TB0640L-13-F

  TB0640L - TB3500L Green 30A BIDIRECTIONAL SURFACE MOUNT THYRISTOR SURGE PROTECTIVE DEVICE Features Mechanical Data • • • • • • • • • • • • 30A Peak Pulse Current @ 10/1000μs 150A Peak Pulse Current @ 8/20μs 58 - 320V Stand-Off Voltages Oxide-Glass Passivated Junction Bidirectional Protection In a Single Device High Off-State impedance and Low On-State Voltage Helps Equipment Meet GR-1089-CORE, IEC 61000-4-5, FCC Part 68, ITU-T K.20/K.21, and UL497B UL Listed Under Recognized Component Index, File Number 156346 Lead Free Finish/RoHS Compliant (Note 1) Green Molding Compound (No Halogen and Antimony) (Note 2) • • • • Case: SMB Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Lead Free Plating (Matte Tin Finish). Solderable per MIL-STD-202, Method 208 Polarity: None; Bidirectional Devices Have No Polarity Indicator Weight: 0.093 grams (approximate) Bottom View Top View Ordering Information (Note 3) Part Number TB0640L-13-F TB0720L-13-F TB0900L-13-F TB1100L-13-F TB1300L-13-F TB1500L-13-F TB1800L-13-F TB2300L-13-F TB2600L-13-F TB3100L-13-F TB3500L-13-F Notes: Case SMB SMB SMB SMB SMB SMB SMB SMB SMB SMB SMB Packaging 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes. 2. Product manufactured with Data Code 0924 (week 24, 2009) and newer are built with Green Molding Compound. 3. For packaging details, go to our website at http://www.diodes.com. Marking Information YWW xxxxx TB0640L - TB3500L Document number: DS30359 Rev. 9 - 2 xxxxx = Product type marking code (See Table on Page 2) = Manufacturers’ code marking YWW = Date code marking Y = Last digit of year (ex: 2 for 2002) WW = Week code (01 ~ 53) 1 of 5 www.diodes.com May 2011 © Diodes Incorporated TB0640L - TB3500L Maximum Ratings @TA = 25°C unless otherwise specified Single phase, half wave, 60Hz, resistive or inductive load. For capacitance load, derate current by 20%. Characteristic Non-Repetitive Peak Impulse Current @10/1000us Non-Repetitive Peak On-State Current @8.3ms (one-half cycle) Typical Positive Temperature Coefficient for Breakdown Voltage Symbol Ipp ITSM ΔVBR/ΔTJ Value 30 15 0.1 Unit A A %/°C Symbol RθJL RθJA TJ TSTG Value 30 120 -40 to +150 -55 to +150 Unit °C/W °C/W °C °C Thermal Characteristics Characteristic Thermal Resistance, Junction to Lead Thermal Resistance, Junction to Ambient Junction Temperature Range Storage Temperature Range Waveform Standard Ipp (A) 2/10 us GR-1089-CORE 200 8/20 us IEC 61000-4-5 150 10/160 us FCC Part 68 100 10/700 us (Note 4) ITU-T, K.20/K.21 60 10/560 us FCC Part 68 50 10/1000 us GR-1089-CORE 30 Notes: IPP, PEAK PULSE CURRENT (%) Maximum Rated Surge Waveform 4. Applied 2kV, 10/700 us waveform Peak Value (Ipp) tr = rise time to peak value tp = decay time to half value Half Value tr tp Electrical Characteristics @TA = 25°C unless otherwise specified Part Number TB0640L TB0720L TB0900L TB1100L TB1300L TB1500L TB1800L TB2300L TB2600L TB3100L TB3500L Maximum Rated Repetitive Off-State Voltage Maximum Off-State Leakage Current @ VDRM Maximum Breakover Voltage Maximum On-State Voltage @ IT = 1A VDRM (V) IDRM (uA) VBO (V) VT (V) 58 65 75 90 120 140 160 190 220 275 320 5 5 5 5 5 5 5 5 5 5 5 77 88 98 130 160 180 220 265 300 350 400 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 TB0640L - TB3500L Document number: DS30359 Rev. 9 - 2 Breakover Current IBO Min (mA) 50 50 50 50 50 50 50 50 50 50 50 2 of 5 www.diodes.com Max (mA) 800 800 800 800 800 800 800 800 800 800 800 Holding Current IH Min (mA) 150 150 150 150 150 150 150 150 150 150 150 Max (mA) 800 800 800 800 800 800 800 800 800 800 800 Typical Off-State Capacitance Marking Code CO (pF) 100 100 100 60 60 60 60 40 40 40 40 T064L T072L T090L T110L T130L T150L T180L T230L T260L T310L T350L May 2011 © Diodes Incorporated TB0640L - TB3500L Electrical Characteristics @TA = 25°C unless otherwise specified Symbol VDRM IDRM VBR IBR VBO IBO IH VT IPP CO Notes: Parameter Stand-off Voltage Leakage current at stand-off voltage Breakdown voltage Breakdown current Breakover voltage Breakover current Holding current (Note 5) On state voltage Peak pulse current Off-state capacitance (Note 6) 5. IH > (VL/RL) If this criterion is not obeyed, the TSPD triggers but does not return correctly to high-resistance state. The surge recovery time does not exceed 30ms. 6. Off-state capacitance measured at f = 1.0MHz, 1.0VRMS signal, VR = 2VDC bias. I IPP IBO IH IBR IDRM VBR VT VDRM VBO 1.2 NORMALIZED BREAKDOWN VOLTAGE I(DRM), OFF-STATE CURRENT (uA) 100 V 10 1 0.1 VDRM = 50V 0.01 1.15 1.1 1.05 1 0.95 0.001 -25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (°C) Fig. 1 Off-State Current vs. Junction Temperature TB0640L - TB3500L Document number: DS30359 Rev. 9 - 2 3 of 5 www.diodes.com 0.9 -50 -25 0 25 50 75 100 125 150 175 TJ, JUNCTION TEMPERATURE (°C) Fig. 2 Relative Variation of Breakdown Voltage vs. Junction Temperature May 2011 © Diodes Incorporated TB0640L - TB3500L 100 IT, ON-STATE CURRENT (A) NORMALIZED BREAKDOWN VOLTAGE 1.1 1.05 1 10 T j = 25°C 1 1 0.95 25 50 75 100 125 150 175 0 -50 -25 TJ, JUNCTION TEMPERATURE (ºC) Fig. 3 Relative Variation of Breakover Voltage vs. Junction Temperature 1 NORMALIZED CAPACITANCE NORMALIZED HOLDING CURRENT 2 1.5 1 0.5 0 -50 9 3 4 5 6 7 8 VT, ON-STATE VOLTAGE (V) Fig. 4 On-State Current vs. On-State Voltage 2 0.1 -25 25 50 75 100 125 0 TJ, JUNCTION TEMPERATURE (°C) Fig. 5 Relative Variation of Holding Current vs. Junction Temperature 1 10 100 VR, REVERSE VOLTAGE (V) Fig. 6 Relative Variation of Junction Capacitance vs. Reverse Voltage Bias Package Outline Dimensions B A C D J H TB0640L - TB3500L Document number: DS30359 Rev. 9 - 2 G E SMB Dim Min Max A 3.30 3.94 B 4.06 4.57 C 1.96 2.21 D 0.15 0.31 E 5.00 5.59 G 0.05 0.20 H 0.76 1.52 J 2.00 2.50 All Dimensions in mm 4 of 5 www.diodes.com May 2011 © Diodes Incorporated TB0640L - TB3500L Suggested Pad Layout C SMB Value (in mm) Dimensions Z 6.8 G 1.8 X 2.3 Y 2.5 C 4.3 X Y G Z IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2011, Diodes Incorporated www.diodes.com TB0640L - TB3500L Document number: DS30359 Rev. 9 - 2 5 of 5 www.diodes.com May 2011 © Diodes Incorporated