BL24C08F
Features
Compatible with all I2C bidirectional data
–
transfer protocol
Write Protect Pin for Hardware Data Protection
Memory array:
Schmitt Trigger, Filtered Inputs for Noise
–
8K bits (1024 X 8) of EEPROM
–
Page size: 16 bytes
Suppression
Single supply voltage and high speed:
–
1 MHz
Random and sequential Read modes
Partial Page Writes Allowed
Write:
High-reliability
–
Endurance: 1 Million Write Cycles
–
Data Retention: 100 Years
Enhanced ESD/Latch-up protection
–
–
Byte Write within 3 ms
–
Page Write within 3 ms
HBM 5000V
8-lead PDIP/SOP/TSSOP and UDFN packages
Description
The BL24C08F provides 8192 bits of serial
The device is optimized for use in many
electrically erasable and programmable read-
industrial and commercial applications where
only memory (EEPROM), organized as 1024
low-power
words of 8 bits each.
essential.
and
low-voltage
operation
Pin Configuration
8-lead PDIP
8-lead SOP
8-lead TSSOP
8-pad DFN
NC
1
8
VCC
NC
1
8
VCC
NC
1
8
VCC
VCC
8
1
NC
NC
2
7
WP
NC
2
7
WP
NC
2
7
WP
WP
7
2
NC
A2
3
6
SCL
A2
3
6
SCL
A2
3
6
SCL
SCL 6
3
A2
GND
4
5
SDA
GND
4
5
SDA
GND
4
5
SDA
SDA 5
4
GND
Bottem view
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are
BL24C08F
Pin Descriptions
Pin Name
Type
Functions
A2
I
Address Inputs
SDA
I/O
Serial Data
SCL
I
Serial Clock Input
WP
I
Write Protect
GND
P
Ground
Vcc
P
Power Supply
Table 1
Block Diagram
Vcc
GND
WP
SCL
START STOP
LOGIC
SDA
EN
SERIAL CONTROL
LOGIC
HIGH VOLTAGE
PUMP/TIMING
LOAD
DATA RECOVERY
CCMP
DEVICE ADDRESS
COMPARATOR
LOAD
INC
A2
X DECODER
DATA WORD
ADRESS COUNTER
Y DECODER
DIN
EEPROM
SERIAL MUX
DOUT/ACKNOWLEDGE
DOUT
Figure 1
DEVICE/PAGE ADDRESSES (A2): The A2 pin is device address input that is hard wire for the BL24C08F.
Only two 8K devices may be addressed on a single bus system (device addressing is discussed in
detail under the Device Addressing section).
SERIAL DATA (SDA): The SDA pin is bi-directional for serial data transfer. This pin is open-drain driven
and may be wire-ORed with any number of other open-drain or open- collector devices.
SERIAL CLOCK (SCL): The SCL input is used to positive edge clock data into each EEPROM device
and negative edge clock data out of each device.
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BL24C08F
WRITE PROTECT (WP): The BL24C08F has a Write Protect pin that provides hardware data protection.
The Write Protect pin allows normal read/write operations when connected to ground (GND). When
the Write Protection pin is connected to Vcc, the write protection feature is enabled and operates as
shown in the following Table 2.
WP Pin Status
BL24C08F
At VCC
Full Array
At GND
Normal Read/Write Operations
Table 2
Functional Description
1.
Memory Organization
BL24C08F, 8K SERIAL EEPROM: Internally organized with 64 pages of 16 bytes each, the 8K requires a 10bit data word address for random word addressing.
2.
Device Operation
CLOCK and DATA TRANSITIONS: The SDA pin is normally pulled high with an external device. Data on the
SDA pin may change only during SCL low time periods (see Figure 2). Data changes during SCL high
periods will indicate a start or stop condition as defined below.
SDA
SCL
DATA STABLE
DATA CHANGE
DATA STABLE
Figure 2. Data Validity
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BL24C08F
START CONDITION: A high-to-low transition of SDA with SCL high is a start condition which must
precede any other command (see Figure 3).
STOP CONDITION: A low-to-high transition of SDA with SCL high is a stop condition. After a read
sequence, the stop command will place the EEPROM in a standby power mode (see Figure 3).
SDA
SCL
START
STOP
Figure 3. Start and Stop Definition
ACKNOWLEDGE: All addresses and data words are serially transmitted to and from the EEPROM in 8-bit
words. The EEPROM sends a "0" to acknowledge that it has received each word. This happens during
the ninth clock cycle.
SCL
1
8
9
DATA IN
DATA OUT
START
ACKNOWLEDGE
Figure 4. Output Acknowledge
STANDBY MODE: The BL24C08F features a low-power standby mode which is enabled:
(a) upon power-up
(b) after the receipt of the STOP bit and the completion of any internal operations.
MEMORY RESET: After an interruption in protocol, power loss or system reset, any two-wire part can be
reset by following these steps:
1. Clock up to 9 cycles.
2. Look for SDA high in each cycle while SCL is high.
3. Create a start condition.
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BL24C08F
3.
Device Addressing
The 8K EEPROM devices all require an 8-bit device address word following a start condition to enable
the chip for a read or write operation (see Figure 5)
MSB
LSB
1
0
1
0
A2
P1
P0
R/W
Figure 5. Device Address
The device address word consists of a mandatory "1", "0" sequence for the first four most significant
bits as shown. This is common to all the Serial EEPROM devices.
The 8K EEPROM uses A2 device address bits to allow two devices on the same bus. This bit must be
compared to their corresponding hardwired input pins. The A2 pin uses an internal proprietary circuit
that biases them to a logic low condition if the pin is allowed to float.
The eighth bit of the device address is the read/write operation select bit. A read operation is initiated if
this bit is high and a write operation is initiated if this bit is low.
Upon a compare of the device address, the EEPROM will output a "0". If a compare is not made, the
chip will return to a standby state.
DATA SECURITY: The BL24C08F has a hardware data protection scheme that allows the user to write
protect the entire memory when the WP pin is at VCC.
4.
Write Operations
BYTE WRITE: A write operation requires an 8-bit data word address following the device address word
and acknowledgment. Upon receipt of this address, the EEPROM will again respond with a "0" and then
clock in the first 8-bit data word. Following receipt of the 8-bit data word, the EEPROM will output a "0"
and the addressing device, such as a microcontroller, must terminate the write sequence with a stop
condition. At this time the EEPROM enters an internally timed write cycle, tWR, to the nonvolatile
memory. All inputs are disabled during this write cycle and the EEPROM will not respond until the write
is complete (see Figure 6).
S
T
A
R
T
DEVICE
ADDRESS
W
R
I
T
E
WORD
ADDRESS
S
T
O
P
DATA
SDA
LINE
M
S
B
L R A
S / C
BWK
L A
S C
B K
L A
S C
B K
Figure 6. Byte Write
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BL24C08F
PAGE WRITE: The 8K devices are capable of 16-byte page writes.
A page write is initiated the same as a byte write, but the microcontroller does not send a stop
condition after the first data word is clocked in. Instead, after the EEPROM acknowledges receipt of the
first data word, the microcontroller can transmit up to fifteen more data words. The EEPROM will
respond with a "0" after each data word received. The microcontroller must terminate the page write
sequence with a stop condition (see Figure 7).
S
T
A
R
T
W
R
I
T
E
DEVICE
ADDRESS
WORD
ADDRESS
DATA(n)
DATA(n+1)
S
T
O
P
DATA(n+1)
SDA
LINE
M
S
B
L R A
S / C
BWK
L A
S C
B K
A
C
K
A
C
K
A
C
K
Figure 7. Page Write
The data word address lower four bits are internally incremented following the receipt of each data
word. The higher data word address bits are not incremented, retaining the memory page row location.
When the word address, internally generated, reaches the page boundary, the following byte is placed
at the beginning of the same page. If more than sixteen data words are transmitted to the EEPROM, the
data word address will "roll over" and previous data will be overwritten.
ACKNOWLEDGE POLLING: Once the internally timed write cycle has started and the EEPROM inputs are
disabled, acknowledge polling can be initiated. This involves sending a start condition followed by the
device address word. The read/write bit is representative of the operation desired. Only if the internal
write cycle has completed will the EEPROM respond with a "0", allowing the read or write sequence to
continue.
5.
Read Operations
Read operations are initiated the same way as write operations with the exception that the read/write
select bit in the device address word is set to "1". There are three read operations: current address read,
random address read and sequential read.
CURRENT ADDRESS READ:
The internal data word address counter maintains the last address accessed during the last read or
write operation, incremented by one. This address stays valid between operations as long as the chip
power is maintained. The address "roll over" during read is from the last byte of the last memory page
to the first byte of the first page. The address "roll over" during write is from the last byte of the current
page to the first byte of the same page. Once the device address with the read/write select bit set to
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BL24C08F
"1" is clocked in and acknowledged by the EEPROM, the current address data word is serially clocked
out. The microcontroller does not respond with an input "0" but does generate a following stop
condition (see Figure 8).
S
T
A
R
T
R
E
A
D
DEVICE
ADDRESS
S
T
O
P
DATA
SDA
LINE
M
S
B
L R A
S / C
BWK
NO
ACK
Figure 8. Current Address Read
RANDOM READ:
A random read requires a "dummy" byte write sequence to load in the data word address. Once the
device address word and data word address are clocked in and acknowledged by the EEPROM, the
microcontroller must generate another start condition. The microcontroller now initiates a current
address read by sending a device address with the read/write select bit high. The EEPROM
acknowledges the device address and serially clocks out the data word. The microcontroller does not
respond with a "0" but does generate a following stop condition (see Figure 9)
S
T
A
R
T
DEVICE
ADDRESS
W
R
I
T
E
S
T
A
R
T
WORD
ADDRESS
DEVICE
ADDRESS
R
E
A
D
S
T
O
P
DATA(n)
SDA
LINE
M
S
B
L R A
S / C
BWK
L A
S C
B K
A
C
K
NO
ACK
DUMMY WRITE
Figure 9. Random Read
SEQUENTIAL READ: Sequential reads are initiated by either a current address read or a random address
read. After the microcontroller receives a data word, it responds with an acknowledge. As long as the
EEPROM receives an acknowledge, it will continue to increment the data word address and serially
clock out sequential data words. When the memory address limit is reached, the data word address will
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BL24C08F
"roll over" and the sequential read will continue. The sequential read operation is terminated when the
microcontroller does not respond with a "0" but does generate a following stop condition (see Figure
10).
DEVICE
ADDRESS
R
E
A
D
DATA(n)
DATA(n+1)
DATA(n+2)
S
T
O
P
DATA(n+x)
SDA
LINE
R A
/ C
WK
A
C
K
A
C
K
A
C
K
NO
ACK
Figure 10. Sequential Read
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BL24C08F
Electrical Characteristics
Absolute Maximum Stress Ratings:
DC Supply Voltage . . . . . . . . . . . . . . . . .-0.3V to +6.5V
Input / Output Voltage . . . . . . . .GND-0.3V to VCC+0.3V
Operating Ambient Temperature . . . . . -40℃ to +85℃
Storage Temperature . . . . . . . . . . . . -65℃ to +150℃
Electrostatic pulse (Human Body model) . . . . . . . 5000V
Comments:
Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to this
device. These are stress ratings only. Functional operation of this device at these or any other
conditions above those indicated in the operational sections of this specification is not implied or
intended. Exposure to the absolute maximum rating conditions for extended periods may affect device
reliability.
DC Electrical Characteristics
Applicable over recommended operating range from: TA = -40℃ to +85℃, VCC = +1.7V to +5.5V
(unless otherwise noted)
Parameter
Symbol
Min
Typ
Max
Unit
Condition
Supply Voltage
VCC1
1.7
-
5.5
V
Supply Current VCC=5.0V
ICC1
-
0.26
0.5
mA
READ at 400KHZ
Supply Current VCC=5.0V
ICC2
-
0.28
0.5
mA
WRITE at 400KHZ
Supply Current VCC=5.0V
ISB1
-
0.03
0.5
μA
VIN=VCC or VSS
Input Leakage Current
IL1
-
0.10
1.0
μA
VIN=VCC or VSS
Output Leakage Current
ILO
-
0.05
1.0
μA
VOUT=VCC or VSS
Input Low Level
VIL1
-0.3
-
VCC×0.3
V
VCC=1.7V to 5.5V
Input High Level
VIH1
VCC×0.7
-
VCC+0.3
V
VCC=1.7V to 5.5V
Output Low Level VCC=1.7V
VOL1
-
-
0.2
V
IOL=2.1mA
Output Low Level VCC=5.0V
VOL2
-
-
0.4
V
IOL=3.0mA
-
Table 3
Pin Capacitance
Applicable over recommended operating range from TA = 25℃, f = 1.0 MHz, VCC = +1.7V
Parameter
Symbol
Min
Typ
Max
Unit
Condition
Input/Output Capacitance(SDA)
CI/O
-
-
8
pF
VIO=0V
Input Capacitance(SCL)
CIN
-
-
6
pF
VIN=0V
Table 4
BL24C08F
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BL24C08F
AC Electrical Characteristics
Applicable over recommended operating range from TA = -40℃ to +85℃, VCC = +1.7V to +5.5V, CL =
1 TTL Gate and 100 pF (unless otherwise noted)
Parameter
Symbol
1.7V≤VCC﹤2.5V
2.5V≤VCC﹤5.5V
Min
Typ
Max
Min
Typ
Max
Units
Clock Frequency,SCL
fSCL
-
-
400
-
-
1000
kHz
Clock Pulse Width Low
tLOW
1.3
-
-
0.5
-
-
μs
Clock Pulse Width High
tHIGH
0.6
-
-
0.26
-
-
μs
Noise Suppression Time
tI
-
-
50
-
-
50
ns
Clock Low to Data Out Valid
tAA
-
-
0.9
-
-
0.45
μs
Time the bus must be free before a
new transmission can start
tBUF
1.3
-
-
0.5
-
-
μs
Start Hold Time
tHD:STA
0.6
-
-
0.25
-
-
μs
Start Setup Time
tSU:STA
0.6
-
-
0.25
-
-
μs
Data In Hold Time
tHD:DAT
0
-
-
0
-
-
μs
Data in Setup Time
tSU:DAT
100
-
-
100
-
-
ns
Input Rise Time(1)
tR
-
-
0.3
-
-
0.12
μs
Input Fall Time(1)
tF
-
-
0.3
-
-
0.12
μs
Stop Setup Time
tSu:STO
0.6
-
-
0.25
-
-
μs
Data Out Hold Time
tDH
50
-
-
50
-
-
ns
Write Cycle Time
twR
-
1.9
3
-
1.9
3
ms
Endurance
1M
-
-
1M
-
-
Write Cycle
5.0V,25℃,Byte Mode(1)
Table 5
Notes:
1. This parameter is characterized and is not 100% tested.
2. AC measurement conditions:
RL (connects to VCC): 1.3 k
Input pulse voltages: 0.3 VCC to 0.7 VCC
Input rise and fall time: 50 ns
Input and output timing reference voltages: 0.5 VCC
The value of RL should be concerned according to the actual loading on the user's system.
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BL24C08F
Bus Timing
tF
tHIGH
tR
tLOW
tLOW
SCL
tSU.DAT
tHD.DAT
tHD.STA
tSU.STA
tSU.STO
SDA_IN
tAA
t BUF
tDH
SDA_OUT
Figure 11. SCL: Serial Clock, SDA: Serial Data I/O
Write Cycle Timing
SCL
ACK
SDA
Word n
tWR(1)
STOP
CONDITION
START
CONDITION
Figure 12. SCL: Serial Clock, SDA: Serial Data I/O
Notes:
The write cycle time tWR is the time from a valid stop condition of a write sequence to the end of the internal
clear/write cycle.
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BL24C08F
Package Information
PDIP Outline Dimensions
E
E1
C
eA
Top View
End View
COMMON DIMENSIONS
(Unit of Measure=inches)
D
D1
e
B3
4PLCS
A2 A
b2
b
Side View
L
SYMBOL
A
A2
b
b2
b3
c
D
D1
E
E1
e
eA
L
MIN
NOM
0.115
0.014
0.045
0.030
0.008
0.355
0.005
0.300
0.240
0.130
0.018
0.060
0.039
0.010
0.365
0.115
0.310
0.250
0.100BSC
0.300BSC
0.130
MAX
0.210
0.195
0.022
0.070
0.045
0.014
0.400
NOTE
2
5
6
6
0.325
0.280
3
3
4
3
0.150
4
2
Notes:
1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional
information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed
0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010
(0.25 mm).
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BL24C08F
SOP
1
E
E1
N
L
Φ
COMMON DIMENSIONS
(Unit of Measure=mm)
B
e
D
A
A1
SYMBOL
A
A1
b
C
D
E1
E
e
L
Φ
MIN
1.35
0.10
0.31
0.17
4.80
3.81
5.79
0.40
0"
NOM
1.27BSC
-
MAX
1.75
0.25
0.51
0.25
5.00
3.99
6.20
NOTE
1.27
8"
Notes:
These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper
dimensions, tolerances, datums, etc.
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BL24C08F
TSSOP
3
2
1
E1
E
L1
End View
N
L
COMMON DIMENSIONS
Unit of Measure=mm
Top View
A
b
e
D
Side View
A2
SYMBOL
D
E
E1
A
A2
b
e
L
L1
MIN
2.90
4.30
0.80
0.19
0.45
NOM
MAX
3.00
3.10
6.40BSC
4.40
4.50
1.20
1.00
1.05
0.30
0.65BSC
0.60
0.75
1.00REF
NOTE
2,5
3,5
4
Notes:
1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper
dimensions, tolerances, datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall
not exceed 0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed
0.25 mm (0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess
of the b dimension at maximummaterial condition. Dambar cannot be located on the lower radius of the foot.
Minimum space between protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H.
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BL24C08F
UDFN
D
D2
L
PIN 1 DOT
BY MARKING
E
E2
PIN #1 IDENTIFICATION
CHAMFER
TOP VIEW
A
A3
A1
SIDE VIEW
BL24C08F
b
e
BOTTOM VIEW
PKG
REF
A
A1
A3
D
E
b
L
D2
E2
e
COMMON DIMENSION(MM)
UT:ULTRA THIN
MIN
NOM
MAX
>0.50
0.55
0.60
0.00
0.05
0.15REF
1.95
2.00
2.05
2.95
3.00
3.05
0.20
0.25
0.30
0.20
0.30
0.40
1.25
1.40
1.50
1.15
1.30
1.40
0.50BSC
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BL24C08F
Ordering Information
BL24C08F - 1
Code
2
3
Description
Package type
PA: SOP-8L
SF: TSSOP-8L
DA: PDIP-8L
1
NT: UDFN-8L
TC: SOT23-5L
RR: TSOT23-5L
MA: M2.2
MB: M3.2
Packing type
2
R: Tape and Reel
T: Tube
Feature
3
S: Standard (default, Pb Free RoHS Std.)
C: Green (Halogen Free)
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BL24C08F
Revision history
Version 1.0 BL24C08F
Initial version
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