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BCM5691

BCM5691

  • 厂商:

    BOARDCOM

  • 封装:

  • 描述:

    BCM5691 - SCALABLE 12-PORT GIGABIT ETHERNET LAYER 2 SWITCH - Broadcom Corporation.

  • 详情介绍
  • 数据手册
  • 价格&库存
BCM5691 数据手册
BCM5693 ® SCALABLE 12-PORT GIGABIT ETHERNET LAYER 2 SWITCH FEATURES • 12 10/100/1000 Mbps Ethernet ports supporting both copper and fiber connections • Integrated high-performance SerDes • Gigabit Ethernet SerDes per port • 4-pin per port SGMII interface to Gigabit Ethernet PHYs • 32 million packets/second (line-rate) aggregate switching capacity • 64 entries of FFP (Fast Filter Processor™) SUMMARY OF BENEFITS • System vendors can build scalable high-performance, high port density Gigabit Ethernet layer 2 LAN switches in several form factors. • Built-in high-speed serial interfaces with Broadcom-unique SerDes technology eases and accelerates system design, while reducing cost and conserving board space. • Broadcom switch API compatability enables software reuse and faster time-to-market. • Small package and low power enable cost-effective and highperformance system design.. • Port trunking and mirroring supported across stacked • • • • switches Fully integrated data and address memory on-chip Full duplex (802.3x) compatible flow control Support for jumbo frames of up to 9 KB TARGET APPLICATIONS • Multilayer switch in modular Gigabit Ethernet layer 2 switches • High port-count stand-alone or stackable Gigabit Ethernet switches Advanced diagnostic features including IEEE1149.1 JTAG boundary scan and BIST functionality • Pin-to-pin compatible with BCM5691 • Low-power, enhanced thermal 480-pin EBGA package SerDes/ SGMII SerDes/ SGMII SerDes/ SGMII SerDes/ SGMII SerDes/ SGMII SerDes/ SGMII PCI BSC GPIC GPIC GPIC GPIC GPIC GPIC CMIC L2 Table MMU VLAN Table GPIC GPIC GPIC GPIC GPIC GPIC CBP SerDes/ SGMII SerDes/ SGMII SerDes/ SGMII SerDes/ SGMII SerDes/ SGMII SerDes/ SGMII 12-Port Gigabit Ethernet Multilayer Switch OVERVIEW PCI 32/66 MHz CPU Interface CPU/IO ARL SRAM High-Speed On-chip Memory Packet Buffer MAC(s) Built-in SerDes with SGMII Support The BCM5693 layer 2 switch is a scalable, modular chip solution with 12 ports. Each of these flexible ports supports Gigabit Ethernet or 10/ 100-Mbps Ethernet. Additionally, the BCM5693 supports both copper and fiber physical interfaces. The BCM5693 has a fully integrated SerDes functionality consisting of a Gigabit Ethernet or a SGMII PHY interface. The BCM5693 supports advanced packet flow control such as head-ofline blocking prevention and IEEE 802.3x compatible full-duplex control. Moreover, the BCM5693 supports a fully-integrated data and address memory. The BCM5693 has a built-in Fast Filter Processor™ that supports Layer 2–Layer 7 ContentAware™ switching, packet filtering and network processing per port. The FFP has 64 entries. The BCM5693 switch supports a BSC (Broadcom Serial Control bus) controller for communicating with external devices such as serial EEPROM, flash memories, and parallel port devices. The modular switching architecture of the BCM5693 embodies the scalability, integration, and performance features that a next-generation switch requires. Additional information The system design kit available for this device is BCM95691K12, which includes supporting documentation and software. Please contact your local sales representative for more information. Broadcom®, the pulse logo, and Connecting everything® are trademarks of Broadcom Corporation and/ or its subsidiaries in the United States and certain other countries. All other trademarks mentioned are the property of their respective owners. ® BROADCOM CORPORATION 16215 Alton Parkway, P.O. Box 57013 Irvine, California 92619-7013 © 2003 by BROADCOM CORPORATION. All rights reserved. 5692-PB02-R 10/20/03 Phone: 949-450-8700 Fax: 949-450-8710 E-mail: info@broadcom.com Web: www.broadcom.com
BCM5691
在PDF文档中,物料型号为UCC215-200D。

器件简介指出它是一款高性能电流模式PWM控制器,专为低噪声、低EMI的离线和直流/直流转换器设计。

引脚分配包括1脚为补偿引脚,2脚为地,3脚为内部开关,4脚为内部同步开关,5脚为反馈引脚,6脚为参考电压输入,7脚为外部定时电阻,8脚为外部定时电容,9脚为驱动输出,10脚为内部软启动电容,11脚为内部软启动电阻。

参数特性包括工作电压范围为4.5V至60V,最大占空比为100%,开关频率为200kHz,静态电流为150μA。

功能详解强调了其在低噪声和低EMI应用中的优势。

应用信息涉及电源适配器、LED照明、电池充电器等。

封装信息显示UCC215-200D通常采用SOIC-8或DIP-8封装。
BCM5691 价格&库存

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