CD1206-B240

PL IA Features ■ ■ Applications ■ ■ ■ ■ NT ■ ■ Lead free device (RoHS compliant*) Low profile High current capability UL 94V-0 classification High frequency switching power supplies Inverters Free wheeling Polarity protection *R oH S CO M General Information The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop increasingly smaller electronic components. Bourns offers Schottky Rectifier Diodes for rectification applications, in compact chip package 1206 size format, which offer PCB real estate savings and are considerably smaller than most competitive parts. The Schottky Rectifier Diodes offer a forward current of 2 A with a repetitive peak reverse voltage of 20 V up to 100 V. Bourns® Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment and their flat configuration minimizes roll away. Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter Symbol CD1206B220 B240 B260 B2100 Unit Maximum Repetitive Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current1 DC Reverse Current @ Rated DC Blocking Voltage (@TJ = 25 °C) DC Reverse Current @ Rated DC Blocking Voltage (@TJ = 100 °C) Maximum Instantaneous Forward Voltage @ 2 A2 Typical Thermal Resistance3 Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load (JEDEC Method) Notes: 1 See Forward Derating Curve. 2 Pulse test width PW = 300 µsec, 1 % duty cycle. 3 Mounted on P.C. board with 0.2 x 0.2 ˝ (5.0 x 5.0 mm) copper pad areas. Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter Operating Temperature Range Storage Temperature Range Symbol TJ TSTG CD1206-B220~B2100 -55 to +125 -55 to +150 Unit °C °C *RoHS Directive 2002/95/EC Jan 27 2003 including Annex. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 6 VRRM VRMS VDC I(AV) IR IR VF RθJA RθJL IFSM CD1206-B220~B2100 – Surface Mount Schottky Rectifier Diode 20 14 20 40 28 40 2 0.5 20 0.5 75 17 40 60 42 60 100 70 100 V V V A mA 10 0.7 0.85 mA V °C/W A CD1206-B220~B2100 – Surface Mount Schottky Rectifier Diode Product Dimensions This is a lead free product, packaged with FRP substrate and is epoxy underfilled. The terminals are pure tin plated and are solderable per MIL-STD-750, Method 2026. The package weighs approximately 0.02 g. The package and dimensions are shown below. 3.20 - 3.60 (0.126 - 0.142) Recommended Pad Layout 3.00 MAX. (0.118) 1.60 MIN. (0.063) 1.70 - 2.10 (0.067 - 0.083) 0.40 R (0.016) 1.40 MIN. (0.055) DIMENSIONS: MM (INCHES) How To Order 0.50 - 0.90 (0.020 - 0.035) 0.50 - 0.90 (0.020 - 0.035) CD 1206 - B 2 20 Common Code CD = Chip Diode Package 1206 Model Series B = Schottky Barrier Diode Forward Current I(AV) 2=2A Reverse Voltage 20 = 20 V 40 = 40 V 60 = 60 V 100 = 100 V 0.86 - 1.16 (0.034 - 0.046) DIMENSIONS: MM (INCHES) Typical Part Marking CD1206-B220 ...................................................................... CD1206-B240 ...................................................................... CD1206-B260 ...................................................................... CD1206-B2100 .................................................................... 220 240 260 2100 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. CD1206-B220~B2100 – Surface Mount Schottky Rectifier Diode Packaging Information The product will be dispensed in Tape and Reel format (see diagram below). P 0 P 1 E Index Hole 120 F W B D2 D1 D T d P Trailer A Device C Leader End ....... ....... 10 pitches (min.) ....... ....... ....... ....... ....... ....... 10 pitches (min.) W1 Start DIMENSIONS: MM (INCHES) Direction of Feed Devices are packed in accordance with EIA standard RS-481-A and specifications shown here. Item Carrier Width Carrier Length Carrier Depth Sprocket Hole Reel Outside Diameter Reel Inner Diameter Feed Hole Diameter Sprocket Hole Position Punch Hole Position Punch Hole Pitch Sprocket Hole Pitch Embossment Center Overall Tape Thickness Tape Width Reel Width Quantity per Reel Symbol A B C d D D1 D2 E F P P0 P1 T W W1 — 1206 1.70 ±0.10 (0.067 ±0.004) 3.40 ±0.10 (0.134 ±0.004) 1.25 ±0.10 (0.049 ±0.004) 1.55 ±0.05 (0.061 ±0.002) 178 (7.008) 60.0 Min. (2.362) 13.0 ±0.20 (0.512 ±0.008) 1.75 ±0.10 (0.069 ±0.004) 3.50 ±0.05 (0.138 ±0.002) 4.00 ±0.10 (0.157 ±0.004) 4.00 ±0.10 (0.157 ±0.004) 2.00 ±0.05 (0.079 ±0.002) 0.20 ±0.05 (0.008 ±0.002) 8.00 ±0.20 (0.315 ±0.008) 13.5 Max. (0.531) 3,000 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. CD1206-B220~B2100 – Surface Mount Schottky Rectifier Diode Performance Graphs Forward Current Derating Curve 2.0 CD1206-B260~B2100 CD1206-B220~B240 Maximum Non-Repetitive Surge Current Peak Forward Surge Current (Amps) 50 40 30 20 10 0 1 10 Number of Cycles at 60 Hz 100 Pulse Width 8.3 ms Single Half Sine-Wave (JEDEC Method) Average Forward Current (Amps) 1.0 Resistive or Inductive Load P.C.B. Mounted on 0.2 x 0.2 ˝ (5.0 x 5.0 mm) Copper Pad Areas 0 0 50 70 90 110 130 150 170 Lead Temperature (°C) Typical Forward Characteristics 10.0 Typical Reverse Characteristics 100.0 Instantaneous Reverse Leakage Current (mA) Instantaneous Forward Current (Amps) 10.0 TJ = 100 °C B220~B240 B260 B2100 1.0 1.0 0.10 0.1 0.01 TJ = 25 °C 0.01 0 0.2 0.4 0.6 0.8 1.0 1.2 Instantaneous Forward Voltage (Volts) 0.001 0 20 40 60 80 100 Percent of Rated Peak Reverse Voltage (%) Typical Junction Capacitance 400 Junction Capacitance (pF) Reliable Electronic Solutions 100 TJ = 25 °C f = 1.0 MHz VSIG = 50 mVP-P 10 0.1 1.0 10 Reverse Voltage (Volts) 100 Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700 www.bourns.com COPYRIGHT© 2005, BOURNS, INC. LITHO IN U.S.A., IPA0508 10/05 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.