170

MODEL 170 Custom Power Modules C USTOM POWER MODULES DESCRIPTION BI’s Custom Power Modules are designed to assemble all of your circuit’s power components into one, easy to manage, package. Power modules offer a low cost method to improve the circuit density. These modules will also reduce the assembly labor by eliminating insulating pads and reducing the individual bolting of discreet power semiconductors. BI offers power module designs that FEATURES AND BENEFITS allow the module to be soldered to the circuit board at the same time as the other components, eliminating hand soldering operations. Power modules allow the use of a simpler and less expensive heat sink. All the power components normally bolted to the heat sink should be included in the custom module. TYPICAL APPLICATIONS • • • • • Low cost custom modules Reduced circuit size Allows simplified heat sink Soldering technique minimizes voids Flexible package dimensions • • • • • • Power supply subassemblies Motor driver Power amplifier H-Bridge Bridge rectifier Ganged power FETs PACKAGING Package Size Package, Typical Package Configurations Custom packaging from 0.3” to 4.0” on a side. Heat sink attachment and heat transfer. Ceramic substrate, typically copper clad to promote heat transfer. Base with mounted components is assembled into a custom frame and encapsulated. 7 Specifications subject to change without notice. 7-13 Model 170 ELECTRICAL Semiconductor Components Capacitors Other Components MECHANICAL BJTs, FETs, Diodes, SCRs, IGBTs Ceramic and tantalum Resistors, thermisters and various surface mount/solder mount components Substrate Interconnect Layers Interconnect Material Die Attach Package Construction ENVIRONMENTAL Alumina, beryllia, aluminum nitride, aluminum, copper 1 (crossover layers possible) Copper Solder attached, aluminum & gold wire bonding Substrate base with plastic frame Custom power modules are typically designed to operate over a temperature range of -40°C to +125°C. 7-14 Model 170