BD23B_1

BD23B Dual Band 2-Way SMT Power Divider 1900~2500MHz PCS, WCDMA & TD-SCDMA, WiBro Device Features     Typical Isolation = 25 dB Typical Insertion Loss = 0.4 dB MSL 1 moisture rating Lead-free/RoHS-compliant SOIC-8 Plastic Package With exposed back side ground pad Typical Performance1 Parameter Frequency Range Insertion Loss Isolation IRL(S11) ORL(S22/S33) Amplitude Balance Phase Balance Min 1900 0.4 15 25 -23 -25 0.05 0.5 -15 -15 0.2 1.0 Typical Max 2500 0.8 Unit MHz dB dB dBm dBm dB deg Product Description BeRex’s Divider BD23B is designed for PCS, WCDMA & TD-SCDMA and WiBro band with low Insertion Loss and Isolation. This chip is fully passivated for enhanced performance and reliability and packaged in RoHScompliant with SOIC-8 surface mount package. It can be used without back side ground soldering. (This may degrade the performance at the high frequency edge.) *All specifications apply to the following test conditions, 1. Device performance _ measured on BeRex E/B at 25°C, 50ohm system. 2. Insertion Loss: Above 3.0dB. 3. Back side ground _ soldered. Applications  Base station Infrastructure  Commercial/Industrial/Military wireless system Absolute Maximum Ratings Parameter Input Power Storage Temperature Operating Temperature Rating 1W CW dBm -55 to +155°C -40 to +85°C Operation of this device above any of these parameters may result in permanent damage. Evaluation Board Drawing Function Block Diagram Pins 1,3,4,6 and 7 must be DC and RF grounded. BeRex ● website: www.berex.com ● email: sales@berex.com 1 Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark o f BeRex. All other trademarks are the property of their respective owners. © 2010 BeRex Rev. C BD23B Dual Band 2-Way SMT Power Divider 1900~2500MHz PCS, WCDMA & TD-SCDMA, WiBro Typical Test Data With Back Side Ground Soldering Parameters Frequency Range Insertion Loss Isolation IRL(S11) ORL(S22,S33) Phase Diff. Amplitude Balance Unit MHz dB dB dB dB deg dB WCDMA & TD-SCDMA 1900 0.38 18.7 -21.4 -20.9 0.0 0.03 2075 0.39 21.6 -26.7 -24.5 0.2 0.04 2250 0.44 25.8 -25.2 -23.0 0.3 0.06 2200 0.42 24.2 -27.0 -23.7 0.3 0.05 WiBro 2350 0.46 28.5 -21.6 -21.6 0.5 0.06 2500 0.54 23.8 -17.4 -20.8 0.7 0.09 Without Back Side Ground Soldering Parameters Frequency Range Insertion Loss Isolation IRL(S11) ORL(S22,S33) Phase Diff. Amplitude Balance Unit MHz dB dB dB dB deg dB WCDMA & TD-SCDMA 1900 0.36 19.2 -24.2 -22.3 1.7 0.07 2075 0.38 22.2 -26.0 -25.0 1.6 0.06 2250 0.45 25.7 -20.4 -21.9 1.7 0.07 2200 0.42 24.7 -22.1 -22.8 1.7 0.07 WiBro 2350 0.49 25.8 -17.6 -20.4 1.7 0.06 2500 0.6 20.5 -14.2 -19.3 1.8 0.06 BeRex ● website: www.berex.com ● email: sales@berex.com 2 Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark o f BeRex. All other trademarks are the property of their respective owners. © 2010 BeRex Rev. C BD23B Dual Band 2-Way SMT Power Divider 1900~2500MHz PCS, WCDMA & TD-SCDMA, WiBro Insertion Loss vs. Frequency Isolation vs. Frequency IRL vs. Frequency ORL vs. Frequency Notes) - BG: Data taken with backside ground soldering - NBG: Data taken without backside ground soldering BeRex ● website: www.berex.com ● email: sales@berex.com 3 Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark o f BeRex. All other trademarks are the property of their respective owners. © 2010 BeRex Rev. C BD23B Dual Band 2-Way SMT Power Divider 1900~2500MHz PCS, WCDMA & TD-SCDMA, WiBro Package Outline Drawing BeRex ● website: www.berex.com ● email: sales@berex.com 4 Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark o f BeRex. All other trademarks are the property of their respective owners. © 2010 BeRex Rev. C BD23B Dual Band 2-Way SMT Power Divider 1900~2500MHz PCS, WCDMA & TD-SCDMA, WiBro Suggested PCB Land Pattern and PAD Layout PCB Land Pattern 0.047"(1.20) PCB Mounting RF In 0.018"(0.45) 0.076"(1.92) 0.157"(3.98) 0.040"(1.01) RF Out1 0.030"(0.76) 0.198"(5.02) RF Out2 Note : All dimension _ millimeters PCB lay out _ on BeRex website Tape & Reel Packaging information: SOIC8 SOIC8-Part orientation Tape Width (mm): 12 Reel Size (inches): 7 Device Cavity Pitch (mm): 8 Direction of feed Devices Per Reel: 1000 Lead plating finish 100% Tin Matte finish (All BeRex products undergoes a 1 hour, 150 degree C, Anneal bake to eliminate thin whisker growth concerns.) MSL / ESD Rating MSL Rating: Standard: Level 3 at +265°C convection reflow JEDEC Standard J-STD-020 NATO CAGE code: 2 BeRex N 9 6 F ● email: sales@berex.com 5 ● website: www.berex.com Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark o f BeRex. All other trademarks are the property of their respective owners. © 2010 BeRex Rev. C