BD09B

BD09B Dedicated Band 2-Way SMT Power Divider 700~1000MHz Cellular & GSM900 Device Features     Typical Isolation = 23 dB Typical Insertion Loss = 0.5 dB MSL 1 moisture rating Lead-free/RoHS-compliant SOIC-8 Plastic Package With exposed back side ground pad Typical Performance1 Parameter Frequency Range Insertion Loss Isolation IRL(S11) ORL(S22/S33) Amplitude Balance Phase Balance Min 700 0.5 15 23 -20 -23 0.05 0.2 -15 -15 0.2 0.5 Typical Max 1000 0.8 Unit MHz dB dB dBm dBm dB deg Product Description BeRex’s Divider BD09B is designed for Cellular & GSM band with low Insertion Loss and Isolation. This chip is fully passivated for enhanced performance and reliability and packaged in RoHS-compliant with SOIC-8 surface mount package. It can be used without back side ground soldering. (This may degrade the performance at the high frequency edge.) *All specifications apply to the following test conditions, 1. Device performance _ measured on BeRex E/B at 25°C, 50ohm system. 2. Insertion Loss: Above 3.0dB. 3. Back side ground _ soldered. Applications  Base station Infrastructure  Commercial/Industrial/Military wireless system Absolute Maximum Ratings Parameter Input Power Storage Temperature Operating Temperature Rating 1W CW dBm -55 to +155°C -40 to +85°C Operation of this device above any of these parameters may result in permanent damage. Evaluation Board Drawing Function Block Diagram Pins 1,3,4,6 and 7 must be DC and RF grounded. BeRex ● website: www.berex.com ● email: sales@berex.com 1 Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark o f BeRex. All other trademarks are the property of their respective owners. © 2010 BeRex Rev. C BD09B Dedicated Band 2-Way SMT Power Divider 700~1000MHz Cellular & GSM900 Typical Test Data With Back Side Ground Soldering Parameters Frequency Range Insertion Loss Isolation IRL(S11) ORL(S22,S33) Phase Diff. Amplitude Balance Unit MHz dB dB dB dB deg dB 700 0.48 16.7 -19.5 -21.9 0.1 0.00 750 0.50 20.6 -21.8 -25.4 0.2 0.00 Cellular & GSM900 800 0.49 25.4 -23.8 -28.1 0.2 0.01 850 0.52 27.0 -24.2 -26.2 0.2 0.01 900 0.54 22.9 -22.0 -22.8 0.3 0.02 950 0.59 19.5 -19.2 -20.0 0.4 0.01 1000 0.65 17.1 -16.8 -17.9 0.4 0.01 Without Back Side Ground Soldering Parameters Frequency Range Insertion Loss Isolation IRL(S11) ORL(S22,S33) Phase Diff. Amplitude Balance Unit MHz dB dB dB dB deg dB 700 0.46 16.4 -19.6 -21.8 0.4 0.01 750 0.49 20.2 -21.8 -25.3 0.5 0.02 Cellular & GSM900 800 0.48 25.1 -23.8 -28.3 0.6 0.02 850 0.49 28.3 -23.5 -26.5 0.5 0.02 900 0.52 23.9 -21.2 -22.9 0.7 0.02 950 0.58 20.1 -18.5 -20.1 0.6 0.03 1000 0.64 17.5 -16.1 -17.9 0.6 0.03 BeRex ● website: www.berex.com ● email: sales@berex.com 2 Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark o f BeRex. All other trademarks are the property of their respective owners. © 2010 BeRex Rev. C BD09B Dedicated Band 2-Way SMT Power Divider 700~1000MHz Cellular & GSM900 Insertion Loss vs. Frequency Isolation vs. Frequency IRL vs. Frequency ORL vs. Frequency Notes) - BG: Data taken with backside ground soldering - NBG: Data taken without backside ground soldering BeRex ● website: www.berex.com ● email: sales@berex.com 3 Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark o f BeRex. All other trademarks are the property of their respective owners. © 2010 BeRex Rev. C BD09B Dedicated Band 2-Way SMT Power Divider 700~1000MHz Cellular & GSM900 Package Outline Drawing BeRex ● website: www.berex.com ● email: sales@berex.com 4 Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark o f BeRex. All other trademarks are the property of their respective owners. © 2010 BeRex Rev. C BD09B Dedicated Band 2-Way SMT Power Divider 700~1000MHz Cellular & GSM900 Suggested PCB Land Pattern and PAD Layout PCB Land Pattern 0.047"(1.20) PCB Mounting RF In 0.018"(0.45) 0.076"(1.92) 0.157"(3.98) 0.040"(1.01) RF Out1 0.030"(0.76) 0.198"(5.02) RF Out2 Note : All dimension _ millimeters PCB lay out _ on BeRex website Tape & Reel Packaging information: SOIC8 SOIC8-Part orientation Tape Width (mm): 12 Reel Size (inches): 7 Device Cavity Pitch (mm): 8 Direction of feed Devices Per Reel: 1000 Lead plating finish 100% Tin Matte finish (All BeRex products undergoes a 1 hour, 150 degree C, Anneal bake to eliminate thin whisker growth concerns.) MSL / ESD Rating MSL Rating: Standard: Level 3 at +265°C convection reflow JEDEC Standard J-STD-020 NATO CAGE code: 2 BeRex N 9 6 F ● email: sales@berex.com 5 ● website: www.berex.com Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark o f BeRex. All other trademarks are the property of their respective owners. © 2010 BeRex Rev. C