BCG13D

BeRex 5-4000 MHz Cascadeable InGaP HBT Gain Block Device Features • 33 dBm Output IP3 at 5dBm/tone • 24.9 dB Gain at 900 MHz • 18 dBm P1dB • Highly Reliable InGaP/GaAs HBT Technology • 50 ohm Cascadeable • Application: commercial wireless system BCG13D Target Device Performance (Ta = 25°C) Symbols Frequency Range Gain 900 MHz 1900 MHz 2450 MHz 900 MHz 1900 MHz 2450 MHz 900 MHz 1900 MHz 2450 MHz 900 MHz 1900 MHz 2450 MHz 900 MHz 1900 MHz 2450 MHz Vc = 5.0V Test Conditions Min 5 23.9 22.0 20.6 Typ 24.9 23.0 21.6 -11.7 -10.4 -11.9 -7.6 -13.4 -12.0 33.0 32.7 31.5 18.3 18.2 17.4 69 5.0 -0.007 85 Max 4000 25.9 24.0 22.6 Unit MHz dB S11 dB S22 dB OIP3 P1dB Ic Vc dG/dT Rth 31.0 30.7 29.5 17.3 17.2 16.4 59 dBm dBm 79 mA V dB/°C °C/W Thermal Resistance Test conditions unless otherwise noted. 1. Device performance is measured on BeRex evaluation board at 25C, 50 ohm system 2. OIP3 measured with two tones at an output power of 5 dBm/tone separated by 1 MHz. Absolute Maximum Ratings Parameter Operating Case temperature Storage Temperature Operating Voltage Supply Current Input RF Power Rating -40 to +85°C -40 to +155°C +5.5V 150 mA 23dBm Operation of this device above any of these parameters may result in permanent damage. http: //www.berex.com BeRex BCG13D S-parameter test circuit Chip attachment on PF083 I-V characteristics Generic PF083 Evaluation Board (31mil thick FR4) Application Circuit: 5-4000 MHz Typical Performance (Vc = 5V, Ic = 69mA, T = 25°C) Freq S21 S11 S22 P1 OIP3 MHz dB dB dB dBm dBm 900 24.9 -11.7 -7.6 19.0 32.0 1900 23.0 -10.4 -13.4 19.0 32.0 2450 22.5 -11.9 -12.0 19.0 31.0 http: //www.berex.com BeRex Schematic Diagram C1 C2 C3 C4 C5 L1* BOM 100pF 100pF 100pF 1000pF 10uF 39nH BCG13D Tolerance ±5% ±5% ±5% ±5% ±20% 5% *Note: 1. Chip is mounted on the PF083 open PKG, and bonded with 2-wires at both input and output. 2. Less than 20nH improves RF performance at frequencies over 1.9GHz. 3. 40nH or higher value L1 improves RF performance at frequencies under 500MHz. 4. Optimum value of L1 may vary with board design. S-parameters (Vc=5V, Ic=65mA, T=25°C) Typical Device Data http: //www.berex.com BeRex BCG13D Device Performance P1dB-Gain P1 Gain OIP3 http: //www.berex.com BeRex ACPR BCG13D S-Parameter (Vdevice = 5.0V, Icc = 69mA, T = 25 °C, calibrated to device leads) Freq [MHz] 100 500 1000 1500 2000 2500 3000 3500 4000 S11 [dB] -4.678 -11.610 -12.057 -13.053 -9.849 -12.146 -13.490 -9.805 -11.035 S11 [Ang] -25.54 -16.90 -12.98 16.38 17.27 -27.86 -123.12 -167.89 -160.29 S21 [dB] 25.672 25.427 24.828 23.968 22.767 21.639 20.413 19.346 18.256 S21 [Ang] 176.84 159.35 141.93 124.40 109.52 96.24 84.08 73.06 63.61 S12 [dB] -35.909 -30.250 -29.445 -30.025 -29.185 -28.649 -29.741 -28.948 -24.947 S12 [Ang] 77.16 -25.07 50.31 -114.05 -159.59 158.92 116.90 77.73 32.85 S22 [dB] -1.418 -6.267 -8.236 -12.494 -12.806 -11.873 -9.756 -8.579 -14.089 S22 [Ang] 173.59 29.56 -7.08 -26.17 -17.49 -64.24 -130.88 -170.03 -165.34 * Note : S-parameter includes 1 mil thick and 16-mil long Au wire http: //www.berex.com BeRex Die Outline NOTES: BCG13D 1) DIE THICKNESS 100um 2) BONDPAD METAL THICKNESS 2.8um 3) BACKSIDE METAL Au, 5um 4) DEVICE IS GROUNDED THROUGH VIA HOLES ESD Rating ESD Rating: Value: Test: Standard: Class 1C Passes