TB0640M - TB3500M
Green
50A BIDIRECTIONAL SURFACE MOUNT THYRISTOR SURGE PROTECTION DEVICE
Features
Mechanical Data
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•
•
•
•
•
•
•
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50A Peak Pulse Current @ 10/1000μs
250A Peak Pulse Current @ 8/20μs
58 - 320V Stand-Off Voltages
Oxide-Glass Passivated Junction
Bidirectional Protection In a Single Device
High Off-State impedance and Low On-State Voltage
Helps Equipment Meet GR-1089-CORE, IEC 61000-4-5, FCC
Part 68, ITU-T K.20/K.21, and UL497B
UL Listed Under Recognized Component Index, File Number
156346
Lead Free Finish/RoHS Compliant (Note 1)
Green Molding Compound (No Halogen and Antimony)
(Note 2)
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Case: SMB
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Lead Free Plating (Matte Tin Finish). Solderable per
MIL-STD-202, Method 208
Polarity: None; Bidirectional Devices Have No Polarity Indicator
Weight: 0.093 grams (approximate)
Bottom View
Top View
Ordering Information (Note 3)
Part Number
TB0640M-13-F
TB0720M-13-F
TB0900M-13-F
TB1100M-13-F
TB1300M-13-F
TB1500M-13-F
TB1800M-13-F
TB2300M-13-F
TB2600M-13-F
TB3100M-13-F
TB3500M-13-F
Notes:
Case
SMB
SMB
SMB
SMB
SMB
SMB
SMB
SMB
SMB
SMB
SMB
Packaging
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes.
2. Product manufactured with Data Code 0924 (week 24, 2009) and newer are built with Green Molding Compound.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
YWW
xxxxx
TB0640M - TB3500M
Document number: DS30361 Rev. 10 - 2
xxxxx = Product type marking code
(See Electrical Characteristics table on page 3)
= Manufacturers’ code marking
YWW = Date code marking
Y = Last digit of year (ex: 2 for 2002)
WW = Week code (01 to 53)
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TB0640M - TB3500M
Maximum Ratings @TA = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Non-Repetitive Peak Impulse Current
Non-Repetitive Peak On-State Current
Typical Positive Temperature Coefficient for Breakdown Voltage
@10/1000us
@8.3ms (one-half cycle)
Symbol
Ipp
ITSM
ΔVBR/ΔTj
Value
50
30
0.1
Unit
A
A
%/°C
Symbol
RθJL
RθJA
TJ
TSTG
Value
20
100
-40 to +150
-55 to +150
Unit
°C/W
°C/W
°C
°C
Thermal Characteristics
Characteristic
Thermal Resistance, Junction to Lead
Thermal Resistance, Junction to Ambient
Junction Temperature Range
Storage Temperature Range
Waveform
Standard
Ipp (A)
2/10 us
GR-1089-CORE
300
8/20 us
IEC 61000-4-5
250
10/160 us
FCC Part 68
150
10/700 us
ITU-T, K.20/K.21
100
10/560 us
FCC Part 68
75
10/1000 us
GR-1089-CORE
50
IPP, PEAK PULSE CURRENT (%)
Maximum Rated Surge Waveform
Peak Value (Ipp)
tr = rise time to peak value
tp = decay time to half value
Half Value
tr
TB0640M - TB3500M
Document number: DS30361 Rev. 10 - 2
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tp
November 2011
© Diodes Incorporated
TB0640M - TB3500M
Electrical Characteristics
Part Number
TB0640M
TB0720M
TB0900M
TB1100M
TB1300M
TB1500M
TB1800M
TB2300M
TB2600M
TB3100M
TB3500M
@TA = 25°C unless otherwise specified
Maximum
Rated
Repetitive
Off-State
Voltage
Maximum
Off-State
Leakage
Current @
VDRM
Maximum
Breakover
Voltage
Maximum
On-State
Voltage
@ IT = 1A
VDRM (V)
IDRM (uA)
VBO (V)
VT (V)
58
65
75
90
120
140
160
190
220
275
320
5
5
5
5
5
5
5
5
5
5
5
77
88
98
130
160
180
220
265
300
350
400
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
Symbol
VDRM
IDRM
VBR
IBR
VBO
IBO
IH
VT
IPP
CO
Notes:
Breakover
Current
IBO
Min
(mA)
50
50
50
50
50
50
50
50
50
50
50
Holding Current
IH
Max
(mA)
800
800
800
800
800
800
800
800
800
800
800
Min
(mA)
150
150
150
150
150
150
150
150
150
150
150
Max
(mA)
800
800
800
800
800
800
800
800
800
800
800
Typical
Off-State
Capacitance
Marking
Code
CO (pF)
140
140
140
90
90
90
90
60
60
60
60
T064M
T072M
T090M
T110M
T130M
T150M
T180M
T230M
T260M
T310M
T350M
Parameter
Stand-off Voltage
Leakage current at stand-off voltage
Breakdown voltage
Breakdown current
Breakover voltage
Breakover current
Holding current
Note 4
On state voltage
Peak pulse current
Off-state capacitance
Note 5
4. IH > (VL/RL) If this criterion is not obeyed, the TSPD triggers but does not return correctly to high-resistance state. The surge recovery time does not
exceed 30ms.
5. Off-state capacitance measured at f = 1.0MHz, 1.0VRMS signal, VR = 2VDC bias.
I
IPP
IBO
IH
IBR
IDRM
VBR
VT
VDRM
TB0640M - TB3500M
Document number: DS30361 Rev. 10 - 2
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V
VBO
November 2011
© Diodes Incorporated
TB0640M - TB3500M
1.2
NORMALIZED BREAKDOWN VOLTAGE
I(DRM), OFF-STATE CURRENT (uA)
100
10
1
0.1
VDRM = 50V
0.01
0.001
-25
0
25
50
75
100 125
150
TJ, JUNCTION TEMPERATURE (°C)
Fig. 1 Off-State Current vs. Junction Temperature
1.15
1.1
1.05
1
0.95
0.9
-50
-25 0
25 50 75 100 125 150 175
TJ, JUNCTION TEMPERATURE (°C)
Fig. 2 Relative Variation of Breakdown Voltage vs. Junction Temperature
100
IT, ON-STATE CURRENT (A)
NORMALIZED BREAKDOWN VOLTAGE
1.1
1.05
1
10
1
0.95
1
25 50 75 100 125 150 175
0
-50 -25
TJ, JUNCTION TEMPERATURE (ºC)
Fig. 3 Relative Variation of Breakover Voltage vs. Junction Temperature
1.4
5
2
2.5
3.5
4.5
3
4
VT, ON-STATE VOLTAGE (V)
Fig. 4 On-State Current vs. On-State Voltage
1.5
1
1.2
NORMALIZED CAPACITANCE
NORMALIZED HOLDING CURRENT
1.3
1.1
1
0.9
0.8
0.7
0.6
0.5
0.4
0.1
0.3
75
-25
25
50
100 125
0
TJ, JUNCTION TEMPERATURE (°C)
Fig. 5 Relative Variation of Holding Current vs. Junction Temperature
-50
TB0640M - TB3500M
Document number: DS30361 Rev. 10 - 2
10
100
VR, REVERSE VOLTAGE (V)
Fig. 6 Relative Variation of Junction Capacitance vs. Reverse Voltage Bias
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TB0640M - TB3500M
Package Outline Dimensions
B
A
SMB
Dim
Min
Max
A
3.30
3.94
B
4.06
4.57
C
1.96
2.21
D
0.15
0.31
E
5.00
5.59
G
0.05
0.20
H
0.76
1.52
J
2.00
2.50
All Dimensions in mm
C
D
J
H
G
E
Suggested Pad Layout
SMB
Value (in mm)
Dimensions
Z
6.8
G
1.8
X
2.3
Y
2.5
C
4.3
TB0640M - TB3500M
Document number: DS30361 Rev. 10 - 2
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TB0640M - TB3500M
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2011, Diodes Incorporated
www.diodes.com
TB0640M - TB3500M
Document number: DS30361 Rev. 10 - 2
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November 2011
© Diodes Incorporated