glitch During Power Up
1μA Maximum Standby Supply Current
Reverse Current Blocking
Built-in Soft-Start
PT7M2061/PT7M2065
UL Recognized,
File Number E341484
D AND DGN PACKAGE
Pin Configuration
(TOP VIEW)
o
GND 1
8 OUT
IN
2
7
OUT
IN
3
6
OUT
4
5 /OC
PT7M2061/PT7M2065
D AND DGN PACKAGE
PI5PD2068
View)
(TOP (Top
VIEW)
PT7M2601/PT7M2065
o
DBV PACKAGE
GND 1
8 OUT
(TOP VIEW)
/EN
IN
OUT
IN
2
1
3
GND
EN
42
6
OUT
IN
OUT
5
/OC
7
5
Description
The PI5PD2068/69 is an integrated 70mΩ N-channel
MOSFET power switches for self-powered and buspowered Universal Series Bus (USB) applications. The
devices are equipped with charge pump circuitry to drive
the internal MOSFET switch. The switch’s low RDS(on),
70mΩ meets USB voltage drop requirements. This
power-distribution switch is designed to set current limit
at 2.85A typically.
When the output load exceeds the current-limit threshold
or a short-circuit situation is present, the devices limit
the output current by switching into a constant-current
mode, pulling the over-current (/OC) logic output low.
When continuous heavy overloads
and short-circuits
PT7M2062(-1)/PT7M2066(-1)
PT7M2065-1
increase
the
power
dissipation
in
the
switch,
causing the
D AND DGN PACKAGE
DGN PACKAGE
junction
temperature
to
rise,
a
thermal
protection
(TOP VIEW)
(TOP VIEW) circuit
turns off the switch to prevent damage. Recovery from a
o thermal shutdown is automatic oonce the device has
GND 1 cooled sufficiently.
8 /OC1 Internal
GND circuitry
1
8 that
OUTthe
ensures
off until valid
2 switch remains
IN
INinput2 voltage is present.
7 OUT1
7 OUT
6
OUT
*/EN2 4 Applications
5 /OC2
EN 4
5
PT7M2062(-1)/PT7M2066(-1)
PT7M2065-1
Laptop, Motherboard PC
D AND DGNUSB
PACKAGE
Bus/Self Powered Hubs DGN PACKAGE
(TOP
(TOP VIEW)
VIEW)
TV and Set-top BOX Power switch
o USB Peripherals
o
Battery-Powered
Equipment
GND 1
8 /OC1
GND 1
8
Hot-Plug Power Supplies
2
2
IN
IN
7 OUT1
7
/OC
*/EN1
3
-
IN
/EN(PI5PD2068)
OUT
1
EN(PI5PD2069)
/OC 2
GND
OUT
Power
/OC
PAD(TM)3
OUT2
IN
3
OUT
OUT
*/EN1
3
6
OUT2
IN
3
6
OUT
*/EN2
4
5
/OC2
EN
4
5
/OC
/OC PI5PD2069
3
(Top4View)/EN
Pin DescriptionPT7M2601/PT7M2065
DBV PACKAGE
Pin No.
Pin Name
Type
1
GND (TOP VIEW)
- Ground.
2, 3
4
4
5
6, 7, 8
6
Description
I Power input voltage.
I 5EnableIN
input, logic low turns on power switch.
I Enable input, logic high turns on power switch.
O Over-current, open-drain output, active-low.
O Power output voltage.
Internally connected to GND; used to heat-sink the part to the circuit board traces. Should be
- 4
/EN to GND pin
connected
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70mΩ Current-Limited, Power-Distribution Switches
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Function block diagram
See Note A
IN
CS
OUT
Current
Limit
/OC
Charge
Pump
/EN
(See Note B)
Driver
UVLO
Deglitch
Thermal
Sense
GND
Note A: Current sense
Note B: Active low(/EN)for PI5PD2068; Active high(EN) for PI5PD2069
Maximum Ratings
Storage Temperature ............................................................................. -65oC to +150oC
Operating virtual junction temperature range, TJ
EP-MSOP package ................................................................................ -40oC to +105oC
SOIC package..............................................................................................0oC to +105oC
Input Voltage range ( VI(IN)(2)) ....................................................................... -0.3V to +6V
Output Voltage range ( VO(OUT)(2)) ............................................................... -0.3V to +6V
Input Voltage range (VI(/EN), VI(EN))............................................................... -0.3V to +6V
Voltage range (VI(/OC), VI(OC)) ....................................................................... -0.3V to +6V
Continuous output current ( IO(OUT))........................................................... Internally limit
Continuous total power dissipation....................................................... SOIC-8/600mW
.......................................................................................................... EP-MSOP-8/1200mW
Electrostatic discharge (ESD) protection.......... 4kV/Human body MIL-STD-883C
Electrostatic discharge (ESD) protection............500V/Charge device model(CDM)
Note:
(1)Stresses greater than those listed under MAXIMUM
RATINGS may cause permanent damage to the device.
This is a stress rating only and functional operation of the
device at these or any other conditions above those
indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
(2)All voltages are with respect to GND.
Recommended Operating Conditions
Symbol
Description
Min
Type
Max
Unit
VI(IN)
Input Voltage
2.7
-
5.5
V
VI(/EN), VI(EN),VI(/EN), VI(EN)
Input Voltage
0
-
5.5
V
Continuous Output Current
Operating Virtual
EP-MSOP Package
Junction Temperature
SOIC Package
Range
0
-
2.1
A
-40
-
105
0
-
105
IO(OUT), IO(OUTx)
TJ
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70mΩ Current-Limited, Power-Distribution Switches
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Electrical Characteristics
Unless otherwise specified, -40°C≤TJ≤105°C for EP-MSOP Package, 0°C≤TJ≤105°C for SOIC Package, VI(IN) = 5.5V, IO = 2.1A,
VI(/EN) =0V, or VI(EN) = 5.5V.
Sym
Power Switch
Static drain-source on-state resistance, 5V
operation and 3.3V operation
RDS(on)
Static drain-source on-state resistance, 2.7V
operation(2)
tr(2)
tf
(2)
Test Conditions(1)
Description
Rise time, output
Fall time, output
Min
Typ
Max
Unit
VI(IN) = 5V or 3.3V, IO = 1.5A,
-
70
115
mΩ
VI(IN) = 2.7V, IO = 1.5A,
-
75
125
mΩ
VI(IN) = 5.5V
-
0.6
1.5
-
0.4
1
0.05
-
0.5
0.05
-
0.5
2
-
-
-
0.8
VI(IN) = 2.7V
VI(IN) = 5.5V
CL=1F,
RL=5Ω,
TJ=25°C
VI(IN) = 2.7V
ms
Enable Input /EN or EN
VIH
High-level input voltage
2.7 V ≤ VI(IN) ≤ 5.5 V
VIL
Low-level input voltage
2.7 V ≤ VI(IN) ≤ 5.5 V
II
Input current
VI(EN) = 0 V or 5.5 V
-0.5
-
0.5
ton
Turn on time
CL = 100F, RL = 5Ω
-
-
3
toff
Turn off time
CL = 100F, RL = 5Ω
-
-
10
1.6
2.1
2.6
A
2.3
2.85
3.4
A
No load on OUT,
TJ =25°C
VI(/EN)=5.5V, or
Over TJ range
VI(EN)=0V
No load on OUT,
TJ=25°C
VI(/EN) = 0V, or
Over TJ range
VI(EN)=5.5V
OUT connected to ground,
VI(/EN)=5.5V, or VI(EN)=0V
VI(OUT)=5.5V,
TJ =25°C
IN=ground
-
0.1
-
-
0.2
-
-
43
-
-
43
-
-
1
-
-
0.1
-
Low-level input voltage, IN
-
2
-
2.5
V
Hysteresis, IN
TJ=25°C
-
75
-
mV
Output low voltage
IO(/OC)=5mA
-
-
0.4
V
Off-state current
VO(/OC)=5V or 3.3V
-
-
1
A
/OC deglitch
/OC assertion or deassertion
4
12
15
ms
V
A
ms
Current Limit
IOS
Short-circuit output current
IOC-TRIP
Overcurrent trip threshold
VI(IN)=5V, OUT connected to GND,
device enabled into short-circuit
VI(IN)=5V, current ramp (≤100A/s) on
OUT
Supply Current
ISTB
Input supply current at output disable
ISS
Input supply current at output enable
Leakage current
Reverse leakage current
A
Under-Voltage Lockout
Over-Current /OC
VOL(/OC)
Thermal Shutdown(3)
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70mΩ Current-Limited, Power-Distribution Switches
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Thermal shutdown threshold
-
135
-
-
°C
Recovery from thermal shutdown
-
125
-
-
°C
Hysteresis
-
-
10
-
°C
Note:
(1) Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into
account separately.
(2) Not tested in production, specified by design.
(3) The thermal shutdown only reacts under over current conditions.
Typical Performance and Characteristics
1.
Turn On Delay and Rise Time
RL=5Ω, CL=1µF, TA=25℃
RL=5Ω, CL=1µF, TA=25℃
VI(/EN)
5V/Div
VI(/EN)
5V/Div
VO(OUT)
2V/Div
VO(OUT)
2V/Div
Time (200µs/Div)
Time (200µs/Div)
RL=5Ω, CL=100µF, TA=25℃
RL=5Ω, CL=100µF, TA=25℃
VI(/EN)
5V/Div
VI(/EN)
5V/Div
VO(OUT)
2V/Div
VO(OUT)
2V/Div
Time (200µs/Div)
Time (400µs/Div)
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2.
Over-Current /OC Response
3.
TA=25℃, RL=0.5Ω, CL=0.1µF
Output Short to Ground Then Enable
TA=25℃
VO(/OC)
2V/Div
VI(/EN)
2V/Div
IO(OUT)
2A/Div
IO(OUT)
1A/Div
Time (2ms/Div)
Time (200µs/Div)
I
4.
Inrush Current
TA=25℃, VI(IN)=5V, RL=3Ω
VI(/EN)
5V/Div
IO(OUT)
1A/Div
Time (1ms/Div)
I
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70mΩ Current-Limited, Power-Distribution Switches
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Turn On/Off Time vs. Input Voltage
Turn On Time
RL=5Ω, CL=100µF, TA=25℃
Turn Off Time
RL=5Ω, CL=100µF, TA=25℃
800
800
700
600
Turn Off Time (µs)
Turn On Time (µs)
5.
600
500
400
200
0
2
3
4
Input Voltage (V)
5
6
2
Rise and Fall Time vs. Input Voltage
Rise Time
RL=5Ω, CL=1µF, TA=25℃
800
400
600
300
400
100
0
0
3
4
Input Voltage (V)
4
Input Voltage (V)
5
6
5
6
200
200
2
3
Fall Time
RL=5Ω, CL=1µF, TA=25℃
Fall Time (µs)
Rise Time (µs)
6.
400
5
2
6
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4
Input Voltage (V)
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70mΩ Current-Limited, Power-Distribution Switches
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Input Supply Current vs. Ambient Temperature
Output Enable, TA=25℃
Output Disable, TA=25℃
60
OUT Disable Supply Current (nA)
OUT Enable Supply Current (µA)
7.
Vin=5.5V
Vin=5V
Vin=3.3V
Vin=2.7V
40
20
0
160
Vin=5.5V
Vin=5V
Vin=3.3V
Vin=2.7V
120
80
40
0
-50
0
50
100
Ambient T emperature(℃)
150
-50
0
50
100
Ambient T emperature (℃)
150
Static Drain-Source on Resistance vs. Ambient Temperature
100
On Resistance (mΩ)
8.
200
80
60
40
Vin=5V
Vin=3.3V
Vin=2.7V
20
0
-50
0
50
100
Ambient T emperature(℃)
150
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70mΩ Current-Limited, Power-Distribution Switches
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9.
Current Limit vs. Ambient Temperature
Short-circuit Output Current vs. Ambient Temperature
Threshold Trip Current vs. Input Voltage
3
Short Circuit Current (A)
Threshold Trip Current (A)
4
3
2
1
0
Vin=5.5V
Vin=5V
Vin=3.3V
Vin=2.7V
2.5
2
1.5
1
2
3
4
Input Voltage (V)
5
-50
6
0
50
100
Ambient T emperature (℃)
150
Application Information
The power switch is an N-channel MOSFET with a low RDS(on) 70mΩ resistance. Configured as a high-side switch, the power
switch prevents leakage current flow from output to input when chip disabled. The power switch supplies a maximum continuous
current up to 2.1A.
Power-Supply Considerations
PI5PD2068
POWER SUPPLY
2.7V to 5.5V
0.1µF
IN
OUT
IN
OUT
LOAD
0.1µF
22µF
OUT
/OC
/EN
GND
Figure 1 Typical Application
A 0.01μF to 1μF ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value
electrolytic capacitor on the output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply
transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01μF to 1μF ceramic capacitor
improves the immunity of the device to short-circuit transients.
Enable (/EN or EN)
The enable pin is logic enable & disables the power switch, which is compatible with CMOS and TTL logic levels. The supply
current is reduced to less than 1μA when a logic high is present on /EN, or when a logic low is present on EN. A logic zero input
on /EN, or a logic high input on EN restores the bias to the driver and control circuits and turns the switch on
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70mΩ Current-Limited, Power-Distribution Switches
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/OC Output
The /OC open-drain output is asserted (active low) when an over current or over temperature condition is asserted. The output
remains asserted until the over current or over temperature condition is removed. The /OC pin requires a pull-up resistor, this
resistor should be larger to reduce energy drain. A 100KΩ pull-up resistor works well for most applications. In the case of an
over-current or short-circuit conditions, /OC will be asserted only after response delay time, Td, 14ms have elapsed. If an over
temperature shutdown occurs, the /OC is asserted instantaneously.
V+
PI5PD2068
IN
/OC
IN
OUT
GND
OUT
/EN
OUT
Rpullup
Figure 2 Typical Circuit for the /OC Pin
Under-Voltage Lockout (UVLO)
A voltage sense circuit monitors the input voltage, an under voltage lockout ensures that the power switch is in the off state at
power up. When the input voltage is below approximately 2V, a control signal turns off the power switch.
Power Dissipation Calculation
The low RDS(on) resistance on the N-channel MOSFET allows the small surface-mount packages to pass large currents. The thermal
resistances of these packages are high compared to those of power packages. Begin by determining the RDS(on) of the N-channel
MOSFET relative to the input voltage and operating temperature. Using this value, the power dissipation per switch can be
calculated by:
• PD = RDS(on)× I
2
Multiply this number by the number of switches being used. This step renders the total power dissipation from the N-channel
MOSFET.
Finally, calculate the junction temperature:
• TJ = PD x RθJA + TA
Where:
• TA= Ambient temperature °C
• RθJA = Thermal resistance
• PD = Total power dissipation based on number of switches being used.
Thermal Protection
Thermal protection prevents damage to the IC when heavy-overload or short-circuit faults are present for extended periods of time.
The PI5PD2068/69 implements a thermal protection circuitry to monitor the operating junction temperature of the power
distribution switch. In an over current or short-circuit condition cause to the junction temperature rises, when the die temperature
rises to approximately 135°C due to over current conditions, the internal thermal protection circuitry turns off the switch, thus
preventing the device from damage. Hysteresis is built into the thermal protection circuitry, and after the device has cooled
approximately 10 degrees, the switch turns back on. The switch continues to cycle off and on until the fault is removed. The opendrain false reporting output (/OC) is asserted (active low) when an over temperature shutdown or over current occurs.
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70mΩ Current-Limited, Power-Distribution Switches
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Universal Serial Bus (USB) Application
The universal serial bus (USB) interface is a 480Mb/s or 12Mb/s, multiplexed serial bus designed for low-to-medium bandwidth
PC peripherals (e.g., keyboards, printers, scanners, and mice). The four-wire USB interface is conceived for dynamic attachdetach (hot plug-unplug) of peripherals. Two lines are provided for differential data, and two lines are provided for 5V power
distribution.
USB data is a 3.3V level signal, but power is distributed at 5V to allow for voltage drops in cases where power is distributed
through more than one hub across long cables. Each function must provide its own regulated 3.3V from the 5V input or its own
internal power supply.
The USB specification defines the following five classes of devices, each differentiated by power-consumption requirements:
• Hosts/self-powered hubs (SPH)
• Bus-powered hubs (BPH)
• Low-power, bus-powered functions
• High-power, bus-powered functions
• Self-powered functions
SPHs and BPHs distribute data and power to downstream functions. The PI5PD2061/65 has higher current capability than
required by one USB port; so, it can be used on the host side and supplies power to multiple downstream ports or functions.
Host/Self-Powered and Bus-Powered Hubs
Hosts and SPHs have a local power supply that powers the embedded functions and the downstream ports (see Figure 3). This
power supply must provide from 5.25V to 4.75V to the board side of the downstream connection under full-load and no-load
conditions. Hosts and SPHs are required to have current-limit protection and must report over current conditions to the USB
controller. Typical SPHs are desktop PCs, monitors, printers, and stand-alone hubs.
POWER SUPPLY
3.3V 5V
Downstream
USB Ports
PI5PD2068
D+
2, 3
Vbus
OUT
IN
0.1µF
USB
Controller
5
D-
6, 7, 8
0.1µF
120µF
GND
/OC
4
/EN
GND
1
Figure 3 Typical Four-Port USB Host/Self-Powered Hub
BPHs obtain all power from upstream ports and often contain an embedded function. The hubs are required to power up with less
than one unit load. The BPH usually has one embedded function, and power is always available to the controller of the hub. If the
embedded function and hub require more than 100mA on power up, the power to the embedded function may need to be kept off
until enumeration is completed. This can be accomplished by removing power or by shutting off the clock to the embedded
function. Power switching the embedded function is not necessary if the aggregate power draw for the function and controller is
less than one unit load. The total current drawn by the bus-powered device is the sum of the current to the controller, the
embedded function, and the downstream ports, and it is limited to 500mA from an upstream port.
2013-07-0009
PT0332-4
10
07/31/13
PI5PD2068/2069
70mΩ Current-Limited, Power-Distribution Switches
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Mechanical Information
WE (Lead free and Green SOIC-8)
Unit: mm
2013-07-0009
PT0332-4
11
07/31/13
PI5PD2068/2069
70mΩ Current-Limited, Power-Distribution Switches
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UEE (Lead free and Green EP-MSOP-8)
Ordering Information
Part Number
Package Code
Package
PI5PD2068WE
W
Lead free and Green 8-Pin SOIC
PI5PD2068UEE
UE
Lead free and Green 8-Pin EP-MSOP
PI5PD2069WE
W
Lead free and Green 8-Pin SOIC
PI5PD2069UEE
UE
Lead free and Green 8-Pin EP-MSOP
Notes:
E = Pb-free and Green
Adding X Suffix= Tape/Reel
Function comparison table
Part Number
Enable
Recommended maximum
continuous load current
Typical short-circuit
current limit at 25ºC
Number of switches
PI5PD2068
PI5PD2069
Active Low
Active High
2.1A
2.1A
Single
Single
Pericom Semiconductor Corporation 1-800-435-2336 www.pericom.com
Pericom reserves the right to make changes to its products or specifications at any time, without notice, in order to improve design or performance and to supply
the best possible product. Pericom does not assume any responsibility for use of any circuitry described other than the circuitry embodied in Pericom product. The
company makes no representations that circuitry described herein is free from patent infringement or other rights, of Pericom.
2013-07-0009
PT0332-4
12
07/31/13
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