CDDFN10-3324P

Features Applications ■ RoHS compliant* ■ ■ ■ ■ ■ ■ HDMI 1.3, 1.4 and 2.0 DisplayPort Digital Visual Interface (DVI) SATA and eSATA USB 3.0 Memory protection ■ SIM card ports ■ Low capacitance - 0.04 pF (I/O to I/O) ■ ESD protection to IEC 61000-4-2 (Level 4) CDDFN10-3324P - Surface Mount TVS Diode Array General Information The Model CDDFN10-3324P device provides ESD, CDE and EFT protection for high-speed data ports, meeting IEC 61000-4-2 (ESD) requirements. The Transient Voltage Suppressor array, protecting up to four data lines, offers a Working Peak Reverse Voltage of 3.3 V and a Minimum Breakdown Voltage of 4.5 V. Additional Information Click these links for more information: Pin 1 Pin 2 Pin 4 Pin 5 PRODUCT TECHNICAL INVENTORY SAMPLES SELECTOR LIBRARY CONTACT Pins 3, 8 The DFN10 packaged device has an ultra-low typical capacitance of only 0.04 pF between I/O lines. This allows it to be used for protecting sensitive components used on high-speed interfaces. The small footprint of the device allows for flow-through routing on the PCB, helping to maintain matched impedances of the high-speed data lines. Absolute Maximum Ratings (@ TA = 25 °C Unless Otherwise Noted) Parameter Symbol CDDFN10-3324P Unit Peak Pulse Power (tp = 8/20 μS) Ppp 30 W Peak Pulse Current (tp = 8/20 μS) Ipp 4 A Operating Temperature TJ -55 to +85 ºC TSTG -55 to +150 ºC Storage Temperature Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter Symbol Working Peak Reverse Voltage VWM Breakdown Voltage @ 1 mA VBR Leakage Current @ VWM Min. Typ. Max. Unit 3.3 V 4.5 V IR 0.1 0.5 μA Capacitance @ 1.65 V, f = 1 MHz (I/O to GND) CIN 0.45 0.65 pF Capacitance @ 1.65 V, f = 1 MHz (I/O to I/O) CCROSS 0.04 0.08 pF 7.5 V 12 15 kV Clamping Voltage @ 8/20 μs @ IPP VC ESD Protection per IEC 6-1000-4-2 Contact Discharge Air Discharge WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov *RoHS Directive 2015/863, Mar 31, 2015 and Annex. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. CDDFN10-3324P - Surface Mount TVS Diode Array Product Dimensions PIN 1 MARKING Recommended Footprint 1.000 ± 0.050 (.039 ± .002) 1.55 (.061) 2.500 ± 0.050 (.098 ± .002) PIN 1 IDENTIFICATION CHAMFER 0.100 X 45 ° (.039) 0.4 (.016) 0.25 (.010) 0.20 (.008) 0.875 (.034) 0.675 (.027) 0.400 ± 0.050 (.016 ± .002) 0.50 (.020) 0.500 BSC (.020) 0.100 (.039) R 1.00 (.039) 0.400 ± 0.050 (.016 ± .002) 1.950 (.077) REF. TYP. 0.250 ± 0.050 (.010 ± .002) Typical Part Marking 0.075 (.003) 3-DIGIT PRODUCT CODE CONTROL CODE 0.200 ± 0.050 (.008 ± .002) 324 XX 0.40 - 0.50 (0.016 - 0.020) Environmental Specifications 0.152 (.006) REF. 0.000 - 0.050 (.000 - .002) DIMENSIONS: Moisture Sensitivity Level ................................................................. 3 ESD Classification (HBM)...............................................................3B MM (INCHES) How to Order CD DFN10 - 33 24 P Device Pinout Common Code Chip Diode 1 10 2 9 3 Pin Function 1,2,4,5 Input and Output Lines 6,7,9,10 NC (No Internal Connection) for Feed-Through Layout design 3,8 GND 8 4 7 5 6 Package DFN10 = DFN-10 Package Working Peak Reverse Voltage 33 = 3.3 VRWM (Volts) Number of Lines 24 = 2 Ground / 4 Data Lines Suffix P = Ultra-low Capacitance TOP VIEW Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. CDDFN10-3324P - Surface Mount TVS Diode Array Rating & Characteristic Curves Typical Voltage vs. Capacitance CCROSS 0.8 0.10 0.7 0.09 0.08 0.6 Input Capacitance (pF) Input Capacitance (pF) Typical Voltage vs. Capacitance CIN 0.5 0.4 0.3 0.2 0.06 0.05 0.04 0.03 0.02 f = 1 MHz, T = 25 °C 0.1 0.07 f = 1 MHz, T = 25 °C 0.01 0.0 0.00 0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3 0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3 Input Voltage (V) Input Voltage (V) Typical Insertion Loss S21 Typical Analog Cross Talk 20 0 10 Analog Cross Talk (dB) Insertion Loss (dB) -3 -6 -9 -12 -15 -18 -21 -24 -27 -30 3 GHz: 0.535 dB 0 -10 -20 -30 -40 -50 -60 -70 -80 1e+8 1e+9 1e+8 Frequency (Hz) 1e+9 Frequency (Hz) Transmission Line Pulsing (TLP) Current (A) Typical Transmission Line Pulsing (TLP) 18 16 V_pulse 14 Pulse from a transmission line 12 TLP_I + 100 ns 10 TLP_V - 8 6 4 VCLAMP @ 16 A = 10 V VCLAMP @ 8 A = 7.5 V I/O to GND 2 0 0 1 2 3 4 5 6 7 8 9 10 11 12 Transmission Line Pulsing (TLP) Voltage (V) Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. CDDFN10-3324P - Surface Mount TVS Diode Array Reference Application The Bourns® Model CDDFN10-3324P is designed to protect high-speed data ports from ESD transients. For high-speed ports above 5 Gbps such as HDMI 2.0 and USB 3.0, maintaining signal line impedance is a critical requirement. The use of a DFN10 package using a “feedthrough” layout provides minimal impedance change on the high-speed data line, while the ultra-low capacitance performance of the device limits signal degradation on each channel. HDMI CONNECTOR TMDS_D2+ TMDS_GND TMDS_D2TMDS_D1+ TMDS_GND TMDS_D1- LINE-1 1 10 LINE-2 2 9 GND 3 8 LINE-3 4 7 LINE-4 5 6 TMDS_D0TMDS_CK+ TMDS_GND TO I/O PORT CONNECTOR TO I/O PORT CONNECTOR 1 2 10 9 3 8 4 7 5 6 TO PROTECTED IC TMDS_CK- 1 10 2 9 GND 3 8 LINE-3 4 7 LINE-4 5 6 +5 V OUT HOTPLUG_DET TMDS_D1TMDS_D0+ TMDS_D0- GND TMDS_CK+ TMDS_CK- CDDFN10-3324P GND 3 2 Via hole to GND CE_REMOTE DDC_CLK 1 CDSOT236-0504C DDC_DAT GND TMDS_D1+ LINE-2 DDC_CLK TO PROTECTED IC GND LINE-1 CE_REMOTE N/C TMDS_D2- CDDFN10-3324P TMDS_D0+ TMDS_GND TMDS_D2+ 4 6 5 +5 V Via hole to +5 V DDC_DAT Via hole to GND C = 100 nF (OPTIONAL) HOTPLUG_DET Model CDDFN10-3324P Layout on HDMI Port Feed-Through Layout Model CDDFN10-3324P in HDMI Application HDMI 2.0 Eye Diagram Test Without Model CDDFN10-3324P (PCB Only) HDMI 2.0 Eye Diagram Test With Model CDDFN10-3324P Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. CDDFN10-3324P - Surface Mount TVS Diode Array Packaging Information The product is packaged in an 8 mm x 4 mm tape and reel format per EIA-481-D standard. P 0 P 1 d T E Index Hole Pin 1 Location 120 ° F D2 W B D1 D P A Trailer ....... ....... End C Device ....... ....... Leader ....... ....... ....... ....... 10 pitches (min.) 10 pitches (min.) W1 Start DIMENSIONS: MM (INCHES) Direction of Feed Item Symbol DFN-10 Carrier Width A 1.70 ± 0.08 (0.067 ± 0.003) Carrier Length B 2.30 ± 0.08 (0.091 ± 0.003) Carrier Depth C 0.75 ± 0.05 (0.030 ± 0.002) Sprocket Hole d 1.15 ± 0.10 (0.045 ± 0.004) Reel Outside Diameter D 178 (7.008) Reel Inner Diameter D1 54.40 ± 0.40 (2.142 ± 0.016) Feed Hole Diameter D2 13.0 ± 0.20 (0.512 ± 0.008) Sprocket Hole Position E 1.75 ± 0.10 (0.069 ± 0.004) Punch Hole Position F 3.50 ± 0.05 (0.138 ± 0.002) Punch Hole Pitch P 4.00 ± 0.10 (0.157 ± 0.004) Sprocket Hole Pitch P0 4.00 ± 0.10 (0.157 ± 0.004) Embossment Center P1 2.00 ± 0.05 (0.079 ± 0.002) Overall Tape Thickness T 0.20 ± 0.30 (0.008 ± 0.012) Tape Width W 8.00 +0.30/-0.10 (0.315 +0.012/- 0.004) Reel Width W1 12.30 ± 1.00 (0.484 ± 0.039) -- 3000 Quantity per Reel Asia-Pacific: Tel: +886-2 2562-4117 Email: asiacus@bourns.com EMEA: Tel: +36 88 885 877 Email: eurocus@bourns.com The Americas: Tel: +1-951 781-5500 Email: americus@bourns.com www.bourns.com REV. 08/19 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Legal Disclaimer Notice This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and P[ZHɉSPH[LZJVSSLJ[P]LS`¸)V\YUZ¹ Unless otherwise expressly indicated in writing, Bourns® products and data sheets relating thereto are subject to change ^P[OV\[UV[PJL