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PI7C9X112SLFDEX

PI7C9X112SLFDEX

  • 厂商:

    BCDSEMI(美台)

  • 封装:

    LQFP128

  • 描述:

    IC INTERFACE SPECIALIZED 128LQFP

  • 数据手册
  • 价格&库存
PI7C9X112SLFDEX 数据手册
PI7C9X112SL PCI Express-to-PCI Bridge Datasheet January 2021 Revision 5 1545 Barber Lane Milpitas, CA 95035 Telephone: 408-232-9100 FAX: 408-434-1040 Internet: http://www.diodes.com Document Number DS40299 Rev 5-2 PI7C9X112SL PR IMPORTANT NOTICE 1. DIODES INCORPORATED AND ITS SUBSIDIARIES (“DIODES”) MAKE NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO ANY INFORMATION CONTAINED IN THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 2. The Information contained herein is for informational purpose only and is provided only to illustrate the operation of Diodes products described herein and application examples. Diodes does not assume any liability arising out of the application or use of this document or any product described herein. This document is intended for skilled and technically trained engineering customers and users who design with Diodes products. Diodes products may be used to facilitate safety-related applications; however, in all instances customers and users are responsible for (a) selecting the appropriate Diodes products for their applications, (b) evaluating the suitability of the Diodes products for their intended applications, (c) ensuring their applications, which incorporate Diodes products, comply the applicable legal and regulatory requirements as well as safety and functional-safety related standards, and (d) ensuring they design with appropriate safeguards (including testing, validation, quality control techniques, redundancy, malfunction prevention, and appropriate treatment for aging degradation) to minimize the risks associated with their applications. 3. Diodes assumes no liability for any application-related information, support, assistance or feedback that may be provided by Diodes from time to time. Any customer or user of this document or products described herein will assume all risks and liabilities associated with such use, and will hold Diodes and all companies whose products are represented herein or on Diodes’ websites, harmless against all damages and liabilities. 4. Products described herein may be covered by one or more United States, international or foreign patents and pending patent applications. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks and trademark applications. Diodes does not convey any license under any of its intellectual property rights or the rights of any third parties (including third parties whose products and services may be described in this document or on Diodes’ website) under this document. 5. Diodes products are provided subject to Diodes’ Standard Terms and Conditions of Sale (https://www.diodes.com/about/company/terms-andconditions/terms-and-conditions-of-sales/) or other applicable terms. This document does not alter or expand the applicable warranties provided by Diodes. Diodes does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. 6. Diodes products and technology may not be used for or incorporated into any products or systems whose manufacture, use or sale is prohibited under any applicable laws and regulations. Should customers or users use Diodes products in contravention of any applicable laws or regulations, or for any unintended or unauthorized application, customers and users will (a) be solely responsible for any damages, losses or penalties arising in connection therewith or as a result thereof, and (b) indemnify and hold Diodes and its representatives and agents harmless against any and all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim relating to any noncompliance with the applicable laws and regulations, as well as any unintended or unauthorized application. 7. While efforts have been made to ensure the information contained in this document is accurate, complete and current, it may contain technical inaccuracies, omissions and typographical errors. Diodes does not warrant that information contained in this document is error-free and Diodes is under no obligation to update or otherwise correct this information. Notwithstanding the foregoing, Diodes reserves the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes. 8. Any unauthorized copying, modification, distribution, transmission, display or other use of this document (or any portion hereof) is prohibited. Diodes assumes no responsibility for any losses incurred by the customers or users or any third parties arising from any such unauthorized use. Copyright © 2021 Diodes Incorporated www.diodes.com PI7C9X112SL Document Number DS40299 Rev 5-2 Page 2 of 76 www.diodes.com January 2021 © Diodes Incorporated PI7C9X112SL PR REVISION HISTORY DATE REVISION # 09/27/2008 04/28/2009 09/10/2009 11/10/2009 02/09/2010 04/21/2016 0.2 0.3 1.0 1.1 1.2 1.3 01/25/2017 1.4 09/27/2017 2 04/21/2020 3 07/03/2020 01/18/2021 4 5 DESCRIPTION Preliminary release of PI7C9X112SL datasheet Revised General Features and Part Ordering Info Production release of PI7C9X112SL datasheet Updated Section 2.2 PCI Express Signal Section Removed reverse mode related description Updated Section 2.5 JTAG Boundary Scan Signals Updated Logo Added Table 14-4 PCI Express Interface - Differential Transmitter (TX) Output Characteristics Added Table 14-5 PCI Express Interface - Differential Receiver (RX) Input Characteristics Added Section 14.4 Operating Ambient Temperature Updated Section 2.8 Pin Assignments Updated Section 14.1 Absolute Maximum Ratings Updated Section 14.2 DC Specifications Added Section 14 Power Sequencing Updated Section 17 Ordering Information Revision numbering system changed to whole number Updated Section 14 Power Sequencing Updated Figure 16-1 Package Outline Drawing Added Section 14.2 Power-Off Sequence Added Figure 16-2 Part Marking 5.3.87 XPIP Configuration Register 2 – OFFSET D4h Updated Section 14 Power Sequencing PREFACE The datasheet of PI7C9X112SL will be enhanced periodically when updated information is available. The technical information in this datasheet is subject to change without notice. This document describes the functionalities of PI7C9X112SL (PCI Express Bridge) and provides technical information for designers to design their hardware using PI7C9X112SL. PI7C9X112SL Document Number DS40299 Rev 5-2 Page 3 of 76 www.diodes.com January 2021 © Diodes Incorporated PI7C9X112SL PR TABLE OF CONTENTS 1 INTRODUCTION ........................................................................................................................ 10 1.1 1.2 1.3 2 PIN DEFINITIONS ...................................................................................................................... 12 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 3 FUNCTIONAL MODE SELECTION .................................................................................... 16 PIN STRAPPING ................................................................................................................... 16 FORWARD (PCIE TO PCI) BRIDGING ................................................................................. 17 4.1 4.2 5 SIGNAL TYPES ..................................................................................................................... 12 PCI EXPRESS SIGNALS ...................................................................................................... 12 PCI SIGNALS ........................................................................................................................ 12 MODE SELECT AND STRAPPING SIGNALS ................................................................... 14 JTAG BOUNDARY SCAN SIGNALS .................................................................................. 14 MISCELLANEOUS SIGNALS ............................................................................................. 14 POWER AND GROUND PINS ............................................................................................. 14 PIN ASSIGNMENTS ............................................................................................................. 15 MODE SELECTION AND PIN STRAPPING.......................................................................... 16 3.1 3.2 4 PCI EXPRESS FEATURES ................................................................................................... 10 PCI FEATURES ..................................................................................................................... 11 GENERAL FEATURES ......................................................................................................... 11 TLP STRUCTURE ................................................................................................................. 17 VIRTUAL ISOCHRONOUS OPERATION .......................................................................... 18 CONFIGURATION REGISTER ACCESS............................................................................... 19 5.1 5.2 5.3 CONFIGURATION REGISTER MAP .................................................................................. 19 PCI EXPRESS EXTENDED CAPABILITY REGISTER MAP ............................................ 21 PCI CONFIGURATION REGISTERS .................................................................................. 22 5.3.1 5.3.2 5.3.3 5.3.4 5.3.5 5.3.6 5.3.7 5.3.8 5.3.9 5.3.10 5.3.11 5.3.12 5.3.13 5.3.14 5.3.15 5.3.16 5.3.17 5.3.18 5.3.19 5.3.20 VENDOR ID – OFFSET 00h ................................................................................................................ 23 DEVICE ID – OFFSET 00h .................................................................................................................. 23 COMMAND REGISTER – OFFSET 04h .............................................................................................. 23 PRIMARY STATUS REGISTER – OFFSET 04h ................................................................................... 24 REVISION ID REGISTER – OFFSET 08h ........................................................................................... 24 CLASS CODE REGISTER – OFFSET 08h ........................................................................................... 24 CACHE LINE SIZE REGISTER – OFFSET 0Ch .................................................................................. 25 PRIMARY LATENCY TIMER REGISTER – OFFSET 0Ch .................................................................. 25 PRIMARY HEADER TYPE REGISTER – OFFSET 0Ch ...................................................................... 25 RESERVED REGISTERS – OFFSET 10h TO 17h ................................................................................ 25 PRIMARY BUS NUMBER REGISTER – OFFSET 18h ........................................................................ 25 SECONDARY BUS NUMBER REGISTER – OFFSET 18h .................................................................. 25 SUBORDINATE BUS NUMBER REGISTER – OFFSET 18h .............................................................. 25 SECONDARY LATENCY TIME REGISTER – OFFSET 18h................................................................ 26 I/O BASE REGISTER – OFFSET 1Ch .................................................................................................. 26 I/O LIMIT REGISTER – OFFSET 1Ch ................................................................................................. 26 SECONDARY STATUS REGISTER – OFFSET 1Ch ............................................................................ 26 MEMORY BASE REGISTER – OFFSET 20h ....................................................................................... 27 MEMORY LIMIT REGISTER – OFFSET 20h ...................................................................................... 27 PREFETCHABLE MEMORY BASE REGISTER – OFFSET 24h ......................................................... 27 PI7C9X112SL Document Number DS40299 Rev 5-2 Page 4 of 76 www.diodes.com January 2021 © Diodes Incorporated 5.3.21 5.3.22 5.3.23 5.3.24 5.3.25 5.3.26 5.3.27 5.3.28 5.3.29 5.3.30 5.3.31 5.3.32 5.3.33 5.3.34 5.3.35 5.3.36 5.3.37 5.3.38 5.3.39 5.3.40 5.3.41 5.3.42 5.3.43 5.3.44 5.3.45 5.3.46 5.3.47 5.3.48 5.3.49 5.3.50 5.3.51 5.3.52 5.3.53 5.3.54 5.3.55 5.3.56 5.3.57 5.3.58 5.3.59 5.3.60 5.3.61 5.3.62 5.3.63 5.3.64 5.3.65 5.3.66 5.3.67 5.3.68 5.3.69 5.3.70 5.3.71 5.3.72 5.3.73 5.3.74 PI7C9X112SL PR PREFETCHABLE MEMORY LIMIT REGISTER – OFFSET 24h ........................................................ 27 PREFETCHABLE BASE UPPER 32-BIT REGISTER – OFFSET 28h................................................. 27 PREFETCHABLE LIMIT UPPER 32-BIT REGISTER – OFFSET 2Ch ............................................... 27 I/O BASE UPPER 16-BIT REGISTER – OFFSET 30h ......................................................................... 28 I/O LIMIT UPPER 16-BIT REGISTER – OFFSET 30h........................................................................ 28 CAPABILITY POINTER – OFFSET 34h .............................................................................................. 28 EXPANSION ROM BASE ADDRESS REGISTER – OFFSET 38h ....................................................... 28 INTERRUPT LINE REGISTER – OFFSET 3Ch ................................................................................... 28 INTERRUPT PIN REGISTER – OFFSET 3Ch ..................................................................................... 28 BRIDGE CONTROL REGISTER – OFFSET 3Ch ................................................................................ 28 PCI DATA BUFFERING CONTROL REGISTER – OFFSET 40h ....................................................... 29 CHIP CONTROL 0 REGISTER – OFFSET 40h ................................................................................... 31 RESERVED REGISTER – OFFSET 44h............................................................................................... 32 ARBITER ENABLE REGISTER – OFFSET 48h ................................................................................... 32 ARBITER MODE REGISTER – OFFSET 48h ...................................................................................... 33 ARBITER PRIORITY REGISTER – OFFSET 48h ................................................................................ 33 RESERVED REGISTERS – OFFSET 4Ch ............................................................................................ 34 MEMORY READSMART BASE LOWER 32-Bit REGISTER 1 – OFFSET 50h.................................... 34 MEMORY READSMART BASE UPPER 32-Bit REGISTER 1 – OFFSET 54h .................................... 34 MEMORY READSMART RANGE CONTROL REGISTER 1 – OFFSET 58h ...................................... 34 MEMORY READSMART BASE LOWER 32-Bit REGISTER 2 – OFFSET 5Ch ................................... 34 MEMORY READSMART BASE UPPER 32-Bit REGISTER 2 – OFFSET 60h .................................... 35 MEMORY READSMART RANGE SIZE REGISTER 2 – OFFSET 64h ................................................ 35 EXPRESS TRANSMITTER/RECEIVER REGISTER – OFFSET 68h .................................................... 35 UPSTREAM MEMORY WRITE FRAGMENT CONTROL REGISTER – OFFSET 68h ....................... 36 RESERVED REGISTER – OFFSET 6Ch .............................................................................................. 36 EEPROM AUTOLOAD CONTROL/STATUS REGISTER – OFFSET 70h ........................................... 36 RESERVED REGISTER – OFFSET 74h............................................................................................... 37 GPIO DATA AND CONTROL REGISTER – OFFSET 78h .................................................................. 37 RESERVED REGISTER – OFFSET 7Ch .............................................................................................. 37 PCI-X CAPABILITY ID REGISTER – OFFSET 80h ............................................................................ 37 NEXT CAPABILITY POINTER REGISTER – OFFSET 80h ................................................................ 37 PCI-X SECONDARY STATUS REGISTER – OFFSET 80h .................................................................. 38 PCI-X BRIDGE STATUS REGISTER – OFFSET 84h .......................................................................... 38 UPSTREAM SPLIT TRANSACTION REGISTER – OFFSET 88h ........................................................ 39 DOWNSTREAM SPLIT TRANSACTION REGISTER – OFFSET 8Ch ................................................. 39 POWER MANAGEMENT ID REGISTER – OFFSET 90h .................................................................... 39 NEXT CAPABILITY POINTER REGISTER – OFFSET 90h ................................................................ 40 POWER MANAGEMENT CAPABILITY REGISTER – OFFSET 90h .................................................. 40 POWER MANAGEMENT CONTROL AND STATUS REGISTER – OFFSET 94h .............................. 40 PCI-TO-PCI SUPPORT EXTENSION REGISTER – OFFSET 94h ..................................................... 41 RESERVED REGISTERS – OFFSET 98h – 9Ch .................................................................................. 41 CAPABILITY ID REGISTER – OFFSET A0h ....................................................................................... 41 NEXT POINTER REGISTER – OFFSET A0h....................................................................................... 41 SLOT NUMBER REGISTER – OFFSET A0h ....................................................................................... 41 CHASSIS NUMBER REGISTER – OFFSET A0h ................................................................................. 41 SECONDARY CLOCK AND CLKRUN CONTROL REGISTER – OFFSET A4h ................................. 42 CAPABILITY ID REGISTER – OFFSET A8h ....................................................................................... 43 NEXT POINTER REGISTER – OFFSET A8h....................................................................................... 43 RESERVED REGISTER – OFFSET A8h .............................................................................................. 43 SUBSYSTEM VENDOR ID REGISTER – OFFSET ACh ...................................................................... 43 SUBSYSTEM ID REGISTER – OFFSET ACh ...................................................................................... 43 PCI EXPRESS CAPABILITY ID REGISTER – OFFSET B0h .............................................................. 43 NEXT CAPABILITY POINTER REGISTER – OFFSET B0h ................................................................ 43 PI7C9X112SL Document Number DS40299 Rev 5-2 Page 5 of 76 www.diodes.com January 2021 © Diodes Incorporated 5.3.75 5.3.76 5.3.77 5.3.78 5.3.79 5.3.80 5.3.81 5.3.82 5.3.83 5.3.84 5.3.85 5.3.86 5.3.87 5.3.88 5.3.89 5.3.90 5.3.91 5.3.92 5.3.93 5.3.94 5.3.95 5.3.96 5.3.97 5.3.98 5.3.99 5.3.100 5.3.101 5.3.102 5.3.103 5.3.104 5.3.105 5.3.106 5.3.107 5.3.108 5.3.109 5.3.110 5.3.111 5.3.112 5.3.113 5.3.114 5.3.115 5.3.116 5.3.117 5.3.118 5.3.119 5.3.120 5.3.121 5.3.122 5.3.123 5.3.124 5.3.125 5.3.126 5.3.127 5.3.128 PI7C9X112SL PR PCI EXPRESS CAPABILITY REGISTER – OFFSET B0h.................................................................... 43 DEVICE CAPABILITY REGISTER – OFFSET B4h ............................................................................. 44 DEVICE CONTROL REGISTER – OFFSET B8h................................................................................. 45 DEVICE STATUS REGISTER – OFFSET B8h ..................................................................................... 46 LINK CAPABILITY REGISTER – OFFSET BCh.................................................................................. 46 LINK CONTROL REGISTER – OFFSET C0h ...................................................................................... 46 LINK STATUS REGISTER – OFFSET C0h .......................................................................................... 47 SLOT CAPABILITY REGISTER – OFFSET C4h ................................................................................. 47 SLOT CONTROL REGISTER – OFFSET C8h ..................................................................................... 48 SLOT STATUS REGISTER – OFFSET C8h ......................................................................................... 48 XPIP CONFIGURATION REGISTER 0 – OFFSET CCh ..................................................................... 48 XPIP CONFIGURATION REGISTER 1 – OFFSET D0h ..................................................................... 48 XPIP CONFIGURATION REGISTER 2 – OFFSET D4h ..................................................................... 49 L0 ENTER L1 WAITING PERIOD COUNTER – OFFSET D4h .......................................................... 49 CAPABILITY ID REGISTER – OFFSET D8h ...................................................................................... 49 NEXT POINTER REGISTER – OFFSET D8h ...................................................................................... 49 VPD REGISTER – OFFSET D8h ......................................................................................................... 49 VPD DATA REGISTER – OFFSET DCh .............................................................................................. 50 RESERVED REGISTERS – OFFSET E0h – ECh ................................................................................. 50 MESSAGE SIGNALED INTERRUPTS ID REGISTER – F0h ............................................................... 50 NEXT CAPABILITIES POINTER REGISTER – F0h ............................................................................ 50 MESSAGE CONTROL REGISTER – OFFSET F0h ............................................................................. 50 MESSAGE ADDRESS REGISTER – OFFSET F4h .............................................................................. 50 MESSAGE UPPER ADDRESS REGISTER – OFFSET F8h ................................................................. 51 MESSAGE DATA REGISTER – OFFSET FCh..................................................................................... 51 ADVANCE ERROR REPORTING CAPABILITY ID REGISTER – OFFSET 100h .............................. 51 ADVANCE ERROR REPORTING CAPABILITY VERSION REGISTER – OFFSET 100h .................. 51 NEXT CAPABILITY OFFSET REGISTER – OFFSET 100h ................................................................ 51 UNCORRECTABLE ERROR STATUS REGISTER – OFFSET 104h ................................................... 51 UNCORRECTABLE ERROR MASK REGISTER – OFFSET 108h ...................................................... 51 UNCORRECTABLE ERROR SEVERITY REGISTER – OFFSET 10Ch ............................................... 52 CORRECTABLE ERROR STATUS REGISTER – OFFSET 110h ......................................................... 52 CORRECTABLE ERROR MASK REGISTER – OFFSET 114h ............................................................ 52 ADVANCED ERROR CAPABILITIES AND CONTROL REGISTER – OFFSET 118h ........................ 53 HEADER LOG REGISTER 1 – OFFSET 11Ch .................................................................................... 53 HEADER LOG REGISTER 2 – OFFSET 120h ..................................................................................... 53 HEADER LOG REGISTER 3 – OFFSET 124h ..................................................................................... 53 HEADER LOG REGISTER 4 – OFFSET 128h ..................................................................................... 53 SECONDARY UNCORRECTABLE ERROR STATUS REGISTER – OFFSET 12Ch ........................... 53 SECONDARY UNCORRECTABLE ERROR MASK REGISTER – OFFSET 130h ............................... 54 SECONDARY UNCORRECTABLE ERROR SEVERITY REGISTER – OFFSET 134h ........................ 54 SECONDARY ERROR CAPABILITY AND CONTROL REGISTER – OFFSET 138h.......................... 55 SECONDARY HEADER LOG REGISTER – OFFSET 13Ch – 148h.................................................... 55 RESERVED REGISTER – OFFSET 14Ch ............................................................................................ 55 VC CAPABILITY ID REGISTER – OFFSET 150h ............................................................................... 55 VC CAPABILITY VERSION REGISTER – OFFSET 150h ................................................................... 55 NEXT CAPABILITY OFFSET REGISTER – OFFSET 150h ................................................................ 56 PORT VC CAPABILITY REGISTER 1 – OFFSET 154h ...................................................................... 56 PORT VC CAPABILITY REGISTER 2 – OFFSET 158h ...................................................................... 56 PORT VC CONTROL REGISTER – OFFSET 15Ch............................................................................. 56 PORT VC STATUS REGISTER – OFFSET 15Ch ................................................................................. 56 VC0 RESOURCE CAPABILITY REGISTER – OFFSET 160h ............................................................. 56 VC0 RESOURCE CONTROL REGISTER – OFFSET 164h ................................................................. 56 VC0 RESOURCE STATUS REGISTER – OFFSET 168h ..................................................................... 57 PI7C9X112SL Document Number DS40299 Rev 5-2 Page 6 of 76 www.diodes.com January 2021 © Diodes Incorporated 5.3.129 5.3.130 5.3.131 5.3.132 5.3.133 PI7C9X112SL PR RESERVED REGISTERS – OFFSET 16Ch – 300h .............................................................................. 57 EXTRA GPI/GPO DATA AND CONTROL REGISTER – OFFSET 304h............................................. 57 RESERVED REGISTERS – OFFSET 308h – 30Ch .............................................................................. 57 REPLAY AND ACKNOWLEDGE LATENCY TIMERS – OFFSET 310h ............................................. 57 RESERVED REGISTERS – OFFSET 314h – FFCh ............................................................................. 57 6 GPIO PINS AND SM BUS ADDRESS....................................................................................... 58 7 CLOCK SCHEME ....................................................................................................................... 59 8 INTERRUPTS .............................................................................................................................. 62 9 EEPROM (I2C) INTERFACE AND SYSTEM MANAGEMENT BUS ................................. 63 9.1 9.2 9.3 EEPROM (I2C) INTERFACE ................................................................................................ 63 SYSTEM MANAGEMENT BUS .......................................................................................... 63 EEPROM AUTOLOAD CONFIGURATION ....................................................................... 63 10 HOT PLUG OPERATION .......................................................................................................... 65 11 RESET SCHEME......................................................................................................................... 66 12 IEEE 1149.1 COMPATIBLE JTAG CONTROLLER ............................................................. 67 12.1 12.2 12.3 12.4 12.5 INSTRUCTION REGISTER .................................................................................................. 67 BYPASS REGISTER ............................................................................................................. 67 DEVICE ID REGISTER ......................................................................................................... 67 BOUNDARY SCAN REGISTER .......................................................................................... 68 JTAG BOUNDARY SCAN REGISTER ORDER ................................................................. 68 13 POWER MANAGEMENT .......................................................................................................... 69 14 POWER SEQUENCING ............................................................................................................. 70 14.1 14.2 15 INITIAL POWER-UP (G3 TO L0) ......................................................................................... 70 POWER-OFF SEQUENCE .................................................................................................... 71 ELECTRICAL AND TIMING SPECIFICATIONS ................................................................ 72 15.1 15.2 15.3 15.4 ABSOLUTE MAXIMUM RATINGS .................................................................................... 72 DC SPECIFICATIONS .......................................................................................................... 72 AC SPECIFICATIONS .......................................................................................................... 73 OPERATING AMBIENT TEMPERATURE ......................................................................... 74 16 PACKAGE INFORMATION ..................................................................................................... 75 17 ORDERING INFORMATION ................................................................................................... 76 PI7C9X112SL Document Number DS40299 Rev 5-2 Page 7 of 76 www.diodes.com January 2021 © Diodes Incorporated PI7C9X112SL PR TABLE OF FIGURES FIGURE 1-1 PI7C9X112SL TOPOLOGY................................................................................................... 10 FIGURE 4-1 FORWARD BRIDGING ............................................................................................................ 17 FIGURE 14-3 INITIAL POWER-UP .............................................................................................................. 70 FIGURE 15-1 PCI SIGNAL TIMING CONDITIONS ....................................................................................... 73 FIGURE 16-1 PACKAGE OUTLINE DRAWING ............................................................................................ 75 FIGURE 16-2 PART MARKING .................................................................................................................. 75 LIST OF TABLES TABLE 2-1 PIN ASSIGNMENTS.................................................................................................................. 15 TABLE 3-1 MODE SELECTION .................................................................................................................. 16 TABLE 3-2 PIN STRAPPING ....................................................................................................................... 16 TABLE 4-1 TLP FORMAT ......................................................................................................................... 17 TABLE 5-1 CONFIGURATION REGISTER MAP (00H – FFH) ....................................................................... 19 TABLE 5-2 PCI EXPRESS EXTENDED CAPABILITY REGISTER MAP (100H – FFFH) .................................. 21 TABLE 6-1 SM BUS DEVICE ID STRAPPING ............................................................................................. 58 TABLE 8-1 PCI INTERRUPT TO PCIE INTERRUPT MESSAGE MAPPING ..................................................... 62 TABLE 12-1 INSTRUCTION REGISTER CODES ........................................................................................... 67 TABLE 12-2 JTAG DEVICE ID REGISTER.................................................................................................. 67 TABLE 12-3 JTAG BOUNDARY SCAN REGISTER DEFINITION .................................................................. 68 TABLE 14-1 POWER SEQUENCING AND RESET SIGNAL TIMINGS .............................................................. 71 TABLE 15-1 ABSOLUTE MAXIMUM RATINGS ........................................................................................... 72 TABLE 15-2 DC ELECTRICAL CHARACTERISTICS .................................................................................... 72 TABLE 15-3 PCI BUS TIMING PARAMETERS ............................................................................................ 73 TABLE 15-4 PCI EXPRESS INTERFACE - DIFFERENTIAL TRANSMITTER (TX) OUTPUT CHARACTERISTICS73 TABLE 15-5 PCI EXPRESS INTERFACE - DIFFERENTIAL RECEIVER (RX) INPUT CHARACTERISTICS ......... 74 TABLE 15-6 OPERATING AMBIENT TEMPERATURE .................................................................................. 74 PI7C9X112SL Document Number DS40299 Rev 5-2 Page 8 of 76 www.diodes.com January 2021 © Diodes Incorporated PI7C9X112SL PR This page intentionally left blank. PI7C9X112SL Document Number DS40299 Rev 5-2 Page 9 of 76 www.diodes.com January 2021 © Diodes Incorporated PI7C9X112SL PR 1 INTRODUCTION PI7C9X112SL is a PCIe-to-PCI bridge. PI7C9X112SL is compliant with the PCI Express Base Specification, Revision 1.1, the PCI Express Card Electromechanical Specification, Revision 1.1, the PCI Local Bus Specification, Revision 3.0 and PCI Express to PCI Bridge Specification, Revision 1.0. PI7C9X112SL supports forward transparent mode operation. PI7C9X112SL has an x1 PCI Express upstream port and a 32-bit PCI downstream port. The 32-bit PCI downstream port is 66MHz capable (see figure 1-1). PI7C9X112SL configuration registers are backward compatible with existing PCI bridge software and firmware. No modification of PCI bridge software and firmware is needed for the original operation. Figure 1-1 PI7C9X112SL Topology Tx Rx x1 PCI Express Port PI7C9X112SL PCI Device PCI Device PCI Device PCI Device PCI 32bit / 66MHz Bus PCI Device 1.1 PCI Device PCI Device PCI Device PCI EXPRESS FEATURES             Compliant with PCI Express Base Specification, Revision 1.1 Compliant with PCI Express Card Electromechanical Specification, Revision 1.1 Compliant with PCI Express to PCI/PCI-X Bridge Specification, Revision 1.0 Physical Layer interface (x1 link with 2.5Gb/s data rate) Lane polarity toggle Virtual Isochronous support (upstream TC1-7 generation, downstream TC1-7 mapping) ASPM support Beacon support CRC (16-bit), LCRC (32-bit) ECRC and advanced error reporting PRBS (Pseudo Random Bit Sequencing) generator/checker for chip testing Maximum payload size to 512 bytes PI7C9X112SL Page 10 of 76 January 2021 Document Number DS40299 Rev 5-2 www.diodes.com © Diodes Incorporated PI7C9X112SL PR 1.2 PCI FEATURES           1.3 Compliant with PCI Local Bus Specification, Revision 3.0 Compliant with PCI-to-PCI Bridge Architecture Specification, Revision 1.2 Compliant with PCI Bus PM Interface Specification, Revision 1.1 Compliant with PCI Hot-Plug Specification, Revision 1.1 Compliant with PCI Mobile Design Guide, Version 1.1 3.3V PCI signaling with 5V I/O tolerance Provides two level arbitration support for eight PCI Bus masters using external 4-to-8 de-mux circuit (ie: 74LVC138A). 16-bit address decode for VGA Subsystem Vendor and Subsystem Device IDs support PCI INT interrupt or MSI Function support GENERAL FEATURES               Compliant with Advanced Configuration and Power Interface Specification (ACPI), Revision 2.0b Compliant with System Management (SM) Bus, Version 2.0 Forward bridging (PCI Express as primary bus, PCI as secondary bus) Transparent mode support GPIO support (4 bi-directional pins) Power Management (including ACPI, CLKRUN_L,CLKREQ_L, PCI_PM) EEPROM (I2C) Interface SM Bus Interface Auxiliary powers (VAUX, VDDAUX, VDDCAUX) support Power consumption less than 0.45 Watt in typical condition Industrial temperature range (-40C to 85C) Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative. https://www.diodes.com/quality/product-definitions/ Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain
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