BT301
500‐4000 MHz High Power Amplifier
Device Features
OIP3 = 49.0 dBm @ 1900 MHz Gain = 12.5 dB @ 1900 MHz Output P1 dB = 30.3 dBm @ 1900 MHz 50 Ω Cascadable Patented Over Voltage Protec on Circuit Lead‐free/RoHS‐compliant SOIC 8 SMT package Typical Performance1
Parameter Gain S11 S22 OIP32 P1dB
IS‐95C ACPR WCDMA ACLR
1 2
YY = Year, WW = Work week, XX = Wafer Number
Product Descrip on BeRex’s BT301 is a high power and a high dynamic range amplifier in a low cost sur‐ face mount package(SOIC‐8) with a RoHS‐ compliant, that incorporates reliable hetero‐ junc on‐bipolar‐transistor (HBT) devices fabricated with InGaP GaAs technology. This device is designed for use where high linearity is required and features high OIP3 and Power with low consump on current (350mA) and requires a few external match‐ ing components such as a DC blocking ca‐ pacitors on the In/Output pin, a bypass ca‐ pacitor and a RF choke for the out port. All devices are 100% RF/DC tested. Applica ons
Frequency 900 18.5 ‐15.0 ‐7.0 49.0 29.5 22.5 ‐ 8.5 1900 12.5 ‐18.0 ‐12.0 49.0 30.3 22.5 ‐ 8.6 2140 11.5 ‐18.0 ‐12.0 47.0 30.3 ‐ 21.0 7.5 2450 10.5 ‐12.0 ‐11.0 49.0 30.3 ‐ 21.0 7.5
Unit MHz dB dB dB dBm dBm dBm dBm dB
Noise Figure Device performance _ measured on a BeRex evalua
*ACPR&ACLR CH Power _ measured at 50dBc.
on board at 25°C, 50 Ω system.
OIP3 _ measured with two tones at an output of 16 dBm per tone separated by 1 MHz.
*ACPR Test set‐up: IS‐95 CDMA, 9Ch. FWD, +885KHz offset. *ACLR Test set‐up: 3GPP WCDMA, TM1+64DPCH, +5MHz offset.
Base sta on Infrastructure/RFID Bandwidth Commercial/Industrial/Military wireless system IC @ (Vc = 5V) VC Applica on Circuits RTH
Min. 500 310
Typical Max. 4000 350 390 5.0 19.6
Unit MHz mA V °C/W
Absolute Maximum Ra ngs
Parameter Opera ng Case Temperature Storage Temperature Junc on Temperature Opera ng Voltage Supply Current Input RF Power Ra ng ‐40 to +85 ‐55 to +155 +220 +6.0 600 28 Unit °C °C °C V mA dBm
*external matching circuit: refer to the page 4 to 11.
*Opera on of this device above any of these parameters may result in permanent damage.
1 BeRex ●website: www.berex.com ● email: sales@berex.com Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex.
All other trademarks are the property of their respec ve owners. © 2010 BeRex
Rev. C
BT301
500‐4000 MHz High Power Amplifier
V‐I Characteris cs
BeRex SOT89 Evalua on Board
*Dielectric constant _ 4.2 *RF pa
ern width 52mil *31mil thick FR4 PCB
Typical Device Data
S‐parameters (Vc=5V, Ic=340mA, T=25°C)
2 BeRex ●website: www.berex.com ● email: sales@berex.com Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex.
All other trademarks are the property of their respec ve owners. © 2010 BeRex
Rev. C
BT301
500‐4000 MHz High Power Amplifier
S‐Parameter
(Vdevice = 5.0V, Icc = 340mA, T = 25 °C, calibrated to device leads) Freq [MHz] 100 500 1000 1500 2000 2500 3000 3500 4000 S11 [Mag] 0.842 0.895 0.893 0.870 0.852 0.840 0.841 0.850 0.879 S11 [Ang] ‐178.0 157.3 130.8 106.2 82.2 58.8 35.6 12.5 ‐6.4 S21 [Mag] 11.489 4.894 2.766 1.658 1.512 1.047 0.888 0.840 0.542 S21 [Ang] 131.4 104.8 83.9 75.1 64.0 47.2 50.8 36.8 24.0 S12 [Mag] 0.019 0.023 0.022 0.025 0.027 0.026 0.029 0.031 0.031 S12 [Ang] 18.2 10.6 9.8 21.7 21.5 21.6 16.4 23.4 16.3 S22 [Mag] 0.534 0.659 0.754 0.773 0.761 0.773 0.792 0.659 0.634 S22 [Ang] ‐134.7 ‐176.7 160.4 139.8 120.1 101.7 83.2 62.6 41.3
3 BeRex ●website: www.berex.com ● email: sales@berex.com Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex.
All other trademarks are the property of their respec ve owners. © 2010 BeRex
Rev. C
BT301
500‐4000 MHz High Power Amplifier
Applica on Circuit: 900 MHz
Schema c Diagram C1 C2 C3 C4 C5 C6 C7 C8 R1 L1 L2 BOM 10uF 1.0nF 100pF 3pF 100pF 4.7pF 5.0pF 2.7pF 12ohm 56nH 4.7nH No ce
1. PCB: 31mil thick FR4 2. Distance between the center of the shunt Induc‐ tor(C6) and the input pin of BT301 _ 5.6 mm.
Tolerance ±20% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5%
PCB Diagram
3. Distance between the center of the shunt cap. (C7) and the output pin of BT301 _ 12 mm. ※ BT301 with both input and output ports opened simultaneously may cause instability. Please See an applica on note or contact company for applica on support.
4 BeRex ●website: www.berex.com ● email: sales@berex.com Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex.
All other trademarks are the property of their respec ve owners. © 2010 BeRex
Rev. C
BT301
500‐4000 MHz High Power Amplifier
Typical Performance
5 BeRex ●website: www.berex.com ● email: sales@berex.com Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex.
All other trademarks are the property of their respec ve owners. © 2010 BeRex
Rev. C
BT301
500‐4000 MHz High Power Amplifier
Typical Performance
6 BeRex ●website: www.berex.com ● email: sales@berex.com Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex.
All other trademarks are the property of their respec ve owners. © 2010 BeRex
Rev. C
BT301
500‐4000 MHz High Power Amplifier
Applica on Circuit: 1900 MHz
Schema c Diagram C1 C2 C3 C4 C5 C6 C7 C8 R1 L1 L2 BOM 10uF 1nF 100pF 100pF 100pF 3pF 2.5pF 2.5pF 12 ohm 56nH 6.8nH No ce Tolerance ±20% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5%
PCB Diagram
1. PCB: 31mil thick FR4 2. Distance between the center of the series cap. (C8) and the input pin of BT301 _ 1.6 mm.
3. Distance between the center of the shunt cap. (C6) and the input pin of BT301 _ 4.0 mm. 4. Distance between the center of the shunt cap. (C7) and the output pin of BT301 _ 2.5 mm.
7 BeRex ●website: www.berex.com ● email: sales@berex.com Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex.
All other trademarks are the property of their respec ve owners. © 2010 BeRex
Rev. C
BT301
500‐4000 MHz High Power Amplifier
Typical Performance
8 BeRex ●website: www.berex.com ● email: sales@berex.com Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex.
All other trademarks are the property of their respec ve owners. © 2010 BeRex
Rev. C
BT301
500‐4000 MHz High Power Amplifier
9 BeRex ●website: www.berex.com ● email: sales@berex.com Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex.
All other trademarks are the property of their respec ve owners. © 2010 BeRex
Rev. C
BT301
500‐4000 MHz High Power Amplifier
Applica on Circuit: 2140MHz
Schema c Diagram C1 C2 C3 C4 C5 C6 C7 C8 C9 R1 L1 L2 BOM 10uF 1nF 100pF 100pF 100pF 2.5pF 1.8pF 1.8pF 5.0pF 12 ohm 56nH 4.7nH No ce Tolerance ±20% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5%
PCB Diagram
1. PCB: 31mil thick FR4 2. Distance between the center of the shunt cap. (C8) and the input pin of BT301 _ 1.6 mm.
3. Distance between the center of the shunt cap. (C6) and the input pin of BT301 _ 3.0 mm. 4. Distance between the center of the shunt cap. (C7) and the output pin of BT301 _ 2.5 mm.
10 BeRex ●website: www.berex.com ● email: sales@berex.com Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex.
All other trademarks are the property of their respec ve owners. © 2010 BeRex
Rev. C
BT301
500‐4000 MHz High Power Amplifier
Typical Performance
11 BeRex ●website: www.berex.com ● email: sales@berex.com Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex.
All other trademarks are the property of their respec ve owners. © 2010 BeRex
Rev. C
BT301
500‐4000 MHz High Power Amplifier
12 BeRex ●website: www.berex.com ● email: sales@berex.com Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex.
All other trademarks are the property of their respec ve owners. © 2010 BeRex
Rev. C
BT301
500‐4000 MHz High Power Amplifier
Applica on Circuit: 2450MHz
Schema c Diagram C1 C2 C3 C4 C5 C6 C7 C8 R1 L1 L2 BOM 10uF 1nF 100pF 100pF 100pF 1.5pF 1.5pF 1.8pF 12 ohm 56nH 3.9nH No ce Tolerance ±20% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5%
PCB Diagram
1. PCB: 31mil thick FR4 2. Distance between the center of the series cap. (C8) and the input pin of BT301 _ 1.6 mm.
3. Distance between the center of the shunt cap. (C6) and the input pin of BT301 _ 3.4 mm. 4. Distance between the center of the shunt cap. (C7) and the output pin of BT301 _ 2.0 mm.
13 BeRex ●website: www.berex.com ● email: sales@berex.com Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex.
All other trademarks are the property of their respec ve owners. © 2010 BeRex
Rev. C
BT301
500‐4000 MHz High Power Amplifier
Typical Performance
14 BeRex ●website: www.berex.com ● email: sales@berex.com Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex.
All other trademarks are the property of their respec ve owners. © 2010 BeRex
Rev. C
BT301
500‐4000 MHz High Power Amplifier
15 BeRex ●website: www.berex.com ● email: sales@berex.com Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex.
All other trademarks are the property of their respec ve owners. © 2010 BeRex
Rev. C
BT301
500‐4000 MHz High Power Amplifier
Package Outline Dimension
16 BeRex ●website: www.berex.com ● email: sales@berex.com Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex.
All other trademarks are the property of their respec ve owners. © 2010 BeRex
Rev. C
BT301
500‐4000 MHz High Power Amplifier
Suggested PCB Land Pa ern and PAD Layout
PCB Land Pa ern PCB Moun ng
Note : All dimension are in millimeters PCB lay out _ on BeRex website
Lead pla ng finish
100% Tin Ma e finish
(All BeRex products undergoes a 1 hour, 150 degree C, Anneal bake to eliminate thin whisker growth concerns.)
MSL / ESD Ra ng
ESD Ra ng: Value: Test: Standard: MSL Ra ng: Standard: Class 1B Passes
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