BB1110RC7

MODEL BB1110RC Resistor capacitor network Thick film resistors Ceramic chip capacitors DISCRIPTION DISCRIPTION Model BB1110RC is designed for terminating high-speed memory buses. Ideally suited for local decoupling of data line drivers. These specialty networks employ solder balls for surface mount flip chip attachment. Their unique construction yields extremely low capacitance and inductance parasitics critical for these high-speed applications. FEATURES FEATURES • • • • • Integrated resistor and capacitor network High density packaging High temperature solder balls Industry standard ball diameter and pitch Excellent high frequency performance SCHEMATIC SCHEMATIC C1-9 = 0.1uF R1-9 = 50 ELECTRICAL ELECTRICAL1 Resistance Tolerance Capacitance Tolerance Capacitor Type Capacitor Maximum Voltage TCR Operating Temperature Range Maximum Resistor Power Package Power Rating ± 1% ± 10% X5R 10 volts 200 ppm/°C -55°C to +85°C 0.05 watts at 70°C 1.0 watt @ 70°C 1 Specifications subject to change without notice. BI Technologies Corporation 4200 Bonita Place, Fullerton, CA 92835 USA Phone: 714 447 2345 August 30, 2005 Website: www.bitechnologies.com page 1 of 2 BI technologies MODEL BB1110RC MECHANICAL Solder Ball Finish Solder Ball Co-planarity Substrate Material Resistor Material SnPb 10/90 0.15 mm Al2O3 Cermet ORDERING ORDERING INFORMATION2 BB BB 1 1 10 RC 7 Model Series Channels: 9 Solder ball Pitch: 1.0 mm Tape Reel packing Resistor Capacitor Network Nominal: 50 ohms / 0.1uf PACKING PACKING INFORMATION Tape reel suffix (also reel size in inches) Part count/reel 7 750 13 3000 OUTLINE OUTLINE DRAWING Units: mm 2 Contact our customer service for custom designs and features. BI Technologies Corporation 4200 Bonita Place, Fullerton, CA 92835 USA Phone: 714 447 2345 October 7, 2004 Website: www.bitechnologies.com page 2 of 2 BI technologies