CD1408-R1600

PL IA NT Features Applications *R oH S CO M Lead free device (RoHS compliant*) Low profile Low power loss, high efficiency UL 94V-0 classification High frequency switching power supplies Inverters Free wheeling Polarity protection CD1408-R1200~R11000 – Surface Mount Rectifier Diode General Information The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop increasingly smaller electronic components. Bourns offers Rectifier Diodes for rectification applications, in compact chip package 1408 size format (compatible with SOD87, SOD123 formats), which offers PCB real estate savings and are considerably smaller than most competitive parts. The Glass Passivated Rectifier Diodes offer a forward current of 1 A with a choice of repetitive peak reverse voltage of 200 V up to 1000 V. Tin Plated Connectors FRP Substrate and Epoxy Underfill Bourns® Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment and their flat configuration minimizes roll away. Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter CD1408- Symbol Unit R1200 R1400 R1600 R1800 R11000 Maximum Repetitive Peak Reverse Voltage VRRM 200 400 600 800 1000 V Maximum RMS Voltage VRMS 140 280 420 560 700 V VDC 200 400 600 800 1000 V Maximum DC Blocking Voltage Max. Average Forward Rectified Current I(AV) 1.0 A DC Reverse Current @ Rated DC Blocking Voltage (@Ta = 25 °C) IR 1.0 μA DC Reverse Current @ Rated DC Blocking Voltage (@Ta = 125 °C) IR 30.0 μA DC Reverse Current @ Rated DC Blocking Voltage (@Ta = 150 °C) IR 50.0 μA Typical Junction Capacitance2 CJ 12 pF Instantaneous Forward Voltage @ IF = 1 A VF 1.0 V Maximum Reverse Recovery Time3 Trr 3000 ns Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM 30.0 A Typical Thermal Resistance Rj-a 80 °C/Watt Typical Thermal Resistance Rj-l 40 °C/Watt 1 Notes: 1 See Forward Derating Curve. 2 Measured @ 1.0 MHz and applied reverse voltage of 4.0 VDC. 3 Reverse recovery test condition: IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter Symbol CD1408-R1200~R11000 Unit TJ -65 to +175 °C TSTG -65 to +175 °C Operating Temperature Range Storage Temperature Range WARNING Cancer and Reproductive Harm www.P65Warnings.ca.gov *RoHS Directive 2015/863, Mar 31, 2015 and Annex. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. CD1408-R1200~R11000 – Surface Mount Rectifier Diode Performance Graphs Maximum Non-Repetitive Surge Current Forward Current Derating Curve Peak Forward Surge Current (Amps) Average Forward Current (Amps) 1.50 1.25 1.00 0.75 60 Hz Resistive or Inductive Load 0.50 0.25 0 0 50 75 100 125 150 175 200 30 25 20 15 Pulse Width 8.3 ms Single Half Sine-Wave (JEDEC Method) 10 0 1 10 Lead Temperature (°C) Typical Forward Characteristics Typical Reverse Characteristics 100 Instantaneous Reverse Leakage Current (µA) 10.00 Instantaneous Forward Current (Amps) 100 Number of Cycles at 60 Hz 1.00 0.10 Pulse Width = 300 µs 1 % Duty Cycle 10 TJ = 125 °C TJ = 100 °C 1 0.1 0.01 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 20 40 60 80 100 Percent of Rated Peak Reverse Voltage (%) Instantaneous Forward Voltage (Volts) Typical Junction Capacitance 200 100 60 Junction Capacitance (pF) 40 20 10 6 4 TJ = 25 °C 2 1 0.1 0.2 0.4 1.0 2 4 10 Reverse Voltage (Volts) 20 40 1 00 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. 110 CD1408-R1200~R11000 – Surface Mount Rectifier Diode Product Dimensions Recommended Footprint This is a lead free product, packaged with FRP substrate and is epoxy underfilled. The terminals are pure tin plated and are solderable per MIL-STD-750, Method 2026. The package weighs approximately 0.02 g. The package and dimensions are shown below. 3.2 - 3.60 (0.126 - 0.142) 1.70 - 2.10 (0.067 - 0.083) B R1D 0.40 R (0.016) 0.50 - 0.90 (0.020 - 0.035) 0.50 - 0.90 (0.020 - 0.035) The device will mount onto existing JEDEC SOD-87 footprint. How To Order CD 1408 - R 1 400 Common Code CD = Chip Diode Package 1408 = ~0.14 x 0.08 ˝ Function R = Rectifier Forward Current I(AV) 1=1A Reverse Voltage 200 = 200 V 400 = 400 V 600 = 600 V 800 = 800 V 1000 = 1000 V Typical Part Marking CD1408-R1200 .......................................................................... CD1408-R1400 .......................................................................... CD1408-R1600 .......................................................................... CD1408-R1800 .......................................................................... CD1408-R11000 ........................................................................ 0.95 - 1.35 (0.037 - 0.053) DIMENSIONS: R1D R1G R1J R1K R1M MM (INCHES) Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. CD1408-R1200~R11000 – Surface Mount Rectifier Diode Packaging Information The product will be dispensed in Tape and Reel format (see diagram below). P 0 P 1 d T E Index Hole 120 ° F D2 W B D1 D P A Trailer ....... ....... End C Device ....... ....... ....... ....... 10 pitches (min.) Leader ....... ....... DIMENSIONS: 10 pitches (min.) Direction of Feed Item W1 Start Symbol 1408 Carrier Width A Carrier Length B Carrier Depth C Sprocket Hole d Reel Outside Diameter D Reel Inner Diameter D1 Feed Hole Diameter D2 Overall Tape Thickness T Tape Width W Reel Width W1 1.85 ± 0.1 (0.073 ± 0.004) 3.65 ± 0.1 (0.144 ± 0.004) 1.25 ± 0.1 (0.05 ± 0.004) 1.50 ± 0.1 (0.059 ± 0.004) 178 ± 2.0 (7.008 ± 0.079) 50 Min. (1.969) 13.0 ± 0.5 (0.512 ± 0.020) 1.75 ± 0.1 (0.069 ± 0.004) 5.50 ± 0.05 (0.217 ± 0.002) 4.00 ± 0.1 (0.157 ± 0.004) 4.00 ± 0.1 (0.157 ± 0.004) 2.0 ± 0.1 (0.079 ± 0.002) 0.40 Max. (0.016) 12.00 ± 0.30 (0.472 ± 0.012) 18.7 Max. (0.736) Quantity per Reel — 3,000 Sprocket Hole Position E Punch Hole Position F Punch Hole Pitch P Sprocket Hole Pitch P0 Embossment Center P1 MM (INCHES) Devices are packed in accordance with EIA standard RS-481-A and specifications shown here. Asia-Pacific: Europe: The Americas: www.bourns.com REV. 03/20 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Legal Disclaimer Notice This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and P[ZHɉSPH[LZJVSSLJ[P]LS`¸)V\YUZ¹ Unless otherwise expressly indicated in writing, Bourns® products and data sheets relating thereto are subject to change ^P[OV\[UV[PJL