BeRex 1500-4000 MHz Medium Power Amplifier Device Features
• 45.0 dBm Output IP3 at 13dBm/tone • 15.0 dB Gain at 1900MHz • 27.5 dBm P1dB at 1900 MHz • Patented Over Voltage Protection Circuit •Application: commercial
BCT013
Target Device Performance (Ta = 25°C) Symbols
Gain
Parameters Test Conditions
1900MHz 2140MHz 2400MHz 3500MHz 1900MHz 2140MHz 2400MHz 3500MHz 1900MHz 2140MHz 2400MHz 3500MHz 1900MHz 2140MHz 2400MHz 3500MHz 1900MHz 2140MHz 2400MHz 3500MHz 1900MHz 2140MHz 2400MHz 3500MHz Vc = 5.0V Thermal Resistance
Min
14.0 13.0 12.2 9.7
Typ
15.1 14.0 13.3 10.7 -17.3 -12.0 -12.8 -25.3 -12.8 -12.0 -12.9 -25.3 45.0 45.2 43.1 40.2 27.5 27.1 27.2 25.9 6.8
Max
Unit
dB
S11
dB
S22
dB
OIP3
P1dB
42 42 40 37 26.5 26.2 26.0 25.0
dBm
dBm
NF Ic Vc Rth
dB 158 mA V °C/W
118
138 5.0 50
Test conditions unless otherwise noted. 1. T = 25°C, Vdevice = 5.0V, 50 ohm system. 2. OIP3 is measured on an eval-board with two tones separated by 1 MHz.
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BeRex
Absolute Maximum Ratings Parameter
Operating Case temperature Storage Temperature Junction Temperature Supply Voltage Input RF Power
BCT013
Rating
-40 to +85°C -40 to +155°C +250°C 7V 23dBm
Operation of this device above any of these parameters may result in permanent damage.
S-parameters (Vc=5V, Ic=138mA, T=25°C)
Typical Device Data
-25 -30 -35
S(1,1)
m2 freq=4.000GHz m1 freq=50.00MHz
S12 [dB]
-40 -45 -50 -55 0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Frequency [GHz]
freq (50.00MHz to 4.000GHz)
14 12 10 S21 [dB] 8
S(2,2)
m2 freq=4.000GHz
6 4 2 0 -2 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
m1 freq=50.00MHz
Frequency [GHz]
freq (50.00MHz to 4.000GHz)
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BeRex
BCT013
S-parameter test circuit
Generic PF083 Evaluation Board
I-V Characteristics
PCB 31mil thick FR-4
• Current drop in between 5~6V is due to patented protection circuit.
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BeRex S-Parameter (5V/135mA)
Freq [MHz] 100 500 1000 1500 2000 2500 3000 3500 4000 S11 [Mag] -0.046 -0.952 -1.111 -0.928 -1.240 -1.390 -1.669 -1.989 -2.281 S11 [Ang] -30.149 -116.77 -162.01 157.99 129.31 104.6 82.694 60.455 37.752 S21 [Mag] 2.219 6.737 13.26 10.718 9.181 8.334 6.491 6.124 5.024 S21 [Ang] -128.4 -174.18 161.56 121.35 101.55 81.201 66.725 51.795 33.795 S12 [Mag] -41.958 -32.703 -32.513 -30.171 -28.599 -26.76 -26.706 -25.792 -24.653 S12 [Ang] 66.107 25.318 76.255 46.516 42.527 37.808 32.623 26.141 20.698 S22 [Mag] -3.497 -3.457 -7.557 -7.780 -7.262 -7.180 -7.38 -7.336 -6.823
BCT013
S22 [Ang] 165.97 162.64 117.5 127.17 116.25 97.537 74.648 50.666 32.131
Application Circuit: 1900 MHz
Schematic Diagram
Vcc
BOM C1 100pF
Tolerance ±5% ±5% ±15% ±5% ±5% ±5% ±5% ±5%
L1
C1
C2
C3
C2 1000pF C3 C4 C5 10uF 22pF 22pF 3.0pF 0.5pF 100nH
BT013 RF In C4 C6 C7 C5 RF Out
C6 C7 L1
Note: 1. Chip is mounted on the PF083 open PKG, and bonded with 2-wires at both input and output. 2. PCB: 31mil thick FR4 3. Distance between the center of the shunt cap(C6) and the input pin of BT013 is 3.2mm 4. Distance between the center of the shunt cap(C7) and the output pin of BT03 is 8.3mm
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BeRex Typical Performance
BCT013
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BeRex
BCT013
Application Circuit: 2100 MHz
Schematic Diagram
Vcc
C1
BOM 100pF
Tolerance ±5% ±5% ±15% ±5% ±5% ±5% ±5% ±5%
L1
C1
C2
C3
C2 1000pF C3 C4 10uF 24pF 24pF 3pF 0.5pF 33nH
BT013 RF In C4 C6 C7 C5 RF Out
C5 C6 C7 L1 Note:
1. Chip is mounted on the PF083 open PKG, and bonded with 2-wires at Both input and output. 2. PCB: 31mil thick FR4 3. Distance between the center of the shunt cap(C6) and the input pin of BT013 is 1.5mm 4. Distance between the center of the shunt cap(C7) and the output pin of BT03 is 6.4mm
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BeRex
BCT013
Typical Performance
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BeRex
BCT013
Application Circuit: 2400MHz
Schematic Diagram C1 C3 C4 C5 C6 C7 L1 Note: 1. Chip is mounted on the PF083 open PKG, and bonded with 2-wires at Both input and output. 2 PCB: 31mil thick FR4 3 Distance between the center of the shunt cap(C6) and the input pin of BT013 is 0.7mm 4 Distance between the center of the shunt cap(C7) and the output pin of BT03 is 3.2mm BOM 100pF 10uF 100pF 100pF 2pF 0.5pF 33nH C2 1000pF Tolerance ±5% ±5% ±15% ±5% ±5% ±5% ±5% ±5%
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BeRex Typical Performance
BCT013
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BeRex
BCT013
Application Circuit: 3500MHz
Schematic Diagram C1 C2 C3 C4 C6 C7 C8 L1 BOM 22pF 0.75pF 0.5pF 100pF 10uF 0.5pF 22pF 33nH Tolerance ±5% ±5% ±5% ±5% ±5% ±20% ±5% ±5% ±5%
C5 1000pF
Note: 1. Chip is mounted on the PF083 open PKG, and bonded with 2-wires at both input and output. 2 PCB: 31mil thick FR4 3 Distance between the center of the shunt cap(C2) and the input pin of BT013 is 10mm 4 Distance between the center of the series cap(C3) and the input pin of BT013 is 4mm 5 Distance between the center of the shunt cap(C7) and the output pin of BT03 is 3mm
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BeRex Typical Performance
BCT013
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BeRex
BCT013
Die Outline
NOTES: 1) DIE THICKNESS 100um 2) BONDPAD METAL THICKNESS 2.8um 3) BACKSIDE METAL Au, 5um 4) DEVICE IS GROUNDED THROUGH VIA HOLES
MSL / ESD Rating
ESD Rating Value Test Standard MSL Rating Standard http: //www.berex.com Class 1 Passes
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