BLM3407

Pb Free Product BLM3407 P-Channel Enhancement Mode Power MOSFET DESCRIPTION D The BLM3407 uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate G voltages as low as 4.5V. This device is suitable for use as a load switch or in PWM applications. S GENERAL FEATURES Schematic diagram ● VDS = -30V,ID = -4.1A RDS(ON) < 95mΩ @ VGS=-4.5V RDS(ON) < 65mΩ @ VGS=-10V ● High Power and current handing capability ● Lead free product is acquired Marking and pin Assignment ● Surface Mount Package Application ●PWM applications ●Load switch SOT-23 top view ●Power management Package Marking And Ordering Information Device Marking Device Device Package Reel Size Tape width Quantity 3407 BLM3407 SOT-23 Ø180mm 8 mm 3000 units Absolute Maximum Ratings (TA=25℃ ℃unless otherwise noted) Parameter Symbol Drain-Source Voltage VDS Gate-Source Voltage VGS Drain Current-Continuous ID Drain Current-Pulsed (Note 1) IDM Maximum Power Dissipation PD Operating Junction and Storage Temperature Range TJ,TSTG Limit Unit -30 V ±20 V -4.1 A -20 A 1.4 W -55 To 150 ℃ 90 ℃/W Thermal Characteristic Thermal Resistance,Junction-to-Ambient (Note 2) RθJA Electrical Characteristics (TA=25℃unless otherwise noted) Parameter Symbol Condition Min Typ Max Unit Off Characteristics Drain-Source Breakdown Voltage BVDSS VGS=0V ID=-250µA -30 -33 - V Zero Gate Voltage Drain Current IDSS VDS=-24V,VGS=0V - - -1 µA Page1 www.belling.com.cn V2.0 Pb Free Product BLM3407 Gate-Body Leakage Current IGSS VGS=±20V,VDS=0V - - ±100 nA Gate Threshold Voltage VGS(th) VDS=VGS,ID=-250µA -1 -1.5 -3 V Drain-Source On-State Resistance RDS(ON) VGS=-10V, ID=-4.1A - 55 65 mΩ VGS=-4.5V, ID=-4A - 75 95 mΩ VDS=-5V,ID=-4.1A 5.5 - - S - 700 - PF - 120 - PF On Characteristics (Note 3) Forward Transconductance gFS Dynamic Characteristics (Note4) Input Capacitance Clss Output Capacitance Coss Reverse Transfer Capacitance Crss - 75 - PF Turn-on Delay Time td(on) - 9 - nS Turn-on Rise Time tr VDD=-15V,RL=3.6Ω - 5 - nS td(off) VGS=-10V,RGEN=3Ω - 28 - nS VDS=-15V,VGS=0V, F=1.0MHz Switching Characteristics (Note 4) Turn-Off Delay Time Turn-Off Fall Time tf - 13.5 - nS Total Gate Charge Qg - 14 - nC Gate-Source Charge Qgs - 3.1 - nC Gate-Drain Charge Qgd - 3. - nC - - -1.2 V VDS=-15V,ID=-4A,VGS=-10V Drain-Source Diode Characteristics Diode Forward Voltage (Note 3) VSD VGS=0V,IS=-1A Notes: 1. Repetitive Rating: Pulse width limited by maximum junction temperature. 2. Surface Mounted on FR4 Board, t ≤ 10 sec. 3. Pulse Test: Pulse Width ≤ 300µs, Duty Cycle ≤ 2%. 4. Guaranteed by design, not subject to production Page2 www.belling.com.cn V2.0 Pb Free Product BLM3407 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS ton tr td(on) toff tf td(off) 90% VOUT 90% INVERTED 10% 10% 90% VIN 50% 50% 10% PULSE WIDTH Figure 2:Switching Waveforms PD Power(W) ID- Drain Current (A） Figure 1:Switching Test Circuit TJ-Junction Temperature(℃) TJ-Junction Temperature(℃) Figure 4 Drain Current ID- Drain Current (A) Rdson On-Resistance(mΩ) Figure 3 Power Dissipation Vds Drain-Source Voltage (V) Figure 5 Output CHARACTERISTICS Page3 www.belling.com.cn ID- Drain Current (A) Figure 6 Drain-Source On-Resistance V2.0 Pb Free Product ID- Drain Current (A) Normalized On-Resistance BLM3407 Vgs Gate-Source Voltage (V) TJ-Junction Temperature(℃) Figure 8 Drain-Source On-Resistance C Capacitance (pF) Rdson On-Resistance(mΩ) Figure 7 Transfer Characteristics Vgs Gate-Source Voltage (V) Vds Drain-Source Voltage (V) Figure 10 Capacitance vs Vds Vgs Gate-Source Voltage (V) Is- Reverse Drain Current (A) Figure 9 Rdson vs Vgs Qg Gate Charge (nC) Figure 11 Gate Charge Page4 Vsd Source-Drain Voltage (V) Figure 12 Source- Drain Diode Forward www.belling.com.cn V2.0 Pb Free Product ID- Drain Current (A) BLM3407 Vds Drain-Source Voltage (V) Safe Operation Area r(t),Normalized Effective Transient Thermal Impedance Figure 13 Square Wave Pluse Duration(sec) Figure 14 Normalized Maximum Transient Thermal Impedance Page5 www.belling.com.cn V2.0 Pb Free Product BLM3407 SOT-23 PACKAGE INFORMATION Dimensions in Millimeters (UNIT:mm) Symbol A A1 A2 b c D E E1 e e1 L L1 θ Dimensions in Millimeters MIN. MAX. 0.900 1.150 0.000 0.100 0.900 1.050 0.300 0.500 0.080 0.150 2.800 3.000 1.200 1.400 2.250 2.550 0.950TYP 1.800 2.000 0.550REF 0.300 0.500 0° 8° NOTES 1. All dimensions are in millimeters. 2. Tolerance ±0.10mm (4 mil) unless otherwise specified 3. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 5 mils. 4. Dimension L is measured in gauge plane. 5. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. Page6 www.belling.com.cn V2.0