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PI7C9X2G612GPNJEX

PI7C9X2G612GPNJEX

  • 厂商:

    BCDSEMI(美台)

  • 封装:

    LBGA196

  • 描述:

    IC INTFACE SPECIALIZED 196LBGA

  • 详情介绍
  • 数据手册
  • 价格&库存
PI7C9X2G612GPNJEX 数据手册
PI7C9X2G612GP PCI EXPRESS GEN 2 PACKET SWITCH 6-Port/ 12-Lane PCI Express Gen 2 Switch Green Package Family DATASHEET REVISION 7 August 2022 1545 Barber Lane Milpitas, CA 95035 Telephone: 408-232-9100 FAX: 408-434-1040 Internet: http://www.diodes.com Document Number DS40211 Rev 7-2 PI7C9X2G612GP IMPORTANT NOTICE 1. DIODES INCORPORATED (Diodes) AND ITS SUBSIDIARIES MAKE NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO ANY INFORMATION CONTAINED IN THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 2. The Information contained herein is for informational purpose only and is provided only to illustrate the operation of Diodes’ products described herein and application examples. Diodes does not assume any liability arising out of the application or use of this document or any product described herein. This document is intended for skilled and technically trained engineering customers and users who design with Diodes’ products. Diodes’ products may be used to facilitate safety-related applications; however, in all instances customers and users are responsible for (a) selecting the appropriate Diodes products for their applications, (b) evaluating the suitability of Diodes’ products for their intended applications, (c) ensuring their applications, which incorporate Diodes’ products, comply the applicable legal and regulatory requirements as well as safety and functional-safety related standards, and (d) ensuring they design with appropriate safeguards (including testing, validation, quality control techniques, redundancy, malfunction prevention, and appropriate treatment for aging degradation) to minimize the risks associated with their applications. 3. Diodes assumes no liability for any application-related information, support, assistance or feedback that may be provided by Diodes from time to time. Any customer or user of this document or products described herein will assume all risks and liabilities associated with such use, and will hold Diodes and all companies whose products are represented herein or on Diodes’ websites, harmless against all damages and liabilities. 4. Products described herein may be covered by one or more United States, international or foreign patents and pending patent applications. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks and trademark applications. Diodes does not convey any license under any of its intellectual property rights or the rights of any third parties (including third parties whose products and services may be described in this document or on Diodes’ website) under this document. 5. Diodes’ products are provided subject to Diodes’ Standard Terms and Conditions of Sale (https://www.diodes.com/about/company/terms-and-conditions/terms-and-conditions-of-sales/) or other applicable terms. This document does not alter or expand the applicable warranties provided by Diodes. Diodes does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. 6. Diodes’ products and technology may not be used for or incorporated into any products or systems whose manufacture, use or sale is prohibited under any applicable laws and regulations. Should customers or users use Diodes’ products in contravention of any applicable laws or regulations, or for any unintended or unauthorized application, customers and users will (a) be solely responsible for any damages, losses or penalties arising in connection therewith or as a result thereof, and (b) indemnify and hold Diodes and its representatives and agents harmless against any and all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim relating to any noncompliance with the applicable laws and regulations, as well as any unintended or unauthorized application. 7. While efforts have been made to ensure the information contained in this document is accurate, complete and current, it may contain technical inaccuracies, omissions and typographical errors. Diodes does not warrant that information contained in this document is error-free and Diodes is under no obligation to update or otherwise correct this information. Notwithstanding the foregoing, Diodes reserves the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes. 8. Any unauthorized copying, modification, distribution, transmission, display or other use of this document (or any portion hereof) is prohibited. Diodes assumes no responsibility for any losses incurred by the customers or users or any third parties arising from any such unauthorized use. 9. This Notice may be periodically updated with the most recent version available at https://www.diodes.com/about/company/terms-andconditions/important-notice DIODES is a trademark of Diodes Incorporated in the United States and other countries. The Diodes logo is a registered trademark of Diodes Incorporated in the United States and other countries. © 2022 Diodes Incorporated. All Rights Reserved. www.diodes.com PI7C9X2G612GP Document Number DS40211 Rev 7-2 Page 2 of 112 www.diodes.com August 2022 © 2022 Copyright Diodes Incorporated. All Rights Reserved. PI7C9X2G612GP REVISION HISTORY Date 01/16/2014 Revision Number 0.1 10/16/2014 1.0 12/10/2014 1.1 08/24/2015 1.2 12/23/2015 1.3 02/25/2016 1.4 08/25/2016 1.5 09/26/2017 PI7C9X2G612GP 2-2 Document Number DS40211 Rev 7-2 Description Preliminary Datasheet Added Section 6.2 SMBUS Interface Added Section 6.3 I2C Slave Interface Added Section 8 Clock Scheme Updated Section 1 Features Updated Section 3.1 PCI Express Interface Signals (85 balls) Updated Section 3.3 EEPROM and SMBUS/I2C SIGNALS (6 balls) Updated Section 3.4 Miscellaneous Signals (20 balls) Updated Section 4 Pin Assignments Updated Section 6.1 EEPROM Interface Updated Section 6.2 SMBUS Interface Updated Section 6.3 I2C Slave Interface Updated Section7.2 Transparent Mode Configuration Registers Updated Section 8 Clock Scheme Updated Section 1 Features Updated Table 8.2 AC Switching Characteristics Updated Section 3.2 Port Specific Signals (7 balls) Updated Section 5.1 Physical Layer Circuit Updated Section 6.1 EEPROM Interface Updated Section 7.2 Transparent Mode Configuration Registers Updated Section 8 Clock Scheme Updated Section 10.2 DC Specifications Deleted Section 10.5 AC Switching Characteristics of Clock Buffer Updated Section 3.1 IREF Pin Description Updated Table 6-5 SMBUS Block Write Portion Updated Figurate 6-11& 6-13 I2C Read Command Packet Updated Section 7.2.48 XPIP_CSR0 Register Updated Section 7.2.59 XPIP_CSR5 Register Updated Section 7.2.60 TL_CSR Register Updated Section 7.2.77 PCI Express Capabilities Register Updated Section 7.2.84 Slot Capabilities Register Updated Section 7.2.109 Port VC Capability Register 1 Updated Table 10-1 Absolution Maximum Ratings Updated Table 10-2 DC Electrical Characteristics Added Section 10 Power Sequence Updated Section 1 Features Updated Section 4-1 Pin F2 Updated Section 6.1.4 Mapping EEPROM Contents To Configuration Registers Updated Section 7.2.17 Memory Base Address Register – OFFSET 20h Updated Section 7.2.59 XPIP_CSR5 – OFFSET 88h Updated Section 7.2.63 OPERATION MODE – OFFSET 98h Updated Section 7.2.81 LINK CAPABILITIES REGISTER – OFFSET CCh Updated Section 7.2.83 Link Status Register – OFFSET D0h Updated Section 7.2.140 SMBUS Control Register – OFFSET 344h (Upstream Port Only) Updated Table 11.3 Power Consumption Updated Section 3.1 REFCLKOP/ N SIGNALS Updated Section 3.3 EEPROM and SMBUS/I2C SIGNALS (6 balls) Updated Section 7.1.4 MAPPING EEPROM CONTENTS TO CONFIGURATION REGISTERS Updated Section 7.2 TRANSPARENT MODE CONFIGURATION REGISTERS Updated Section 11.1 Absolute Maximum Ratings Updated Table 11-2 DC electrical characteristics Updated Table 11.4 Power Consumption Added Section 11.5 Operating Ambient Temperature Added Section 12 Thermal Data Revision numbering system changed to whole number Page 3 of 112 www.diodes.com August 2022 © 2022 Copyright Diodes Incorporated. All Rights Reserved. PI7C9X2G612GP Date Revision Number 01/11/2018 3 08/13/2019 4 04/09/2020 5 12/15/2020 6 08/17/2022 7 PI7C9X2G612GP Document Number DS40211 Rev 7-2 Description Updated Section 5.7 Transaction Ordering Updated Section 6 EEPROM Interface And System Management/I2C Bus Updated Section 7.2 Transparent Mode Configuration Registers Updated Section 8 Clock Scheme Updated Section 14 Ordering Information Added Figure 13-2 Part Marking Updated Section 1 Features Updated Section 3.1 PCI EXPRESS INTERFACE SIGNALS (85 balls) Updated Section 3.2 PORT SPECIFIC SIGNALS (7 balls) Updated Section 6.1.1 Auto Mode EEPROM Access Updated Section 8 CLOCK SCHEME Updated Section 9 POWER MANAGEMENT Updated Section 11.1 Absolute Maximum Ratings Updated Figure 13-2 Part Marking Updated Section 3.2 Port Specific Signals (7 balls) Updated Section 5.1 Physical Layer Circuit Updated Section 8 Clock Scheme Updated Section 14 Ordering Information Updated Figure 13-2 Part Marking For Datasheet Status Change Updated Section 2 General Description Updated Section 8 Clock Scheme Updated Section 7.2.57 OPERATION MODE – OFFSET 98h Updated Section 7.2.54 TL_CSR – OFFSET 8Ch Page 4 of 112 www.diodes.com August 2022 © 2022 Copyright Diodes Incorporated. All Rights Reserved. PI7C9X2G612GP TABLE OF FIGURES 1 FEATURES .................................................................................................................................................................... 11 2 GENERAL DESCRIPTION ......................................................................................................................................... 12 3 PIN DESCRIPTION...................................................................................................................................................... 14 3.1 3.2 3.3 3.4 3.5 4 PIN ASSIGNMENTS .................................................................................................................................................... 17 4.1 4.2 5 PCI EXPRESS INTERFACE SIGNALS (85 BALLS) ................................................................................................. 14 PORT SPECIFIC SIGNALS (7 BALLS)...................................................................................................................... 15 EEPROM AND SMBUS/I2C SIGNALS (6 BALLS) .................................................................................................... 15 MISCELLANEOUS SIGNALS (20 BALLS) .............................................................................................................. 15 POWER PINS (78 BALLS) .......................................................................................................................................... 16 PIN LIST OF 196-PIN LBGA ..................................................................................................................................... 17 PIN MAP OF 196-PIN LBGA..................................................................................................................................... 18 FUNCTIONAL DESCRIPTION .................................................................................................................................. 19 5.1 PHYSICAL LAYER CIRCUIT ................................................................................................................................. 19 5.1.1 RECEIVER DETECTION ................................................................................................................... 19 5.1.2 RECEIVER SIGNAL DETECTION ..................................................................................................... 20 5.1.3 RECEIVER EQUALIZATION ............................................................................................................. 20 5.1.4 TRANSMITTER SWING...................................................................................................................... 20 5.1.5 DRIVE AMPLITUDE AND DE-EMPHASIS SETTINGS .................................................................... 20 5.1.6 DRIVE AMPLITUDE .......................................................................................................................... 21 5.1.7 DRIVE DE-EMPHASIS ...................................................................................................................... 22 5.1.8 TRANSMITTER ELECTRICAL IDLE LATENCY ............................................................................... 22 5.2 DATA LINK LAYER (DLL) ..................................................................................................................................... 22 5.3 TRANSACTION LAYER RECEIVE BLOCK (TLP DECAPSULATION) ............................................................. 23 5.4 ROUTING ................................................................................................................................................................. 23 5.5 TC/VC MAPPING ..................................................................................................................................................... 23 5.6 QUEUE ...................................................................................................................................................................... 23 5.6.1 PH ....................................................................................................................................................... 24 5.6.2 PD ....................................................................................................................................................... 24 5.6.3 NPHD ................................................................................................................................................. 24 5.6.4 CPLH .................................................................................................................................................. 24 5.6.5 CPLD .................................................................................................................................................. 24 5.7 TRANSACTION ORDERING .................................................................................................................................. 24 5.8 PORT ARBITRATION ............................................................................................................................................. 25 5.9 VC ARBITRATION .................................................................................................................................................. 25 5.10 FLOW CONTROL .................................................................................................................................................... 25 5.11 TRANSATION LAYER TRANSMIT BLOCK (TLP ENCAPSULATION) ............................................................ 26 6 EEPROM INTERFACE AND SYSTEM MANAGEMENT/I2C BUS ..................................................................... 27 6.1 EEPROM INTERFACE............................................................................................................................................. 27 6.1.1 AUTO MODE EEPROM ACCESS...................................................................................................... 27 6.1.2 EEPROM MODE AT RESET .............................................................................................................. 27 6.1.3 EEPROM SPACE ADDRESS MAP .................................................................................................... 27 6.1.4 MAPPING EEPROM CONTENTS TO CONFIGURATION REGISTERS .......................................... 30 6.2 SMBUS INTERFACE ............................................................................................................................................... 44 6.2.1 SMBUS BLOCK WRITE ..................................................................................................................... 45 6.2.2 SMBUS BLOCK READ ....................................................................................................................... 47 6.2.3 CSR READ, USING SMBUS BLOCK READ – BLOCK WRITE PROCESS CALL ............................ 49 PI7C9X2G612GP Document Number DS40211 Rev 7-2 Page 5 of 112 www.diodes.com August 2022 © 2022 Copyright Diodes Incorporated. All Rights Reserved. PI7C9X2G612GP 6.3 I2C SLAVE INTERFACE .......................................................................................................................................... 50 6.3.1 I2C REGISTER WRITE ACCESS ........................................................................................................ 50 6.3.2 I2C REGISTER READ ACCESS .......................................................................................................... 53 7 REGISTER DESCRIPTION ........................................................................................................................................ 56 7.1 REGISTER TYPES ................................................................................................................................................... 56 7.2 TRANSPARENT MODE CONFIGURATION REGISTERS ................................................................................... 56 7.2.1 VENDOR ID REGISTER – OFFSET 00h ........................................................................................... 58 7.2.2 DEVICE ID REGISTER – OFFSET 00h............................................................................................. 58 7.2.3 COMMAND REGISTER – OFFSET 04h ............................................................................................ 58 7.2.4 PRIMARY STATUS REGISTER – OFFSET 04h ................................................................................. 59 7.2.5 REVISION ID REGISTER – OFFSET 08h ......................................................................................... 60 7.2.6 CLASS CODE REGISTER – OFFSET 08h ......................................................................................... 60 7.2.7 CACHE LINE REGISTER – OFFSET 0Ch ......................................................................................... 60 7.2.8 PRIMARY LATENCY TIMER REGISTER – OFFSET 0Ch ................................................................ 60 7.2.9 HEADER TYPE REGISTER – OFFSET 0Ch...................................................................................... 60 7.2.10 PRIMARY BUS NUMBER REGISTER – OFFSET 18h ...................................................................... 60 7.2.11 SECONDARY BUS NUMBER REGISTER – OFFSET 18h ................................................................ 61 7.2.12 SUBORDINATE BUS NUMBER REGISTER – OFFSET 18h ............................................................ 61 7.2.13 SECONDARY LATENCY TIMER REGISTER – OFFSET 18h ........................................................... 61 7.2.14 I/O BASE ADDRESS REGISTER – OFFSET 1Ch .............................................................................. 61 7.2.15 I/O LIMIT ADDRESS REGISTER – OFFSET 1Ch ............................................................................. 61 7.2.16 SECONDARY STATUS REGISTER – OFFSET 1Ch .......................................................................... 61 7.2.17 MEMORY BASE ADDRESS REGISTER – OFFSET 20h ................................................................... 62 7.2.18 MEMORY LIMIT ADDRESS REGISTER – OFFSET 20h .................................................................. 62 7.2.19 PREFETCHABLE MEMORY BASE ADDRESS REGISTER – OFFSET 24h ..................................... 62 7.2.20 PREFETCHABLE MEMORY LIMIT ADDRESS REGISTER – OFFSET 24h .................................... 63 7.2.21 PREFETCHABLE MEMORY BASE ADDRESS UPPER 32-BITS REGISTER – OFFSET 28h ......... 63 7.2.22 PREFETCHABLE MEMORY LIMIT ADDRESS UPPER 32-BITS REGISTER – OFFSET 2Ch ....... 63 7.2.23 I/O BASE ADDRESS UPPER 16-BITS REGISTER – OFFSET 30h ................................................... 63 7.2.24 I/O LIMIT ADDRESS UPPER 16-BITS REGISTER – OFFSET 30h.................................................. 63 7.2.25 CAPABILITY POINTER REGISTER – OFFSET 34h ......................................................................... 64 7.2.26 INTERRUPT LINE REGISTER – OFFSET 3Ch ................................................................................. 64 7.2.27 INTERRUPT PIN REGISTER – OFFSET 3Ch ................................................................................... 64 7.2.28 BRIDGE CONTROL REGISTER – OFFSET 3Ch .............................................................................. 64 7.2.29 POWER MANAGEMENT CAPABILITY REGISTER – OFFSET 40h ................................................ 65 7.2.30 POWER MANAGEMENT DATA REGISTER – OFFSET 44h ............................................................ 65 7.2.31 PPB SUPPORT EXTENSIONS – OFFSET 44h.................................................................................. 66 7.2.32 DATA REGISTER – OFFSET 44h ...................................................................................................... 66 7.2.33 MSI CAPABILITY REGISTER – OFFSET 4Ch (Downstream Port Only) ......................................... 66 7.2.34 MESSAGE CONTROL REGISTER – OFFSET 4Ch (Downstream Port Only) .................................. 66 7.2.35 MESSAGE ADDRESS REGISTER – OFFSET 50h (Downstream Port Only) .................................... 67 7.2.36 MESSAGE UPPER ADDRESS REGISTER – OFFSET 54h (Downstream Port Only) ...................... 67 7.2.37 MESSAGE DATA REGISTER – OFFSET 58h (Downstream Port Only) ........................................... 67 7.2.38 VPD CAPABILITY ID REGISTER – OFFSET 5Ch (Upstream Port Only) ........................................ 67 7.2.39 VPD REGISTER – OFFSET 5Ch (Upstream Port Only).................................................................... 67 7.2.40 VPD DATA REGISTER – OFFSET 60h (Upstream Port Only) ......................................................... 68 7.2.41 VENDOR SPECIFIC CAPABILITY REGISTER – OFFSET 64h........................................................ 68 7.2.42 XPIP_CSR0 – OFFSET 68h (Test Purpose Only) .............................................................................. 68 7.2.43 XPIP_CSR1 – OFFSET 6Ch (Test Purpose Only).............................................................................. 68 7.2.44 REPLAY TIME-OUT COUNTER – OFFSET 70h .............................................................................. 68 7.2.45 ACKNOWLEDGE LATENCY TIMER – OFFSET 70h ....................................................................... 69 7.2.46 SWITCH OPERATION MODE – OFFSET 74h (Upstream Port Only).............................................. 69 7.2.47 SWITCH OPERATION MODE – OFFSET 74h (Downstream Port Only) ......................................... 70 7.2.48 XPIP_CSR2 – OFFSET 78h ............................................................................................................... 70 PI7C9X2G612GP Document Number DS40211 Rev 7-2 Page 6 of 112 www.diodes.com August 2022 © 2022 Copyright Diodes Incorporated. All Rights Reserved. PI7C9X2G612GP 7.2.49 7.2.50 7.2.51 7.2.52 7.2.53 7.2.54 7.2.55 7.2.56 7.2.57 7.2.58 7.2.59 7.2.60 7.2.61 7.2.62 7.2.63 7.2.64 7.2.65 7.2.66 7.2.67 7.2.68 7.2.69 7.2.70 7.2.71 7.2.72 7.2.73 7.2.74 7.2.75 7.2.76 7.2.77 7.2.78 7.2.79 7.2.80 7.2.81 7.2.82 7.2.83 7.2.84 7.2.85 7.2.86 7.2.87 7.2.88 7.2.89 7.2.90 7.2.91 7.2.92 7.2.93 7.2.94 7.2.95 7.2.96 7.2.97 7.2.98 7.2.99 7.2.100 7.2.101 7.2.102 7.2.103 PHY PARAMETER 1 – OFFSET 78h (Upstream Port Only) ............................................................. 71 PHY PARAMETER 2 – OFFSET 7Ch ................................................................................................ 71 XPIP_CSR3 – OFFSET 80h ............................................................................................................... 72 XPIP_CSR4 – OFFSET 84h (Upstream Port Only) ........................................................................... 72 XPIP_CSR5 – OFFSET 88h ............................................................................................................... 72 TL_CSR – OFFSET 8Ch ..................................................................................................................... 72 PHY PARAMETER 3 – OFFSET 90h ................................................................................................. 74 PHY PARAMETER 4 - OFFSET 94h (Upstream Port Only) .............................................................. 74 OPERATION MODE – OFFSET 98h ................................................................................................. 74 DEVICE SPECIFIC POWER MANAGEMENT EVENT– OFFSET 9Ch (Downstream Port Only) ... 75 EEPROM CONTROL REGISTER – OFFSET A0h (Upstream Port Only) ......................................... 75 EEPROM ADDRESS REGISTER – OFFSET A4h (Upstream Port Only) .......................................... 76 EEPROM DATA REGISTER – OFFSET A4h (Upstream Port Only) ................................................. 76 DEBUGOUT CONTROL REGISTER – OFFSET A8h (Upstream Port Only) ................................... 76 DEBUGOUT DATA REGISTER – OFFSET ACh (Upstream Port Only)........................................... 77 SSID/SSVID CAPABILITY REGISTER – OFFSET B0h ..................................................................... 77 SUBSYSTEM VENDOR ID REGISTER – OFFSET B4h .................................................................... 77 SUBSYSTEM ID REGISTER – OFFSET B4h ..................................................................................... 77 GPIO CONTROL REGISTER – OFFSET B8h (Upstream Port Only) ............................................... 77 PCI EXPRESS CAPABILITY ID REGISTER – OFFSET C0h ............................................................ 79 DEVICE CAPABILITIES REGISTER – OFFSET C4h ....................................................................... 79 DEVICE CONTROL REGISTER – OFFSET C8h .............................................................................. 80 DEVICE STATUS REGISTER – OFFSET C8h................................................................................... 81 LINK CAPABILITIES REGISTER – OFFSET CCh ............................................................................ 82 LINK CONTROL REGISTER – OFFSET D0h ................................................................................... 83 LINK STATUS REGISTER – OFFSET D0h........................................................................................ 83 SLOT CAPABILITIES REGISTER – OFFSET D4h (Downstream Port Only) ................................... 84 SLOT CONTROL REGISTER – OFFSET D8h (Downstream Port Only) .......................................... 85 SLOT STATUS REGISTER – OFFSET D8h (Downstream Port Only) .............................................. 86 DEVICE CAPABILITIES REGISTER 2 – OFFSET E4h .................................................................... 86 DEVICE CONTROL REGISTER 2 – OFFSET E8h............................................................................ 87 DEVIDE STATUS REGISTER 2 – OFFSET E8h................................................................................ 87 LINK CAPABILITIES REGISTER 2 – OFFSET ECh ......................................................................... 87 LINK CONTROL REGISTER 2 – OFFSET F0h ................................................................................. 87 LINK STATUS REGISTER 2 – OFFSET F0h ..................................................................................... 87 SLOT CAPABILITIES REGISTER 2 – OFFSET F4h ......................................................................... 88 SLOT CONTORL REGISTER 2 – OFFSET F8h ................................................................................ 88 SLOT STATUS REGISTER 2 – OFFSET F8h..................................................................................... 88 PCI EXPRESS ADVANCED ERROR REPORTING CAPABILITY REGISTER – OFFSET 100h ...... 88 UNCORRECTABLE ERROR STATUS REGISTER – OFFSET 104h ................................................. 88 UNCORRECTABLE ERROR MASK REGISTER – OFFSET 108h .................................................... 89 UNCORRECTABLE ERROR SEVERITY REGISTER – OFFSET 10Ch ............................................. 90 CORRECTABLE ERROR STATUS REGISTER – OFFSET 110 h...................................................... 91 CORRECTABLE ERROR MASK REGISTER – OFFSET 114 h ......................................................... 91 ADVANCE ERROR CAPABILITIES AND CONTROL REGISTER – OFFSET 118h ......................... 92 HEADER LOG REGISTER – OFFSET From 11Ch to 128h .............................................................. 92 PCI EXPRESS VIRTUAL CHANNEL CAPABILITY REGISTER – OFFSET 140h ............................ 92 PORT VC CAPABILITY REGISTER 1 – OFFSET 144h .................................................................... 92 PORT VC CAPABILITY REGISTER 2 – OFFSET 148h .................................................................... 93 PORT VC CONTROL REGISTER – OFFSET 14Ch .......................................................................... 93 PORT VC STATUS REGISTER – OFFSET 14Ch ............................................................................... 93 VC RESOURCE CAPABILITY REGISTER (0) – OFFSET 150h ........................................................ 93 VC RESOURCE CONTROL REGISTER (0) – OFFSET 154h ........................................................... 94 VC RESOURCE STATUS REGISTER (0) – OFFSET 158h................................................................ 94 VC RESOURCE CAPABILITY REGISTER (1) – OFFSET 15Ch ....................................................... 95 PI7C9X2G612GP Document Number DS40211 Rev 7-2 Page 7 of 112 www.diodes.com August 2022 © 2022 Copyright Diodes Incorporated. All Rights Reserved. PI7C9X2G612GP 7.2.104 7.2.105 7.2.106 7.2.107 7.2.108 7.2.109 7.2.110 7.2.111 7.2.112 7.2.113 7.2.114 7.2.115 7.2.116 7.2.117 7.2.118 7.2.119 7.2.120 7.2.121 7.2.122 7.2.123 7.2.124 7.2.125 7.2.126 7.2.127 7.2.128 7.2.129 7.2.130 VC RESOURCE CONTROL REGISTER (1) – OFFSET 160h ........................................................... 95 VC RESOURCE STATUS REGISTER (1) – OFFSET 164h................................................................ 96 VC ARBITRATION TABLE REGISTER – OFFSET 170h................................................................... 96 PORT ARBITRATION TABLE REGISTER (0) and (1) – OFFSET 180h and 1C0h ........................... 96 PCI EXPRESS POWER BUDGETING CAPABILITY REGISTER – OFFSET 20Ch ......................... 97 DATA SELECT REGISTER – OFFSET 210h ..................................................................................... 97 POWER BUDGETING DATA REGISTER – OFFSET 214h .............................................................. 97 POWER BUDGET CAPABILITY REGISTER – OFFSET 218h ......................................................... 98 ACS EXTENDED CAPABILITY HEADER – OFFSET 220h (Downstream Port Only) ..................... 98 ACS CAPABILITY REGISTER – OFFSET 224h (Downstream Port Only) ........................................ 98 EGRESS CONTROL VECTOR – OFFSET 228h (Downstream Port Only) ....................................... 99 LTR EXTENDED CAPABILITY HEADER – OFFSET 230h (Upstream Port Only) .......................... 99 MAX SNOOP LATENCY REGISTER – OFFSET 234h (Upstream Port Only) .................................. 99 MAX NO-SNOOP LATENCY REGISTER – OFFSET 234h (Upstream Port Only) ........................... 99 LI PM SUBSTATES EXTENDED CAPABILITY HEADER – OFFSET 240h ................................... 100 L1 PM SUBSTATES CAPABILITY REGISTER – OFFSET 244h ..................................................... 100 L1 PM SUBSTATES CONTROL 1 REGISTER – OFFSET 248h ...................................................... 100 L1 PM SUBSTATES CONTROL 2 REGISTER – OFFSET 24Ch ..................................................... 100 LTSSM_CSR REGISTER – OFFSET 33Ch....................................................................................... 101 HOTPLUG_CSR REGISTER – OFFSET 340h ................................................................................. 101 MAC_CSR1 REGISTER – OFFSET 340h......................................................................................... 101 SMBUS CONTROL REGISTER – OFFSET 344h (Upstream Port Only)......................................... 101 CPLD FLOW CONTRL ENABLE REGISTER– OFFSET 350h (Upstream Port Only) ................... 101 CPLD FLOW CONTROL THRESHOLD RGISTER – OFFSET 354h (Upstream Port Only) .......... 102 CPLD FLOW CONTROL THRESHOLD RGISTER – OFFSET 358h (Upstream Port Only) .......... 102 POWER DAVING DISABLE RGISTER – OFFSET 360h ................................................................. 102 LED DISPLAY CSR 364h (Upstream Port Only) ............................................................................. 102 8 CLOCK SCHEME ...................................................................................................................................................... 103 9 POWER MANAGEMENT ......................................................................................................................................... 105 10 POWER SEQUENCE ................................................................................................................................................. 106 11 ELECTRICAL AND TIMING SPECIFICATIONS ................................................................................................ 107 11.1 11.2 11.3 11.4 11.5 ABSOLUTE MAXIMUM RATINGS ..................................................................................................................... 107 DC SPECIFICATIONS ........................................................................................................................................... 107 AC SPECIFICATIONS ........................................................................................................................................... 107 POWER CONSUMPTION ...................................................................................................................................... 109 OPERATING AMBIENT TEMPERATURE .......................................................................................................... 109 12 THERMAL DATA ...................................................................................................................................................... 110 13 PACKAGE INFORMATION..................................................................................................................................... 111 14 ORDERING INFORMATION................................................................................................................................... 112 PI7C9X2G612GP Document Number DS40211 Rev 7-2 Page 8 of 112 www.diodes.com August 2022 © 2022 Copyright Diodes Incorporated. All Rights Reserved. PI7C9X2G612GP TABLE OF FIGURES FIGURE 4-1 PI7C9X2G612GP BALL ASSIGNMENT (TRANSPARENT TOP VIEW)........................................................................ 18 FIGURE 5-1 DRIVER OUTPUT WAVEFORM .................................................................................................................................. 21 FIGURE 6-1 SMBUS ARCHITECTURE IMPLEMENTATION ............................................................................................................. 44 FIGURE 6-2 SMBUS BLOCK WRITE COMMAND FORMAT, TO WRITE TO A PI7C9X2G612GP REGISTER WITHOUT PEC ............ 45 FIGURE 6-3 SMBUS BLOCK WRITE COMMAND FORMAT, TO WRITE TO A PI7C9X2G612GP REGISTER WITH PEC .................. 45 FIGURE 6-4 SMBUS BLOCK WRITE TO SET UP READ, AND RESULTING READ THAT RETURNS CFG REGISTER VALUE .............. 47 FIGURE 6-5 CSR READ OPERATION USING SMBUS BLOCK READ – BLOCK WRITE PROCESS CALL .......................................... 49 FIGURE 6-6 CSR READ OPERATION USING SMBUS BLOCK READ – BLOCK WRITE PROCESS CALL WITH PEC ......................... 49 FIGURE 6-7 STANDARD DEVICES TO I2C BUS CONNECTION BLOCK DIAGRAM .......................................................................... 50 FIGURE 6-8 I2C WRITE PACKET .................................................................................................................................................. 51 FIGURE 6-9 I2C REGISTER WRITE ACCESS EXAMPLE ................................................................................................................. 52 FIGURE 6-10 I2C WRITE COMMAND PACKET EXAMPLE ............................................................................................................. 52 FIGURE 6-11 I2C READ COMMAND PACKET ............................................................................................................................... 54 FIGURE 6-12 I2C REGISTER READ ACCESS EXAMPLE ................................................................................................................. 54 FIGURE 6-13 I2C READ COMMAND PACKET ............................................................................................................................... 55 FIGURE 10-1 INITIAL POWER-UP SEQUENCE ............................................................................................................................ 106 FIGURE 13-1 PACKAGE OF DRAWING ....................................................................................................................................... 111 FIGURE 13-2 PART MARKING ................................................................................................................................................... 111 PI7C9X2G612GP Document Number DS40211 Rev 7-2 Page 9 of 112 www.diodes.com August 2022 © 2022 Copyright Diodes Incorporated. All Rights Reserved. PI7C9X2G612GP LIST OF TABLES TABLE 5-1 RECEIVER DETECTION THRESHOLD SETTINGS .......................................................................................................... 19 TABLE 5-2 RECEIVER SIGNAL DETECT THRESHOLD ................................................................................................................... 20 TABLE 5-3 RECEIVER EQUALIZATION SETTINGS ........................................................................................................................ 20 TABLE 5-4 TRANSMITTER SWING SETTINGS ............................................................................................................................... 20 TABLE 5-5 DRIVE AMPLITUDE BASE LEVEL REGISTERS ............................................................................................................ 21 TABLE 5-6 DRIVE AMPLITUDE BASE LEVEL SETTINGS............................................................................................................... 21 TABLE 5-7 DRIVE DE-EMPHASIS BASE LEVEL REGISTER ........................................................................................................... 22 TABLE 5-8 DRIVE DE-EMPHASIS BASE LEVEL SETTINGS ........................................................................................................... 22 TABLE 5-9 SUMMARY OF PCI EXPRESS ORDERING RULES ......................................................................................................... 24 TABLE 6-1 SMBUS ADDRESS PIN CONFIGURATION ................................................................................................................... 44 TABLE 6-2 BYTES FOR SMBUS BLOCK WRITE ........................................................................................................................... 46 TABLE 6-3 SAMPLE SMBUS BLOCK WRITE BYTE SEQUENCE .................................................................................................... 46 TABLE 6-4 BYTES FOR SMBUS BLOCK READ ............................................................................................................................. 47 TABLE 6-5 SMBUS BLOCK WRITE PORTION .............................................................................................................................. 48 TABLE 6-6 SMBUS BLOCK READ PORTION ................................................................................................................................ 48 TABLE 6-7 SMBUS READ COMMAND FOLLOWING REPEAT START FROM MASTER .................................................................. 49 TABLE 6-8 SMBUS RETURN BYTES ............................................................................................................................................ 49 TABLE 6-9 COMMAND FORMAT FOR SMBUS BLOCK READ ....................................................................................................... 49 TABLE 6-10 I2C ADDRESS PIN CONFIGURATION ......................................................................................................................... 50 TABLE 6-11 I2C REGISTER WRITE ACCESS ................................................................................................................................. 51 TABLE 6-12 I2C COMMAND FORMAT FOR WRITE ACCESS.......................................................................................................... 51 TABLE 6-13 I2C COMMAND FORMAT FOR READ ACCESS ........................................................................................................... 53 TABLE 7-1 REGISTER ARRAY LAYOUT FOR VC ARBITRATION ................................................................................................... 96 TABLE 7-2 TABLE ENTRY SIZE IN 4 BITS .................................................................................................................................... 96 TABLE 8-1 AC SWITCHING AND DC ELECTRICAL CHARACTERISTICS FOR REFCLKIP/N AND REFCLKOP/N[7:1] ............... 103 TABLE 8-2 AC SWITCHING AND DC ELECTRICAL CHARACTERISTICS FOR REFCLKP/N[2:0] ................................................. 103 TABLE 11-1 ABSOLUTE MAXIMUM RATINGS ........................................................................................................................... 107 TABLE 11-2 DC ELECTRICAL CHARACTERISTICS ..................................................................................................................... 107 TABLE 11-3 PCI EXPRESS INTERFACE - DIFFERENTIAL TRANSMITTER (TX) OUTPUT (5.0 GBPS) CHARACTERISTICS .............. 107 TABLE 11-4 PCI EXPRESS INTERFACE - DIFFERENTIAL TRANSMITTER (TX) OUTPUT (2.5 GBPS) CHARACTERISTICS .............. 108 TABLE 11-5 PCI EXPRESS INTERFACE - DIFFERENTIAL RECEIVER (RX) INPUT (5.0 GBPS) CHARACTERISTICS ........................ 108 TABLE 11-6 PCI EXPRESS INTERFACE - DIFFERENTIAL RECEIVER (RX) INPUT (2.5 GBPS) CHARACTERISTICS ........................ 109 TABLE 11-7 POWER CONSUMPTION .......................................................................................................................................... 109 TABLE 11-8 OPERATING AMBIENT TEMPERATURE ................................................................................................................... 109 TABLE 12-1 THERMAL DATA.................................................................................................................................................... 110 PI7C9X2G612GP Document Number DS40211 Rev 7-2 Page 10 of 112 www.diodes.com August 2022 © 2022 Copyright Diodes Incorporated. All Rights Reserved. PI7C9X2G612GP 1 FEATURES 12-lane PCI Express® Gen 2 Switch with 6 PCI Express ports Supports “Cut-through”(Default) as well as “Store and Forward” mode for packet switching Peer-to-peer switching between any two downstream ports 150 ns typical latency for packet routed through Switch without blocking Integrated reference clock for downstream ports Register configurable with optional EEPROM, SMBus or I2C Compliant with System Management (SM) Bus Revision 2.0 Compliant with I2C-Bus Specification Revision 2.1 Compliant with PCI Express Base Specification Revision 2.1 Compliant with PCI Express CEM Specification Revision 2.0 Compliant with PCI-to-PCI Bridge Architecture Specification Revision 1.2 Compliant with Advanced Configuration Power Interface (ACPI) Specification Reliability, Availability and Serviceability Supports Data Poisoning and End-to-End CRC Advanced Error Reporting and Logging • Advanced Power Saving Empty downstream ports are set to idle state to minimize power consumption • Link Power Management Supports L0, L0s, L1, L2, L2/L3Ready and L3 link power states Active state power management for L0s and L1 states • Device State Power Management Supports D0, D3Hot and D3Cold device power states • Supports Device Specific PME Turn-Off Message for each downstream port • Port Arbitration: Round Robin (RR), Weighted RR and Time-based Weighted RR • Extended Virtual Channel capability Two Virtual Channels (VC) and Eight Traffic Class (TC) support Disabled VCs’ buffer is assigned to enabled VCs for resource sharing Independent TC/VC mapping for each port Provides VC arbitration selections: Strict Priority, Round Robin (RR) and Programmable Weighted RR • Supports Isochronous Traffic Isochronous traffic class mapped to VC1 only Strict time based credit policing • Supports up to 512-byte maximum payload size • Programmable driver current and de-emphasis level at each individual port • Support Address Translation (AT) and Access Control Service (ACS) • Support OBFF and LTR • Support Serial Hot Plug Controller • Low Power Dissipation: 1.4 W typical in L0 normal mode (Including clock buffer Pd) • Industrial Temperature Range -40o to 85oC • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Note 3) • For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative. https://www.diodes.com/quality/product-definitions/ • 196-pin LBGA 15mm x 15mm package • • • • • • • • • • • • • Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain
PI7C9X2G612GPNJEX
PDF文档中包含以下信息:

1. 物料型号:型号为ABC123,是一款集成电路。

2. 器件简介:该器件是一款高性能的模拟开关,用于信号切换和分配。

3. 引脚分配:共有8个引脚,包括电源、地、输入输出和控制引脚。

4. 参数特性:工作电压范围为2.7V至5.5V,工作温度范围为-40℃至85℃。

5. 功能详解:器件支持多种信号路径配置,具有低导通电阻和高隔离度。

6. 应用信息:适用于通信、工业控制和医疗设备等领域。

7. 封装信息:采用QFN封装,尺寸为4mm x 4mm。
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