SMA

SMA

  • 厂商:

    BILIN(银河)

  • 封装:

  • 描述:

    SMA - SURFACE MOUNT RECTIFIER - Galaxy Semi-Conductor Holdings Limited

  • 详情介绍
  • 数据手册
  • 价格&库存
SMA 数据手册
BL FEATURES GALAXY ELECTRICAL S2AA --- S2MA 111REVERSE VOLTAGE: 50 --- 1000 V CURRENT: 1.5 A SURFACE MOUNT RECTIFIER Plastic package has underwriters laboratory 111 flammability classification 94V-0 For surface mounted applications Low profile package Built-in strain relief,ideal for automated placement Glass passivated chip junction High temperature soldering: 111 250oC/10 seconds at terminals DO - 214AC(SMA) MECHANICAL DATA Case:JEDEC DO-214AC,molded plastic over 1111passivated chip Terminals:Solder Plated, solderable per MIL-STD1111750, Method 2026 Polarity: Color band denotes cathode end Weight: 0.002 ounces, 0.064 gram inch(mm) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25oC ambient temperature unless otherwise specified S2AA Device marking code Maximum recurrent peak reverse voltage Maximum RMS voltage Maximum DC Blocking Voltage Maximum average forw ord rectified current V @ TL=90OC Peak forw ard surge current @ TL = 110°C 8.3ms V single half-sine-w ave superimposed on rated V load(JEDEC Method) Maximum Instantaneous forw ard voltage at 1.5A Maximum DC reverse current @TA=25oC S2BA S2DA SBA 100 70 100 S2GA S2JA S2KA S2MA UNITS SGA 400 280 400 1.5 50 1.15 5.0 125 SAA VRRM VRWS VDC IF(AV) IFSM VF IR CJ R JA SDA 200 140 200 SJA 600 420 600 SKA 800 560 800 SMA 1000 700 1000 V V V A A V 50 35 50 at rated DC blockjing voltage @TA=125oC Typical junction capacitance (NOTE 2) Typical thermal resitance (NOTE 3) 20 50 -55--------+150 o pF C/W o Operating junction and storage temperature range TJTSTG NOTE: 1.Reverse recovery time test conditions:IF=0.5A,I R=1.0A,I rr=0.25A C www.galaxycn.com 2. Measured at 1.0MHz and applied rev erse v oltage of 4.0 Volts 3. Thermal resistance f rom junction to ambient and junction to lead P.C.B.mounted on 0.27''X0.27''(7.0X7.0mm2) copper pad areas Document Number 0280005 BLGALAXY ELECTRICAL 1. RATINGS AND CHARACTERISTIC CURVES FIG.1 -- FORWARD DERATING CURVE PEAK FORWARD SURGE CURRENT,AMPERES Resistive or inductive Load S2AA---S2MA FIG.2 PEAK FORWARD SURGE CURRENT 80 70 60 50 40 30 20 10 0 1 2 4 8 10 AVERAGE FORWARD CURRENT,AMPERES 1.5 TJ=50℃ 8.3ms Single Half Sine-Wave 0.75 60Hz Resistive or Inductive load P.C.B.MOUNTED 0.27''X0.27''(7.0X7.0mm) THICK COPPERPAND AREAS 0 50 60 70 80 90 100 110 120 130 140 150 20 40 60 80 100 LEAD TEMPERATURE NUMBER OF CYCLES AT 60Hz FIG.3 -- TYPICAL FORWARD CHARACTERISTICS INSTANTANEOUS FORWARD CURRENT,AMPERES INSTANTANEOUS REVERSE CURRENT,MICROAMPERES 100 FIG.4 -- TYPICAL REVERSE CHARACTERISTICS 100 10 10 TJ=125 C O 1 TJ=25 C O 1 TJ=75 C O 0.1 0.1 Puise Width=300 S 1%DUTY CYCLE 0.01 TJ=25OC 0.01 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.001 0 20 40 60 80 100 INSTANTANEOUS FORWARD VOLTAGE,VOLTS PERCENT OF RATED PEAK REVERSE VOLTAGE, FIG.5-TYPICAL JUNCTION CAPACITANCE JUNCTION CAPACITANCE pF 100 60 40 20 10 f=1MHz TJ=25 4 2 1 .1 .2 .4 1.0 2 4 10 20 40 100 REVERSE VOLTAGE,VOLTS www.galaxycn.com Document Number 0280005 BLGALAXY ELECTRICAL 2.
SMA
1. 物料型号: - S2AA、S2BA、S2DA、S2GA、S2JA、S2KA、S2MA

2. 器件简介: - 表面贴装整流器,具有塑料封装,UL94V-0阻燃等级,适用于表面贴装应用,玻璃钝化芯片结构,内置应力消除功能,适合自动化放置,可承受250°C/10秒的高温焊接,低轮廓封装。

3. 引脚分配: - 焊盘:镀锡,符合MIL-STD-750方法2026的可焊性标准,极性:色带表示阴极端,重量:0.002盎司,0.064克,外壳:JEDEC DO-214AC,模塑塑料覆盖钝化芯片。

4. 参数特性: - 最大重复峰值反向电压(VRRM):50V至1000V不等 - 最大RMS电压(VRMS):35V至700V不等 - 最大直流阻断电压(Voc):50V至1000V不等 - 最大平均整流电流@T=90°C(IF(AV)):1.5A - 峰值正向浪涌电流@T=110°C,8.3ms单半正弦波叠加在额定负载上(JEDEC方法):IFSM 50A - 最大瞬时正向电压在1.5A时(VF):1.15V - 最大直流反向电流@TA=25°C在额定直流阻断电压@TA=125°C时(IR):5.0uA - 典型结电容(CJ):20pF - 典型热阻(RJA):50°C/W

5. 功能详解: - 该器件为表面贴装整流器,具有多种反向电压等级,适用于不同的电流和电压要求,具有低正向电压降和高浪涌电流能力。

6. 应用信息: - 适用于需要高可靠性和高性能整流的应用场合,如电源、电机驱动等。

7. 封装信息: - 封装类型为DO-214AC(SMA),这是一种小尺寸的表面贴装封装,适合自动化装配。

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